类别是'嵌入式 - FPGA（现场可编程门阵列）'
嵌入式 - FPGA（现场可编程门阵列） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 输出功能 | 收发器数量 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 专用输入数量 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||
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 | XA2S200E-6FT256I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Automotive grade | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 182 | -40°C~100°C TJ | Tray | 1999 | Automotive, AEC-Q100, Spartan®-IIE XA | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 225 | 1.8V | 1mm | 30 | XA2S200E | 256 | 182 | 1.8V | 7kB | 357MHz | 现场可编程门阵列 | 5292 | 57344 | 200000 | 1176 | 6 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5AGXBA3D4F27C4N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 672-BBGA, FCBGA | YES | 336 | 0°C~85°C TJ | Tray | Arria V GX | e1 | Obsolete | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5AGXBA3 | S-PBGA-B672 | 336 | 不合格 | 1.11.2/3.32.5V | 670MHz | 336 | 现场可编程门阵列 | 156000 | 11746304 | 7362 | 2.7mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | AGL125V5-CS196 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1500 LE | 133 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 892.86 MHz | 有 | 348 | IGLOOe | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | AGL125 | 活跃 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.5 V | 未说明 | 85 °C | 无 | AGL125V5-CS196 | 108 MHz | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | 表面贴装 | CSP-196 | YES | 196-CSP (8x8) | 196 | 微芯片技术 | N | 0 to 70 °C | Tray | AGL125V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 未说明 | 0.5 mm | unknown | S-PBGA-B196 | 不合格 | 1.5 V | OTHER | 3072 CLBS, 125000 GATES | 1.2 mm | 现场可编程门阵列 | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 0.7 mm | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P1000-1FG144 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 97 I/O | 1.425 V | 0 C | + 70 C | SMD/SMT | 272 MHz | 有 | 160 | ProASIC3 | 0.014110 oz | 1.5000 V | 1.425 V | 1.575 V | 1.575 V | Tray | M1A3P1000 | 活跃 | LBGA, | GRID ARRAY, LOW PROFILE | 3 | PLASTIC/EPOXY | 1.5 V | 30 | 85 °C | 无 | M1A3P1000-1FG144 | 350 MHz | LBGA | SQUARE | 活跃 | MICROSEMI CORP | 5.23 | 表面贴装 | FBGA | YES | 144-FPBGA (13x13) | 144 | 微芯片技术 | This product may require additional documentation to export from the United States. | 0 to 70 °C | Tray | M1A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 不合格 | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL025TS-FCS325I | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 27696 LE | 180 I/O | 1.2 V | - 40 C | + 100 C | SMD/SMT | 有 | 176 | IGLOO2 | Tray | M2GL025 | 活跃 | 1.2 V | BGA, BGA325,21X21,20 | 网格排列 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 20 | 无 | M2GL025TS-FCS325I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.2 | 表面贴装 | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | M2GL025TS | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | 不合格 | 1.2 V | 1.2 V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 2 Transceiver | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC4010E-4BG225C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 225-BBGA | 225 | 160 | 0°C~85°C TJ | Tray | 1999 | XC4000E/X | e0 | no | Obsolete | 3 (168 Hours) | 225 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 4.75V~5.25V | BOTTOM | BALL | 225 | 5V | 1.5mm | not_compliant | 30 | XC4010E | 225 | 160 | 不合格 | 5V | 1.6kB | 111MHz | 现场可编程门阵列 | 950 | 12800 | 10000 | 400 | 2.7 ns | 400 | 400 | 7000 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC4013E-3BG225I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 225-BBGA | 225 | 192 | -40°C~100°C TJ | Tray | 1999 | XC4000E/X | e0 | no | Obsolete | 3 (168 Hours) | 225 | 4.5V~5.5V | BOTTOM | BALL | 225 | 5V | 1.5mm | 30 | XC4013E | 225 | 192 | 5V | 5V | 2.3kB | 125MHz | 现场可编程门阵列 | 1368 | 18432 | 13000 | 576 | 3 | 1536 | 2 ns | 576 | 10000 | 2.55mm | 27mm | 27mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EPF10K200EFC672-3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 672-BBGA | YES | 470 | 0°C~70°C TA | Tray | FLEX-10KE® | e0 | Obsolete | 3 (168 Hours) | 672 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 220 | 2.5V | 1mm | compliant | 30 | EPF10K200 | S-PBGA-B672 | 470 | 不合格 | 2.52.5/3.3V | 140MHz | 0.8 ns | 470 | 可加载 PLD | 9984 | 98304 | 513000 | 1248 | MIXED | 2.1mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5AGTFD7K3F40I5N | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 1517-BBGA | YES | 704 | -40°C~100°C TJ | Tray | Arria V GT | e1 | 活跃 | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | 未说明 | 1.1V | 1mm | 未说明 | 5AGTFD7 | S-PBGA-B1517 | 704 | 不合格 | 1.11.2/3.32.5V | 622MHz | 704 | 现场可编程门阵列 | 504000 | 27695104 | 23780 | 2.7mm | 40mm | 40mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC7A15T-L2CSG324E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 210 | 0°C~100°C TJ | Tray | 2010 | Artix-7 | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1V SUPPLY | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 0.9V | 0.8mm | 未说明 | S-PBGA-B324 | 112.5kB | 现场可编程门阵列 | 16640 | 921600 | 1300 | 1.51 ns | 1.5mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7A15T-3CSG324E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 210 | 0°C~100°C TJ | Tray | 2010 | Artix-7 | e1 | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B324 | 112.5kB | 现场可编程门阵列 | 16640 | 921600 | 1300 | 0.94 ns | 1.5mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP4CE10F17I8LN | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 256-LBGA | YES | 179 | -40°C~100°C TJ | Tray | 2016 | Cyclone® IV E | e1 | 活跃 | 3 (168 Hours) | 256 | 锡银铜 | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 260 | 1V | 1mm | 40 | EP4CE10 | S-PBGA-B256 | 179 | 不合格 | 11.2/3.32.5V | 362MHz | 179 | 现场可编程门阵列 | 10320 | 423936 | 645 | 645 | 1.55mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP4CGX30CF19I7 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 324-LBGA | YES | 150 | -40°C~100°C TJ | Tray | Cyclone® IV GX | e0 | 活跃 | 3 (168 Hours) | 324 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.16V~1.24V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP4CGX30 | S-PBGA-B324 | 150 | 不合格 | 1.21.2/3.32.5V | 472.5MHz | 150 | 现场可编程门阵列 | 29440 | 1105920 | 1840 | 1.55mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC2V4000-5BF957C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 957-BBGA, FCBGA | 957 | 684 | 0°C~85°C TJ | Tray | 2007 | Virtex®-II | e0 | no | Obsolete | 4 (72 Hours) | 957 | 3A991.D | Tin/Lead (Sn63Pb37) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1.27mm | 30 | XC2V4000 | 957 | 684 | 1.5V | 270kB | 现场可编程门阵列 | 2211840 | 4000000 | 5760 | 5 | 46080 | 0.39 ns | 40mm | 40mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP2SGX130GF1508C3 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 1508-BBGA, FCBGA | YES | 734 | 0°C~85°C TJ | Tray | Stratix® II GX | e0 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP2SGX130 | S-PBGA-B1508 | 734 | 不合格 | 1.21.2/3.33.3V | 717MHz | 734 | 现场可编程门阵列 | 132540 | 6747840 | 6627 | 4.672 ns | 3.5mm | 40mm | 40mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EP20K160ETC144-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 88 | 0°C~85°C TJ | Tray | APEX-20KE® | e0 | Obsolete | 3 (168 Hours) | 144 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.71V~1.89V | QUAD | 鸥翼 | 220 | 1.8V | 0.5mm | compliant | 30 | EP20K160 | S-PQFP-G144 | 80 | 不合格 | 1.81.8/3.3V | 160MHz | 1.93 ns | 80 | 可加载 PLD | 6400 | 81920 | 404000 | 640 | MACROCELL | 4 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | XC3030A-7PC44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 34 | 0°C~85°C TJ | Tray | 1999 | XC3000A/L | e0 | Obsolete | 3 (168 Hours) | 44 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 4.75V~5.25V | QUAD | J BEND | 5V | XC3030 | 44 | 34 | 5V | 5V | 2.7kB | 113MHz | 现场可编程门阵列 | 22176 | 2000 | 100 | 7 | 360 | 5.1 ns | 100 | 100 | 1500 | 16.5862mm | 16.5862mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LCMXO2-4000ZE-1BG256I | Lattice Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 206 | 11.5kB | 表面贴装 | 表面贴装 | 256-LFBGA | 256 | FLASH | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | not_compliant | 104MHz | 30 | LCMXO2-4000 | 207 | 不合格 | 1.2V | 128μA | 27.8kB | 10.21 ns | 现场可编程门阵列 | 4320 | 94208 | 540 | 2160 | 1.7mm | 14mm | 14mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC5VTX150T-2FF1759I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 1760-BBGA, FCBGA | 1759 | 680 | -40°C~100°C TJ | Tray | 1999 | Virtex®-5 TXT | e0 | 活跃 | 4 (72 Hours) | 3A001.A.7.A | Tin/Lead (Sn63Pb37) | 0.95V~1.05V | BOTTOM | BALL | 1V | 1mm | XC5VTX150T | 680 | 1V | 1MB | 现场可编程门阵列 | 148480 | 8404992 | 11600 | 2 | 3.5mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EPF6024AQC240-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 240-BQFP | YES | 199 | 0°C~85°C TJ | Tray | 1996 | FLEX 6000 | e0 | Obsolete | 6 (Time on Label) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | QUAD | 鸥翼 | 220 | 3.3V | 0.5mm | 30 | EPF6024 | S-PQFP-G240 | 199 | 不合格 | 2.5/3.33.3V | 153MHz | 199 | 可加载 PLD | 1960 | 24000 | 196 | MACROCELL | 4 | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EPF8452AQC160-2 | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | YES | 120 | 0°C~70°C TA | Tray | FLEX 8000 | e0 | Obsolete | 3 (168 Hours) | 160 | EAR99 | 锡铅 | 4.75V~5.25V | QUAD | 鸥翼 | 220 | 5V | 0.65mm | compliant | 30 | EPF8452 | S-PQFP-G160 | 116 | 不合格 | 3.3/55V | 417MHz | 120 | 可加载 PLD | 336 | 4000 | 42 | REGISTERED | 336 | 4 | 4.07mm | 28mm | 28mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX02-PLG68M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 57 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 139 MHz | 有 | 19 | Actel | 0.171777 oz | Tray | A40MX02 | 活跃 | 5.5 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX02-PLG68M | 80 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tube | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | 不合格 | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.7 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A40MX02-PLG44M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 34 I/O | 3 V | - 55 C | + 125 C | SMD/SMT | 139 MHz | 有 | 27 | Actel | 0.084185 oz | Tray | A40MX02 | 活跃 | 5.5 V | QCCJ, | CHIP CARRIER | 3 | PLASTIC/EPOXY | -55 °C | 3.3 V | 40 | 125 °C | 有 | A40MX02-PLG44M | 80 MHz | QCCJ | SQUARE | 活跃 | MICROSEMI CORP | 5.29 | 表面贴装 | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TC) | Tube | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | 不合格 | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | 现场可编程门阵列 | 3000 | 2.7 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AX1000-FG896M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | N | 516 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 649 MHz | 有 | 27 | Actel | 0.014110 oz | Tray | AX1000 | 活跃 | 1.575 V | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | -55 °C | 1.5 V | 30 | 125 °C | 无 | AX1000-FG896M | 649 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.3 | Military grade | Production (Last Updated: 2 months ago) | 表面贴装 | 表面贴装 | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B896 | 516 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | 无 | ||||||||||||||||||||||||||||
| AX250-1FGG484M | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | 248 I/O | 1.425 V | - 55 C | + 125 C | SMD/SMT | 763 MHz | 有 | 60 | Actel | 0.014110 oz | 1.575 V | Tray | AX250 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.5 V | 40 | 125 °C | 有 | AX250-1FGG484M | 763 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 5.25 | Military grade | 表面贴装 | FBGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | This product may require additional documentation to export from the United States. | -55°C ~ 125°C (TA) | Tray | AX250 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 248 | 不合格 | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | 现场可编程门阵列 | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm |