N/A

-

Details

176 I/O

3 V

- 55 C

+ 125 C

SMD/SMT

131 MHz

有

24

Actel

Tray

A42MX36

活跃

5.5 V

ROHS COMPLIANT, PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

-55 °C

3.3 V

40

125 °C

有

A42MX36-PQG208M

73 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

5.28

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

PQFP-208

YES

208

208-PQFP (28x28)

208

微芯片技术

This product may require additional documentation to export from the United States.

-55°C ~ 125°C (TC)

Tray

A42MX36

e3

3A001.A.2.C

Matte Tin (Sn)

125 °C

-55 °C

ALSO OPERATES AT 5V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

3.3 V, 5 V

MILITARY

5.5 V

3 V

320 B

2438 CLBS, 54000 GATES

4.1 mm

现场可编程门阵列

1184

2560

54000

131 MHz

1184

1822

2.7 ns

2438

2414

54000

3.4 mm

28 mm

28 mm

无

N/A

-

表面贴装

484-BBGA

YES

369

0°C~70°C TA

Tray

FLEX-10KS®

e0

Obsolete

3 (168 Hours)

484

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

220

2.5V

1mm

compliant

30

EPF10K200

S-PBGA-B484

369

不合格

2.52.5/3.3V

0.8 ns

369

可加载 PLD

9984

98304

513000

1248

MIXED

2.1mm

23mm

23mm

Non-RoHS Compliant

N/A

-

表面贴装

表面贴装

256-BGA

256

176

0°C~85°C TJ

Tray

2006

Virtex®-E

e0

no

Obsolete

3 (168 Hours)

256

EAR99

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

225

1.8V

1mm

30

XCV50E

256

176

1.8V

8kB

357MHz

现场可编程门阵列

1728

65536

71693

384

6

0.47 ns

384

2mm

17mm

17mm

无

Non-RoHS Compliant

含铅

N/A

-

6 Weeks

表面贴装

表面贴装

896-BBGA, FCBGA

896

556

-40°C~100°C TJ

Tray

2011

Virtex®-II Pro

e1

yes

Obsolete

4 (72 Hours)

896

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

245

1.5V

1mm

not_compliant

30

XC2VP30

896

556

不合格

1.5V

1.51.5/3.32/2.52.5V

306kB

1200MHz

现场可编程门阵列

30816

2506752

3424

6

27392

0.32 ns

3.4mm

31mm

31mm

ROHS3 Compliant

N/A

-

10 Weeks

表面贴装

表面贴装

144-LQFP

144

97

0°C~85°C TJ

Tray

2009

Spartan®-3

e3

yes

活跃

3 (168 Hours)

144

EAR99

Matte Tin (Sn)

1.14V~1.26V

QUAD

鸥翼

260

1.2V

725MHz

30

XC3S50

144

97

不合格

1.2V

9kB

现场可编程门阵列

1728

73728

50000

192

5

192

1.4mm

20mm

20mm

Unknown

ROHS3 Compliant

N/A

-

表面贴装

672-BBGA

YES

473

-40°C~100°C TJ

Tray

Stratix®

e1

Obsolete

3 (168 Hours)

672

3A001.A.7.A

锡银铜

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

未说明

1.5V

1mm

compliant

未说明

EP1S25

S-PBGA-B672

706

不合格

1.51.5/3.3V

706

现场可编程门阵列

25660

1944576

2566

符合RoHS标准

N/A

-

表面贴装

672-BBGA

YES

488

0°C~85°C TJ

Tray

APEX-20KE®

e1

Obsolete

3 (168 Hours)

672

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

245

1.8V

1mm

compliant

40

EP20K400

S-PBGA-B672

480

不合格

1.81.8/3.3V

160MHz

1.57 ns

480

可加载 PLD

16640

212992

1052000

1664

MACROCELL

4

3.5mm

27mm

27mm

符合RoHS标准

N/A

-

表面贴装

484-BBGA

YES

229

0°C~85°C TJ

Tray

Arria GX

不用于新设计

3 (168 Hours)

484

3A001.A.7.A

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

1.2V

1mm

EP1AGX50

S-PBGA-B484

229

不合格

1.22.5/3.3V

640MHz

229

现场可编程门阵列

50160

2475072

2508

3.5mm

23mm

23mm

Non-RoHS Compliant

N/A

-

8 Weeks

表面贴装

1760-BBGA, FCBGA

YES

1120

0°C~85°C TJ

Tray

STRATIX® IV E

e1

活跃

3 (168 Hours)

3A001.A.7.A

锡银铜

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

245

0.9V

1mm

40

EP4SE820

S-PBGA-B1760

不合格

0.91.2/31.52.5V

717MHz

现场可编程门阵列

813050

34093056

32522

3.7mm

42.5mm

42.5mm

符合RoHS标准

N/A

-

10 Weeks

表面贴装

1517-BBGA, FCBGA

YES

624

-40°C~100°C TJ

Tray

2012

Kintex® UltraScale™

e1

活跃

4 (72 Hours)

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.922V~0.979V

BOTTOM

BALL

未说明

0.95V

1mm

未说明

S-PBGA-B1517

624

不合格

0.95V

4.8MB

624

2760 CLBS

现场可编程门阵列

725550

38912000

41460

2760

4.09mm

40mm

40mm

ROHS3 Compliant

N/A

-

10 Weeks

表面贴装

表面贴装

1760-BBGA, FCBGA

1759

720

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e1

活跃

4 (72 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

0.95V~1.05V

BOTTOM

BALL

245

1mm

not_compliant

30

XC6VLX240T

720

不合格

1V

11.2/2.5V

1.8MB

1412MHz

现场可编程门阵列

241152

15335424

18840

3

ROHS3 Compliant

N/A

-

10 Weeks

Automotive grade

表面贴装

表面贴装

400-BGA

400

304

-40°C~100°C TJ

Tray

2007

Automotive, AEC-Q100, Spartan®-3E XA

e1

yes

活跃

3 (168 Hours)

400

3A991.D

1.14V~1.26V

BOTTOM

BALL

250

1.2V

1mm

30

XA3S1200E

400

232

不合格

1.2V

1.21.2/3.32.5V

63kB

572MHz

现场可编程门阵列

19512

516096

1200000

8672

4

2168

21mm

21mm

ROHS3 Compliant

N/A

-

表面贴装

表面贴装

208-BFQFP

208

208-PQFP (28x28)

146

0°C~85°C TJ

Tray

2008

Spartan®-IIE

Obsolete

3 (168 Hours)

85°C

0°C

1.71V~1.89V

XC2S100E

1.8V

5kB

2700

40960

100000

600

600

6

无

符合RoHS标准

N/A

-

表面贴装

672-BBGA, FCBGA

YES

362

0°C~85°C TJ

Tray

Stratix® GX

e1

Obsolete

3 (168 Hours)

672

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

245

1.5V

1mm

compliant

40

EP1SGX10

S-PBGA-B672

362

不合格

1.51.5/3.3V

362

1200 CLBS

现场可编程门阵列

10570

920448

1057

1200

3.5mm

27mm

27mm

符合RoHS标准

N/A

-

表面贴装

356-LBGA

YES

271

0°C~85°C TJ

Tray

APEX-20KE®

e0

Obsolete

3 (168 Hours)

356

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1.27mm

compliant

30

EP20K200

S-PBGA-B356

263

不合格

1.81.8/3.3V

2.33 ns

263

可加载 PLD

8320

106496

526000

832

MACROCELL

4

1.63mm

35mm

35mm

Non-RoHS Compliant

N/A

-

8 Weeks

表面贴装

896-BGA

YES

622

0°C~85°C TJ

Tray

Cyclone® II

e1

活跃

3 (168 Hours)

896

3A001.A.7.A

锡银铜

ALSO REQUIRES 3.3 SUPPLY

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

260

1.2V

1mm

40

EP2C70

S-PBGA-B896

606

不合格

1.21.5/3.33.3V

450MHz

622

现场可编程门阵列

68416

1152000

4276

2.6mm

31mm

31mm

符合RoHS标准

N/A

-

Details

97 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

781.25 MHz

有

160

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3P1000

活跃

1.26 V

13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA144,12X12,40

-40 °C

1.2 V

40

85 °C

有

M1A3P1000L-FGG144I

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

97

不合格

1.2 V

1.5/3.3 V

INDUSTRIAL

97

24576 CLBS, 1000000 GATES

1.55 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.05 mm

13 mm

13 mm

N/A

-

N

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

272 MHz

有

160

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

A3P400

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

A3P400-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

144

144-FPBGA (13x13)

400.011771 mg

144

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

272 MHz

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

6.8 kB

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

272 MHz

1

9216

9216

400000

1.05 mm

13 mm

13 mm

无

N/A

-

Details

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

40

70 °C

有

M1A3P1000L-FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P1000L

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

N

177 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

781.25 MHz

有

90

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

1.26 V

Tray

M1A3P1000

活跃

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.2 V

30

70 °C

无

M1A3P1000L-FG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

微芯片技术

This product may require additional documentation to export from the United States.

0 to 70 °C

Tray

M1A3P1000L

TIN LEAD/TIN LEAD SILVER

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

177

不合格

1.2 V

1.5/3.3 V

COMMERCIAL

177

24576 CLBS, 1000000 GATES

1.8 mm

现场可编程门阵列

147456

1000000

STD

24576

24576

1000000

1.2 mm

17 mm

17 mm

N/A

-

171 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

250 MHz

有

1

Actel

Tray

A54SX72

活跃

2.75 V

QFF, TPAK208,2.9SQ,20

FLATPACK

CERAMIC, METAL-SEALED COFIRED

TPAK208,2.9SQ,20

2.5 V

70 °C

无

A54SX72A-1CQ208

250 MHz

QFF

SQUARE

活跃

MICROSEMI CORP

5.25

表面贴装

CQFP-208

YES

208-CQFP (75x75)

208

微芯片技术

N

0°C ~ 70°C (TA)

A54SX72A

72000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

FLAT

0.5 mm

unknown

S-CQFP-F208

171

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

171

6036 CLBS, 108000 GATES

3.3 mm

现场可编程门阵列

108000

6036

1.3 ns

6036

6036

108000

29.21 mm

29.21 mm

N/A

-

N

177 I/O

1.14 V

- 40 C

+ 85 C

SMD/SMT

有

90

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGL600

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.2 V

30

100 °C

无

M1AGL600V2-FG256I

108 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

256

256-FPBGA (17x17)

400.011771 mg

256

微芯片技术

This product may require additional documentation to export from the United States.

-40 to 85 °C

Tray

M1AGL600V2

TIN LEAD/TIN LEAD SILVER

85 °C

-40 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

不合格

1.2 V to 1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

1.8 mm

现场可编程门阵列

13824

110592

600000

STD

13824

600000

1.2 mm

17 mm

17 mm

N/A

-

N

有

184

IGLOOe

215

Tray

M1AGL600

活跃

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

20

1.425 V

85 °C

无

M1AGL600V5-CS281

108 MHz

TFBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.3

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

281-TFBGA, CSBGA

YES

281

281-CSP (10x10)

281

微芯片技术

This product may require additional documentation to export from the United States.

0°C ~ 70°C (TA)

Tray

M1AGL600V5

e0

Tin/Lead/Silver (Sn/Pb/Ag)

70 °C

0 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B281

不合格

OTHER

13.5 kB

13824 CLBS, 600000 GATES

1.05 mm

现场可编程门阵列

13824

110592

600000

13824

600000

10 mm

10 mm

N/A

-

表面贴装

1020-BBGA

YES

624

0°C~85°C TJ

Tray

Stratix® GX

e0

Obsolete

3 (168 Hours)

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

220

1.5V

1mm

30

EP1SGX40

S-PBGA-B1020

638

不合格

1.51.5/3.3V

638

4697 CLBS

现场可编程门阵列

41250

3423744

4125

4697

3.5mm

33mm

33mm

Non-RoHS Compliant

N/A

-

表面贴装

240-BFQFP

YES

189

0°C~70°C TA

Tray

FLEX-10KS®

e3

Obsolete

3 (168 Hours)

240

3A991

Matte Tin (Sn)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

245

2.5V

0.5mm

compliant

40

EPF10K50

S-PQFP-G240

189

不合格

2.52.5/3.3V

0.5 ns

189

可加载 PLD

2880

40960

199000

360

MIXED

4.1mm

32mm

32mm

符合RoHS标准