类别是'嵌入式 - 微处理器'
嵌入式 - 微处理器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | ADC通道数量 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | PWM通道数 | I2C通道数 | 保安功能 | 显示和界面控制器 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||||
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.png) | SPC5200CBV400 | Freescale Semiconductor, Inc. (NXP Semiconductors) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BGA | YES | 272 | 400MHz | e0 | no | 3 (168 Hours) | 272 | Tin/Lead (Sn/Pb) | 85°C | -40°C | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 240 | 1.5V | 400MHz | 30 | 272 | INDUSTRIAL | MICROPROCESSOR | 32 | 32b | 32 | PowerPC | YES | YES | 浮点 | YES | 1 | 2.65mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AM5718AABCXEQ1 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | Automotive grade | -40°C~125°C TJ | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5718 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 524288 | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | HDMI, LCD | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMA5D44A-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 Weeks | 152 | 128kB | Copper, Silver, Tin | 表面贴装 | 361-TFBGA | 361 | L2 Cache, ROM, SRAM | -40°C~85°C TA | Tape & Reel (TR) | 2014 | SAMA5D4 | e2 | yes | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BOTTOM | BALL | 1.26V | 0.8mm | 528MHz | ATSAMA5D44 | 1.8V | 2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB | 1.98V | 1.62V | Internal | 600 MHz | 128kB | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 32b | 3 | 26 | ARM | YES | YES | 固定点 | YES | 1.2V 1.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 (3) | EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART | Multimedia; NEON™ SIMD | 1 | AES, SHA, TDES, TRNG | LCD, Touchscreen | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MPC8349CZUAJDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 672 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8543VUANG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2009 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8543 | 800MHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8358VRAGDGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 668-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 668 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | SVF332R3K1CKU2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 176-LQFP Exposed Pad | YES | -40°C~85°C TA | Tray | 2014 | Vybrid, VF3xxR | e3 | 活跃 | 3 (168 Hours) | 176 | 5A002.A.1 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G176 | 3.6V | 3V | 266MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | YES | YES | 浮点 | YES | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 1.6mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCIMX6X1EVO10AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | -20°C~105°C TJ | Tray | 2014 | i.MX6SX | 活跃 | 3 (168 Hours) | 260 | 40 | 227MHz, 1GHz | ARM® Cortex®-A9, ARM® Cortex®-M4 | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | 无 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8321ZQAFDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 516-BBGA | 516-FPBGA (27x27) | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8321 | 333MHz | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC855TCZQ66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1997 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68030FE33C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 132-BCQFP | 0°C~70°C TA | Tray | 2007 | M680x0 | Obsolete | 1 (Unlimited) | MC68030 | 33MHz | 68030 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8343ZQAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2007 | MPC83xx | e0 | Obsolete | 3 (168 Hours) | 620 | 5A992 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC880CVR66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~100°C TA | Tray | 1999 | MPC8xx | e1 | 最后一次购买 | 3 (168 Hours) | 357 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.8V | 1.27mm | 30 | MPC880 | S-PBGA-B357 | 1.9V | 1.83.3V | 1.7V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (2), 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM | USB 2.0 (1) | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC823ZQ66B2T | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256-BBGA | 0°C~95°C TA | Tray | 1999 | MPC8xx | Obsolete | 3 (168 Hours) | MPC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC8272ZQMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 1994 | MPC82xx | e0 | 最后一次购买 | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | XPC8260ZUHFBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | 0°C~105°C TA | Tray | 2004 | MPC82xx | Obsolete | 3 (168 Hours) | PC8260 | 166MHz | PowerPC G2 | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Z84C1516ASG | Zilog | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 16 | 有 | 表面贴装 | 100-LQFP | 100 | ROMless | 0°C~70°C TA | Tray | 2002 | Z80 | e3 | yes | 活跃 | 3 (168 Hours) | 100 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 16MHz | 40 | Z84C15 | 100 | 5V | 5V | 5V | MICROCONTROLLER | 8 | NO | NO | NO | NO | 16 | 8 | 5.0V | 1 Core 8-Bit | 无 | 1.6mm | 14mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MVF50NN152CMK40 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 364-LFBGA | YES | -40°C~85°C TA | Tray | Vybrid, VF5xx | yes | 活跃 | 3 (168 Hours) | 364 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | 3.6V | 3V | 400MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 | 24MHz | 32 | YES | YES | NO | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XPC823ECVR66B2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 256-BBGA | 256-PBGA (23x23) | -40°C~95°C TA | Tray | 1999 | MPC8xx | Obsolete | 3 (168 Hours) | PC823 | 66MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF331R3K2CKU2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 176-LQFP Exposed Pad | -40°C~85°C TA | Tape & Reel (TR) | Vybrid, VF3xxR | 活跃 | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 266MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 无 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SVF332R3K2CKU2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 176-LQFP Exposed Pad | -40°C~85°C TA | Tape & Reel (TR) | Vybrid, VF3xxR | 活跃 | 3 (168 Hours) | 8542.31.00.01 | 260 | 40 | 266MHz, 133MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XPC8255ZUIFBC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 480-LBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2004 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 480 | 5A991 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.8V | 1.27mm | 30 | PC8255 | S-PBGA-B480 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC G2 | 66.66MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 1.65mm | 37.5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| P89LPC935FDH | Rochester Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FLASH | 516B | 表面贴装 | TSSOP | 28 | 18MHz | 85°C | -40°C | 3.6V | 8kB | 8b | 80C51 | 8 | 2 | 1 | 950μm | 9.8mm | 4.5mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPC8572LVJAULE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 1023-BBGA, FCBGA | 0°C~105°C TA | Tray | 1998 | MPC85xx | yes | 活跃 | 3 (168 Hours) | 245 | 30 | MPC8572 | 1.333GHz | MICROPROCESSOR | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCIMX6Q4AVT08ACR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-FBGA, FCBGA | -40°C~125°C TJ | Tape & Reel (TR) | 2002 | i.MX6Q | e1 | 不用于新设计 | 3 (168 Hours) | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 260 | 40 | MCIMX6 | 852MHz | MICROPROCESSOR | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | SATA 3Gbps (1) | ROHS3 Compliant |