类别是'嵌入式 - 片上系统（SoC）'
嵌入式 - 片上系统（SoC） (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 触点镀层 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 房屋材料 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 终止次数 | 终端 | 温度系数 | 类型 | 电阻 | 端子表面处理 | 组成 | 颜色 | 应用 | 性别 | 功率(瓦特) | HTS代码 | 电容量 | 子类别 | 额定功率 | 技术 | 端子位置 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 额定电流 | 频率 | 频率稳定性 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 房屋颜色 | 工作电源电压 | 电介质 | 引线间距 | 电源 | 配置 | 纹波电流 | 测试频率 | 端口的数量 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 工作温度范围 | 等效串联电阻 | 输出格式 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 闪光大小 | 产品 | 灯型 | 安装角 | 特征 | USOC编码 | 产品类别 | 直径 | 高度 | 座位高度(最大) | 长度 | 宽度 | 可燃性等级 | ||||||||||||||||||||||||||||||||||||||||||
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 | XCVM1302-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EPCOS / TDK | 400 VDC | EPCOS / TDK | B43641A9187M57 | 160 | - 25 C | + 105 C | 0.2 | 402 | Tray | 活跃 | Aluminum Electrolytic Capacitors - Snap In | 1760-BFBGA, FCBGA | 2 Pin | 1760-FCBGA (40x40) | AMD 赛灵思 | Details | 0°C ~ 100°C (TJ) | Bulk | B43641 | 20 % | 长寿命电容器 | 180 uF | Capacitors | 卡入式 | 700 mV | 10 mm | 0.99 A | 100 Hz | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 520 mOhms | Versal™ Prime FPGA, 70k Logic Cells | - | 通用电解电容器 | 电解电容器 | 22 mm | 30 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 85 C | 2.62 V | - 40 C | 1000 | 2.37 V | CTS | CTS电子元件 | Details | 726 | Tray | 活跃 | 标准时钟振荡器 | 7 mm x 5 mm | 1760-FCBGA (40x40) | AMD 赛灵思 | 55 % | 0°C ~ 100°C (TJ) | Reel | 637 | Oscillators | 45 mA | 148.35 MHz | 25 PPM | SMD/SMT | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | LVDS | Versal™ Prime FPGA, 1.2M Logic Cells | - | 标准振荡器 | 1.7 mm | 7 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R16A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 0 C | 450 | 8P8C | 磷青铜 | Amphenol | Amphenol Commercial Products | 384 | Tray | 活跃 | Modular Connectors / Ethernet Connectors | - | - | Thermoplastic polyester | Intel | + 70 C | 0°C ~ 100°C (TJ) | Tray | Agilex F | 磁性千斤顶 | Black | Jack (Female) | Modular Connectors / Ethernet Connectors | Shielded | 焊针 | 1x1 | 1 Port | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 0 C to + 70 C | FPGA - 573K Logic Elements | - | Connectors | 直角 | RJ45 | Modular Connectors / Ethernet Connectors | UL 94V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R24C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Advanced Energy | Advanced Energy | 576 | Tray | 活跃 | Non-Isolated DC/DC Converters | - | - | Intel | 1 | -40°C ~ 100°C (TJ) | Agilex F | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Non-Isolated DC-DC Converters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGID023R18A1E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1005 | + 125 C | 0.000053 oz | - 40 C | 1000 | KYOCERA AVX | ATC / KYOCERA AVX | UBR | Details | 480 | Tray | 活跃 | High Frequency/RF Resistors | 0402 (1005 metric) | - | Intel | 0402 | 0°C ~ 100°C (TJ) | Reel | 504L | 1 % | Ultra-Boardband Resistor | 高频率 | Resistors | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | High Frequency/RF Resistors | 0.5 mm | 1 mm | 05 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVP1502-1LSEVSVA3340 | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Details | Panjit | Panjit | 1250 | 486 | Tray | 活跃 | Schottky Diodes & Rectifiers | 3340-BFBGA | 3340-BGA (55x55) | AMD | 0.040283 oz | 0°C ~ 100°C (TJ) | 弹药包 | Versal® Premium | Diodes & Rectifiers | Si | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-L2FFG676I | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0805 | 2012 | + 150 C | - 55 C | 1000 | Vishay | 500 VDC | Vishay / Vitramon | N | Class 1 | 130 | Tray | XC7Z035 | 活跃 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | 0805 (2012 metric) | 676-FCBGA (27x27) | AMD | AEC-Q200 | -40°C ~ 100°C (TJ) | Reel | VJ....32 | 0.1 pF | Standard | Lead-Bearing Finish MLCCs | 3.3 pF | Capacitors | SMD/SMT | C0G (NP0) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | 通用型MLCC | 陶瓷电容器 | 1.45 mm | 2 mm | 1.25 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB014R24D2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tray | 活跃 | - | - | Intel | - | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA014R24B2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 121010 | 活跃 | 768 | - | - | Molex | Bulk | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB023R25A3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | RN732A | Obsolete | 480 | 0805 (2012 Metric) | 0805 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 505 Ohms | Thin Film | 0.1W, 1/10W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | Moisture Resistant | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFD019R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 110267 | 活跃 | 480 | - | - | Molex | Bulk | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5CG-1SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 221050 | 活跃 | 252 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Molex | Bulk | 0°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F060M3E-1CS288I | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 155523-4500 | ITT Cannon | ITT Cannon | Details | TFBGA, BGA288,21X21,20 | GRID ARRAY, THIN PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 20 | 1.425 V | 无 | A2F060M3E-1CS288I | 100 MHz | TFBGA | SQUARE | Obsolete | MICROSEMI CORP | 1.575 V | 5.24 | 军规圆形连接器 | YES | 288 | 1 | e0 | 锡铅银 | 8542.39.00.01 | Circular Connectors | CMOS | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B288 | 68 | 不合格 | 1.5,1.8,2.5,3.3 V | 68 | 1536 CLBS, 60000 GATES | 1.05 mm | 现场可编程门阵列 | 1536 | 1536 | 60000 | 军规圆形连接器 | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU43DR-L2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Non-Illuminated | Amphenol Nexus Technologies | Details | 366 | 活跃 | 按钮开关 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Amphenol | -40°C ~ 100°C (TJ) | NX300 | Switches | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 按钮开关 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Honeywell | Non-Illuminated | Honeywell | Details | 366 | Tray | 活跃 | 限位开关 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 1 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Switches | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 限位开关 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-2LSEVSVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 | TE Connectivity | 测量专业 | 线性位移传感器 | 2 oz | Bulk | R60D | Sensors | 线性位移传感器 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1MLIVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 施耐德电气 | Telemecanique | Details | 770 | Tray | 活跃 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 1 | -40°C ~ 100°C (TJ) | XUB | Sensors | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | 接近传感器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2MSIVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 55 C | 400 | PCB 安装 | EPCOS / TDK | EPCOS / TDK | Details | 500 | Tray | 活跃 | NTC热敏电阻 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | + 155 C | -40°C ~ 100°C (TJ) | Bulk | B58100 | 2 % | NTC | 1.465 kOhms | Thermistors | 60 mW | Radial | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | NTC热敏电阻 | 11 mm | 12 mm | 12.6 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z0302FBG676E | Other | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 73342-510-000 | PacTec | PacTec | N | Enclosures, Boxes, & Cases | 1 | Connector Enclosure | Black | Enclosures, Racks and Boxes | Black | Enclosures | Enclosures, Boxes, & Cases | 0.8 in | 2.72 in | 1.7 in | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU48DR-2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Amphenol | Amphenol Commercial Products | 366 | Tray | 活跃 | Modular Connectors / Ethernet Connectors | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 125 | -40°C ~ 100°C (TJ) | Reel | Zynq® UltraScale+™ RFSoC | Modular Connectors / Ethernet Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Modular Connectors / Ethernet Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-1FFVG1517E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1111 | 2828 | P90 | + 125 C | - 55 C | 1000 | KYOCERA AVX | ATC / KYOCERA AVX | Details | 561 | Tray | 活跃 | Silicon RF Capacitors / Thin Film | 1111 (2828 metric) | 1517-FCBGA (40x40) | AMD 赛灵思 | 500 V | 0°C ~ 100°C (TJ) | Reel | 100B | 0.25 pF | 90 PPM / C | High Q, Low ESR/ESL Porcelain Superchip Capacitor | 3.9 pF | Capacitors | SMD/SMT | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | RF/Microwave Multilayer Capacitors (MLC) | Silicon RF Capacitors / Thin Film | 2.59 mm | 2.79 mm | 2.79 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU46DR-2FFVH1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Positronic | Amphenol Positronic | 574 | Tray | 活跃 | D-Sub Mixed Contact Connectors | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | 5 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | D-Sub Connectors | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Mixed Contact D-Sub Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z0452FF900E | Other | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Sensata | AIRPAX | 3 | 断路器 | 断路器 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z0101CLG225C | Other | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Amphenol | Amphenol Commercial Products | Modular Connectors / Ethernet Connectors | 125 | Reel | Modular Connectors / Ethernet Connectors | Modular Connectors / Ethernet Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z0302FFG676I | Other | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Positronic | Amphenol Positronic | Details | D-Sub Mixed Contact Connectors | 1 | D-Sub Connectors | Mixed Contact D-Sub Connectors |