类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 片上程序 ROM 宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 速度等级 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 最大结点温度（Tj） | 协处理器/DSP | 只读存储器可编程性 | 核数量 | PWM通道数 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 环境温度范围高 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | MCIMX6D6AVT10AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX280CVM4B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 289-LFBGA | YES | -40°C~85°C TA | Tray | 2002 | i.MX28 | e1 | 活跃 | 3 (168 Hours) | 289 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | MCIMX280 | S-PBGA-B289 | 1.55V | 1.35V | 454MHz | 多功能外围设备 | ARM926EJ-S | 24MHz | YES | 128000 | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LVDDR, LVDDR2, DDR2 | USB 2.0 + PHY (2) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | 4 | Data; DCP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Boot Security, Cryptography, Hardware ID | Keypad | 1.37mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P2020NXN2KHC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2010 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | 32 | YES | YES | 16 | 浮点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM5726BABCXA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | 760-BFBGA, FCBGA | YES | 760 | -40°C~105°C TJ | Tray | Sitara™ | e1 | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5726 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 浮点 | NO | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | DSP, IPU, VPE | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM4379BZDNA100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 491-LFBGA | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.325V | 1GHz | AM4379 | 491 | CAN, I2C, SPI, UART | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | 加密加速器 | TSC, WXGA | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3871CCYE100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 128 | ACTIVE (Last Updated: 2 days ago) | 684-BFBGA, FCBGA | YES | 684 | L2 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 1 (Unlimited) | 684 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.35V | 0.8mm | 100MHz | 未说明 | AM3871 | 684 | 不合格 | 1.1V | 1.42V | I2C, PCIe, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR2, DDR3 | USB 2.0 (2) | CAN, I2C, McASP, McBSP, SPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | HDMI, HDVPSS | SATA 3Gbps (1) | 3.06mm | 23mm | 23mm | 2.5mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
| AM5718AABCX | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 5 days ago) | 760-BFBGA, FCBGA | YES | 760 | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5718 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | HDMI | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6D6AVT08AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6D | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | 16 | YES | YES | 64 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8308CVMAGDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 473-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e1 | 活跃 | 3 (168 Hours) | 473 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8308 | S-PBGA-B473 | 1.05V | 0.95V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | 1.54mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8248VRMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8248 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | FLASH | Cryptography, Random Number Generator | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| P2020NXN2MHC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LS1046AXN8T1A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 76 | -40°C~105°C | Tray | 2016 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 780 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.8GHz | ARM® Cortex®-A72 | 14 | YES | 64 | 10GbE (2), 2.5GbE (1), 1GbE (4) | 4 Core 64-Bit | DDR4 | USB 3.0 (3) + PHY | I2C, PCI, SPI, UART, USB | Secure Boot, TrustZone® | SATA 6Gbps (1) | 2.61mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL137DZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 128 | 128kB | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | 表面贴装 | 256-BGA | 256 | Cache | -40°C~105°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 375MHz | OMAPL137 | SPI, USB | 3.45V | 900mV | 32kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 32b | 2 | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 105°C | Signal Processing; C674x, System Control; CP15 | 1 | 3 | NO | SINGLE | 85°C | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
 | OMAPL138EZWTD4E | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 361-LFBGA | YES | 361 | -40°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | OMAPL138 | 361 | 328kB | 微处理器电路 | ARM926EJ-S | 32b | ARM | 456 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC866PVR133A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC866 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 133MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OMAP5910JGDY2 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 160kB | 表面贴装 | 289-BGA | 289 | FLASH | -40°C~85°C TC | Tray | OMAP-59xx | e0 | 活跃 | 3 (168 Hours) | 289 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.6V | 1mm | 150MHz | OMAP5910 | 289 | 1.6V | 1.675V | I2C, MMC, SDIO, UART, USB | 170mA | 32kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | 16 | 32b | 6 | 25 | ARM | 16 | YES | YES | 固定点 | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | Signal Processing; C55x, System Control; CP15 | MROM | NO | MULTIPLE | Keypad, LCD | 6 | 2.32mm | 19mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
 | AM3715CUS100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 188 | 64kB | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 423-LFBGA, FCBGA | YES | 423 | L2 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | AM3715 | 423 | 1.8V | I2C, SPI, UART, USB | 1.89V | 1.71V | 128MB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 有 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
| MCIMX6QP6AVT1AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | 活跃 | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8313CVRAFFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8313 | S-PBGA-B516 | 1.5V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| OMAPL138EZCE4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 361-LFBGA | YES | 361 | 0°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | OMAPL138 | 361 | 微处理器电路 | ARM926EJ-S | ARM | 456 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P2020NXN2KFC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | -40°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT91SAM9N12-CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 105 | 有 | 32kB | 表面贴装 | 217-LFBGA | 217 | FLASH, ROM | -40°C~85°C TA | Tray | 1997 | SAM9N | e1 | yes | 活跃 | 3 (168 Hours) | 217 | 锡银铜 | BOTTOM | BALL | 260 | 1V | 0.8mm | 400MHz | 40 | AT91SAM9N12 | 11.8/3.33.3V | EBI/EMI, I2C, MMC, SPI, UART, USART, USB | 3.6V | 1.65V | Internal | 128kB | MICROPROCESSOR | ARM926EJ-S | DMA, LCD, POR, PWM, WDT | 32 | 32b | 6 | 26 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 1 Core 32-Bit | 无 | LPDDR, LPDDR2, DDR2, SDR, SRAM | USB 2.0 (2) | EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART | 4 | LCD, Touchscreen | 15mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8548EVJAUJD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | 活跃 | 3 (168 Hours) | 783 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 1mm | MPC8548 | R-PBGA-B783 | 1.155V | 1.045V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e500 | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | 3.294mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM3356BZCZ60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 600MHz | AM3356 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| P2020NSN2MHC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P2 | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 1mm | 40 | P2020 | S-PBGA-B689 | 1.1V | 1.05V | 1V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 100MHz | 32 | YES | YES | 固定点 | YES | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | 2.46mm | 31mm | ROHS3 Compliant |