类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 刷新周期 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 交错突发长度 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | M93C46-WBN6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | e0 | Obsolete | 3 (168 Hours) | 8 | EAR99 | Tin/Lead (Sn/Pb) | 2.5V~5.5V | DUAL | 1 | 5V | 2.54mm | M93C46 | 8 | 5.5V | 3/5V | 2.5V | Serial | 1Kb 128 x 8 64 x 16 | 2mA | 2MHz | 200 ns | EEPROM | SPI | 64X16 | 3-STATE | 5ms | 1 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 3.3mm | 9.27mm | 6.35mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C76CT-E/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2012 | e4 | 活跃 | 1 (Unlimited) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 4.5V~5.5V | DUAL | 5V | 0.5mm | 93C76C | 不合格 | 5V | 5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 2ms | 8 kb | 0.000003A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | HARDWARE/SOFTWARE | 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1470BV33-200AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 40 | CY7C1470 | 100 | 3.3V | 3.6V | 3.135V | 72Mb 2M x 36 | 4 | 500mA | 200MHz | 3ns | SRAM | Parallel | 2MX36 | 3-STATE | 36 | 21b | 72 Mb | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST25VF010A-33-4C-QAE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2014 | SST25 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | Matte Tin (Sn) | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | SST25VF010A | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 1Mb 128K x 8 | 10mA | 33MHz | 12 ns | FLASH | SPI | 8b | 1MX1 | 1 | 20μs | 1b | 1 Mb | 0.000015A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61LF6436A-8.5TQLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 100 | 657.000198mg | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) - annealed | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 40 | 100 | 3.3V | 3.63V | 2Mb 64K x 36 | 1 | 150mA | 150mA | 90MHz | 8.5ns | SRAM | Parallel | 64KX36 | 3-STATE | 36 | 16b | 2.3 Mb | 0.035A | COMMON | Synchronous | 36b | 20mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C09289V-12AC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2001 | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 3V~3.6V | QUAD | 240 | 1 | 3.3V | 0.5mm | 30 | CY7C09289 | 100 | 3.3V | 3.6V | 3V | 1Mb 64K x 16 | 2 | 180mA | 50MHz | 12ns | SRAM | Parallel | 64KX16 | 3-STATE | 16 | 16b | 1 Mb | COMMON | Synchronous | 16b | 3V | YES | 1.6mm | 14mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS42S32800D-6BL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 90-TFBGA | 90 | Volatile | 0°C~70°C TA | Tray | e1 | yes | Obsolete | 2 (1 Year) | 90 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.24 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.8mm | 40 | 90 | 3.3V | 3.6V | 3V | 256Mb 8M x 32 | 1 | 180mA | 166MHz | 5.4ns | DRAM | Parallel | 32b | 8MX32 | 32 | 13b | 256 Mb | 0.003A | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C56BT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C56B | 8 | 5V | 5V | Serial | 2Kb 128 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 16 | 2ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 8 | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC256-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EEPROM | Tin | 表面贴装 | TSSOP | 8 | 400kHz | 卷带 | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 85°C | -40°C | DUAL | 鸥翼 | 260 | 1 | 0.65mm | 400kHz | 40 | 8 | 3/5V | INDUSTRIAL | I2C, Serial | 5.5V | 2.5V | 32kB | 3mA | 900 ns | 8 | 256 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | NO | 1.2mm | 4.4mm | 3mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25H010F-2LBH2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.173, 4.40mm Width) | YES | Non-Volatile | -40°C~125°C TA | Cut Tape (CT) | 活跃 | 1 (Unlimited) | 8 | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | R-PDSO-G8 | 5.5V | 2.5V | 1Kb 128 x 8 | SYNCHRONOUS | 10MHz | EEPROM | SPI | 128X8 | 8 | 4ms | 1024 bit | SERIAL | SPI | 4ms | 1.71mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29CL016J0MQFM030 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 80-BQFP | YES | 80 | Non-Volatile | -40°C~125°C TA | Tray | CL-J | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | 哑光锡 | 8542.32.00.51 | 1.65V~3.6V | QUAD | 260 | 1 | 3.3V | 0.8mm | 40 | 3.3V | 3.6V | 3V | 16Mb 512K x 32 | 56MHz | 0.09mA | 54ns | FLASH | Parallel | 512KX32 | 32 | 60ns | 19b | 16 Mb | 0.00006A | YES | YES | YES | 1630 | 2K16K | YES | BOTTOM | YES | 3.35mm | 20mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS41LV16105D-50TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 50-TSOP (0.400, 10.16mm Width), 44 Leads | YES | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 44 | AUTO REFRESH; RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | R-PDSO-G44 | 3.6V | 3V | 16Mb 1M x 16 | 1 | ASYNCHRONOUS | 25ns | DRAM | Parallel | 1MX16 | 16 | 16777216 bit | 1.2mm | 20.95mm | 10.16mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W9425G6JB-5 | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 60-TFBGA | 60 | Volatile | 0°C~70°C TA | Tray | 2016 | 活跃 | 3 (168 Hours) | 60 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.24 | 2.3V~2.7V | BOTTOM | 未说明 | 1 | 2.5V | 0.8mm | 未说明 | 60 | 不合格 | 2.5V | 2.7V | 2.3V | 256Mb 16M x 16 | 1 | 120mA | SYNCHRONOUS | 200MHz | 55ns | DRAM | Parallel | 16MX16 | 3-STATE | 16 | 15ns | 15b | 256 Mb | 0.005A | COMMON | 8192 | 248 | 248 | 1.2mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 11AA161T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11AA161 | 8 | 不合格 | 5.5V | 2/5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | 单线 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11LC020T-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC020 | 8 | 5V | Serial | 2Kb 256 x 8 | 5mA | 100kHz | EEPROM | 单线 | 8 | 5ms | 2 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W631GU6MB12I | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 96-VFBGA | YES | Volatile | -40°C~95°C TC | Tray | 活跃 | 3 (168 Hours) | 96 | AUTO/SELF REFRESH | 1.283V~1.45V | BOTTOM | 1 | 1.35V | 0.8mm | R-PBGA-B96 | 1.45V | 1.283V | 1Gb 64M x 16 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 64MX16 | 16 | 1073741824 bit | 1mm | 13mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1381D-133AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1381 | 100 | 3.3V | 3.6V | 3.135V | 18Mb 512K x 36 | 4 | 210mA | 133MHz | 6.5ns | SRAM | Parallel | 512KX36 | 3-STATE | 36 | 19b | 18 Mb | 0.07A | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24FC64FT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 0.65mm | 40 | 24FC64F | 不合格 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS45S32400F-7TLA2-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | 表面贴装 | 86-TFSOP (0.400, 10.16mm Width) | YES | 86 | Volatile | -40°C~105°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 86 | 3V~3.6V | DUAL | 3.3V | 0.5mm | 不合格 | 3.3V | 128Mb 4M x 32 | 143MHz | 5.4ns | DRAM | Parallel | 32b | 4MX32 | 3-STATE | 32 | 0.002A | 134217728 bit | AEC-Q100 | COMMON | 4096 | 1248FP | 1248 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S32160F-7TL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Commercial grade | Tin | 表面贴装 | 表面贴装 | 86-TFSOP (0.400, 10.16mm Width) | 86 | Volatile | 0°C~70°C TA | Tube | 活跃 | 3 (168 Hours) | 86 | EAR99 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 8542.32.00.28 | 3V~3.6V | DUAL | 1 | 3.3V | 0.5mm | 不合格 | 3.3V | 3.6V | 3V | 512Mb 16M x 32 | 1 | SYNCHRONOUS | 143MHz | 5.4ns | DRAM | Parallel | 32b | 16MX32 | 3-STATE | 32 | 13b | 512 Mb | 0.004A | COMMON | 8192 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25X40CLSSIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | EAR99 | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8542.32.00.51 | 2.3V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | S-PDSO-G8 | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 4MX1 | 1 | 800μs | 4194304 bit | 2.7V | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S34ML02G104BHI010 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 63-VFBGA | YES | 63 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | ML-1 | Discontinued | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | 3.6V | 3/3.3V | 2.7V | 2Gb 128M x 16 | 0.04mA | FLASH | Parallel | 128MX16 | 16 | 25ns | 28b | 2 Gb | 0.00005A | 25 ns | 3V | NO | NO | YES | 2K | 64K | 2kB | YES | 1mm | 11mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NAND01GW3B2CN6E | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2008 | e3 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.5mm | 30 | NAND01G-A | 48 | 3.6V | 3/3.3V | 2.7V | 1Gb 128M x 8 | 30mA | FLASH | Parallel | 128MX8 | 8 | 25ns | 28b | 1 Gb | 0.00005A | 25000 ns | Asynchronous | 8b | 3V | 25ms | NO | NO | YES | 1K | 128K | 2kB | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS45S16100E-7TLA1 | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 50-TSOP (0.400, 10.16mm Width) | 50 | Volatile | -40°C~85°C TA | Tray | e3 | yes | Discontinued | 3 (168 Hours) | 50 | EAR99 | Matte Tin (Sn) - annealed | AUTO/SELF REFRESH | 8542.32.00.02 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 10 | 50 | 3.3V | 3.6V | 3V | 16Mb 1M x 16 | 1 | 150mA | 143MHz | 5.5ns | DRAM | Parallel | 16b | 1MX16 | 3-STATE | 16 | 12b | 16 Mb | 0.004A | COMMON | 2048 | 1248FP | 1248 | 1.2mm | 20.95mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT45DB161E-MHD-Y | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-UDFN Exposed Pad | 8-UDFN (5x6) | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 2.5V~3.6V | AT45DB161 | 16Mb 528Bytes x 4096 pages | 85MHz | FLASH | SPI | 8μs, 6ms | ROHS3 Compliant |