类别是'嵌入式 - 微控制器 - 应用特定'
嵌入式 - 微控制器 - 应用特定 (5239)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 数据编码/解码方式 | 长度 | 宽度 | ||||||||||||||||||
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5P35021B-773NDGI | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MK3711B | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | SOP, SOP8,.25 | 1 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3.45 V | 3.15 V | 3.3 V | 8 | 无 | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 1.27 mm | not_compliant | 20 | 8 | R-PDSO-G8 | 不合格 | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | 16 MHz | 16 MHz | 4.9 mm | 3.9 mm | ||||||||||||||||||
W49C65-04H | Ic Works Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | IC WORKS INC | SSOP-48 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 48 | Obsolete | IT ALSO OPERATES AT 5V SUPPLY | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G48 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.79 mm | 14.318 MHz | 83.3 MHz | 15.88 mm | 7.52 mm | |||||||||||||||||||||||||||||
53C875 | Symbios Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
SCN2661AA1F28 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | 飞利浦半导体 | DIP, DIP28,.6 | 5.07 MHz | 85 °C | -40 °C | CERAMIC | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 28 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T28 | 不合格 | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2 | NO | 8 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | |||||||||||||||||||||
SCN2661AA1F28 | YAGEO Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 飞利浦组件 | , | 5.07 MHz | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 28 | Obsolete | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | R-CDIP-T28 | 不合格 | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2 | NO | NO | 8 | 1 | 0.125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ | ||||||||||||||||||||||||||
AV9194-07CN20 | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | INTEGRATED CIRCUIT SYSTEMS INC | DIP, DIP20,.3 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 20 | 无 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 14.318 MHz | 130 MHz | |||||||||||||||||||||||||||
SC18IS601IPW | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 | 18 MHz | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.6 V | 2.4 V | 16 | 有 | e3 | TIN | 8542.31.00.01 | DUAL | 鸥翼 | 0.65 mm | unknown | 16 | R-PDSO-G16 | 不合格 | INDUSTRIAL | BUS CONTROLLER, I2C | 16 mA | 1.1 mm | 0.375 MBps | 5 mm | 4.4 mm | |||||||||||||||||||||
W83195BR-S | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | WINBOND ELECTRONICS CORP | SSOP | SSOP-56 | 70 °C | PLASTIC/EPOXY | SSOP | SSOP56,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.3 V | 56 | 无 | e0 | EAR99 | 锡铅 | ALSO REQUIRES 2.5V SUPPLY | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | not_compliant | 56 | R-PDSO-G56 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.794 mm | 14.318 MHz | 200.4 MHz | 18.415 mm | 7.5 mm | |||||||||||||||||||||||
S1R72005B00A300 | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SEIKO EPSON CORP | BGA | TFBGA, | 48 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 2.7 V | 2.3 V | 2.5 V | 64 | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | 81 | S-PBGA-B64 | 不合格 | INDUSTRIAL | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 1.2 mm | 8 | 16 | 1.5 MBps | 8 mm | 8 mm | |||||||||||||||||||||||
S1R72005B00A300 | Seiko Epson Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SEIKO EPSON CORP | TFBGA, | 48 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 2.7 V | 2.3 V | 2.5 V | 64 | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | BUS CONTROLLER, UNIVERSAL SERIAL BUS | 1.2 mm | 8 | 16 | 1.5 MBps | 8 mm | 8 mm | |||||||||||||||||||||||||
RTC8616DX | Richwave Technology Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
W83195BG-202 | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | WINBOND ELECTRONICS CORP | SSOP | 0.300 INCH, LEAD FREE, SSOP-56 | 3 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 56 | 有 | e3 | EAR99 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | compliant | 56 | R-PDSO-G56 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.79 mm | 14.318 MHz | 404.04 MHz | 18.42 mm | 7.52 mm | ||||||||||||||||||||||
W83195BG-202 | Nuvoton Technology Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NUVOTON TECHNOLOGY CORP | SSOP | SSOP, | 3 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 56 | 有 | e3 | 有 | EAR99 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | compliant | 56 | R-PDSO-G56 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.79 mm | 14.318 MHz | 404.04 MHz | 18.42 mm | 7.52 mm | |||||||||||||||||||||
SL38160AZI-24AHT | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | SILICON LABORATORIES INC | TSSOP | 0.173 INCH, 0.65 MM PITCH, ROHS COMPLIANT, MO-153AB, TSSOP-16 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.63 V | 2.97 V | 3.3 V | 16 | Obsolete | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 0.65 mm | unknown | 16 | R-PDSO-G16 | 不合格 | INDUSTRIAL | CLOCK GENERATOR, VIDEO | 1.2 mm | 27 MHz | 148.5 MHz | 5 mm | 4.4 mm | |||||||||||||||||||||||||
FAS366U-QF6 | QLogic Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
XCZU2EG-2LSBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-484 | 4 | 110 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 484 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | |||||||||||||||||||||||||||||
XCZU11EG-3FFVB1517I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | BGA, | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 1517 | 2017-02-15 | 有 | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||
AD892EJP | Analog Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ANALOG DEVICES INC | LCC | PLASTIC, LCC-44 | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5 V | 44 | 无 | e0 | 锡铅 | ALSO REQUIRES 12V SUPPLY | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 44 | S-PQCC-J44 | 不合格 | COMMERCIAL | 微处理器电路 | 4.57 mm | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||
XCZU6CG-1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | BGA-900 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 900 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||
XCZU6CG-1FBVB900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Transferred | XILINX INC | BGA, BGA900,30X30,40 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 900 | 有 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||||||
SYM53C180 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | BROADCOM LTD | PLASTIC/EPOXY | BGA | UNSPECIFIED | BALL | 192 | Obsolete | EAR99 | 8542.39.00.01 | QUAD | BUTT | compliant | X-PBGA-B192 | ||||||||||||||||||||||||||||||||||||||||||
TMPZ84C20AM-8 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | TOSHIBA CORP | SSOP | 0.450 INCH, PLASTIC, SSOP-40 | 8 MHz | 16 | 70 °C | -10 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5.25 V | 4.75 V | 5 V | 40 | Obsolete | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 0.8 mm | unknown | 40 | R-PDSO-G40 | 不合格 | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 10 mA | 2.8 mm | 8 | 17.5 mm | 8.8 mm | ||||||||||||||||||||||
XCZU6CG-1LFFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 900 | 有 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||||
IMISC471AYBD | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 |