类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 刷新周期 | 顺序突发长度 | 交错突发长度 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS81302DT10E-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | Industrial grade | SRAM | BGA-165 | 400 MHz | -40 to 100 °C | Tray | GS81302DT10E | SigmaQuad-II+ B4 | Memory & Data Storage | 165 | 144 Mbit | 2 | 1.065 A | Pipelined | 16 M x 9 | 22 Bit | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS42S16800F-6TLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 54 | EAR99 | AUTO/SELF REFRESH | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 54 | 不合格 | 3.3V | 3.6V | 3V | 128Mb 8M x 16 | 1 | 120mA | SYNCHRONOUS | 166MHz | 5.4ns | DRAM | Parallel | 16b | 8MX16 | 3-STATE | 16 | 12b | 128 Mb | 0.002A | COMMON | 4096 | 1248FP | 1248 | 1.2mm | 22.22mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C76C-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 1 | 5V | 2.54mm | 93C76C | 8 | 5V | 5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 512X16 | 16 | 2ms | 8 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | HARDWARE/SOFTWARE | 8 | 5.334mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S34ML02G100BHB000 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | 表面贴装 | 63-VFBGA | YES | 63 | Non-Volatile | -40°C~105°C TA | Tray | 2016 | ML-1 | Discontinued | 3 (168 Hours) | 63 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 25ns | 2147483648 bit | AEC-Q100 | 3V | 1mm | 11mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25Q20EWSNIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tray | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | 1.65V~1.95V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-G8 | 不合格 | 1.95V | 1.8V | 1.65V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 2MX1 | 1 | 800μs | 0.0000075A | 2097152 bit | 1.8V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1.75mm | 4.85mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302S36GE-375I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | Details | DDR-II | Industrial grade | SRAM | BGA-165 | 375 MHz | -40 to 100 °C | Tray | GS81302S36GE | SigmaSIO DDR-II | Memory & Data Storage | 165 | 144 Mbit | 2 | 1.115 A | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z32CD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | SRAM | BGA-165 | 有 | Tray | GS881Z32CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 160 mA, 190 mA | 6.5 ns | 256 k x 32 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71108AGU-10 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | 未说明 | 10 ns | 70 °C | 有 | GS71108AGU-10 | 131072 words | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | YES | 48 | TFBGA, | e1 | 有 | 3A991.B.2.B | 锡银铜 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 1048576 bit | PARALLEL | 标准SRAM | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8642Z72C-250M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 2.5, 3.3 V | 表面贴装 | 2.7, 3.6 V | 72 Bit | 1 MWords | Synchronous | 2.3, 3 V | 250 MHz | + 125 C | 3.6 V | - 55 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Military grade | SRAM | BGA-209 | 153.8@Flow-Through/250@Pipelined MHz | -55 to 125 °C | GS8642Z72C | NBT Pipeline/Flow Through | Memory & Data Storage | 209 | 72 Mbit | 8 | 500 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | 72 Mbit | Military | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT07E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | SRAM | BGA-165 | 450 MHz | -40 to 100 °C | Tray | GS81302TT07E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1.01 A | 0.45 | 16 M x 8 | 144 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88018CGT-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | TQFP | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 512 kWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Industrial grade | SRAM | TQFP-100 | 181.8@Flow-Through/250@Pipelined MHz | -40 to 85 °C | Tray | GS88018CGT | Pipeline/Flow Through | Memory & Data Storage | 100 | 9 Mbit | 2 | 165 mA, 200 mA | 5.5 ns | Flow-Through/Pipelined | 512 k x 18 | 19 Bit | 9 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71108AGU-12I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 12 ns | 85 °C | 有 | GS71108AGU-12I | 131072 words | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | YES | 48 | TFBGA, | e1 | 有 | 3A991.B.2.B | 锡银铜 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 1048576 bit | PARALLEL | 标准SRAM | 8 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71108AGU-8 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | 未说明 | 8 ns | 70 °C | 有 | GS71108AGU-8 | 131072 words | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | YES | 48 | TFBGA, | e1 | 有 | 3A991.B.2.B | 锡银铜 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 1048576 bit | PARALLEL | 标准SRAM | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302T37E-350I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 4 MWords | 36 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | SRAM | BGA-165 | 350 MHz | -40 to 100 °C | Tray | GS81302T37E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 905 mA | Pipelined | 4 M x 36 | 21 Bit | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS74116AX-10E | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 135 | 3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | N | SRAM | BGA-48 | 3.6 V | GS74116AX | Asynchronous | Memory & Data Storage | 4 Mbit | 105 mA | 10 ns | 256 k x 16 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302DT38E-500I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | QDR | 1.8000 V | Synchronous | 4 MWords | 36 Bit | 表面贴装 | 有 | 500 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | QDR-II | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS81302DT38E-500I | 1.8 V | LBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.06 | BGA | Industrial grade | SRAM | BGA-165 | YES | 165 | 500 MHz | -40 to 100 °C | Tray | GS81302DT38E | 无 | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | INDUSTRIAL | 1.7 V | 144 Mbit | 2 | SYNCHRONOUS | 1.67 A | Pipelined | 4 M x 36 | 1.5 mm | 36 | 20 Bit | 144 Mbit | 150994944 bit | Industrial | PARALLEL | QDR SRAM | SRAM | 17 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT25010YI-G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Industrial grade | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 8 | 5V | SPI, Serial | 1Kb 128 x 8 | 2mA | 20MHz | 75 ns | EEPROM | SPI | 8 | 5ms | 1 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S25FL128SAGMFIG10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | ALSO CONFIGURABLE AS 128M X 1 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 1.27mm | 不合格 | 3V | 3.6V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 90mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 8 | 1b | 128 Mb | 0.0001A | Synchronous | 1b | 3V | SPI | 100000 Write/Erase Cycles | 500ms | 20 | HARDWARE/SOFTWARE | 2 | 2.65mm | 10.3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C15632KV18-450BZXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C15632 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 4M x 18 | 2 | 780mA | 450MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | 0.34A | SEPARATE | Synchronous | 18b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1668KV18-450BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2014 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 40 | CY7C1668 | 165 | 1.8V | 144Mb 8M x 18 | 1 | 790mA | 450MHz | 450 ps | SRAM | Parallel | 18 | 22b | 144 Mb | Synchronous | 18b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 7.5 ns | 70 °C | 有 | GS880E18CGT-150V | 150 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Commercial grade | SRAM | TQFP-100 | YES | 100 | 133.3@Flow-Through/150@Pipelined MHz | 0 to 70 °C | Tray | GS880E18CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | 2 V | 1.8/2.5 V | COMMERCIAL | 1.7 V | 9 Mbit | 2 | SYNCHRONOUS | 105 mA, 115 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 Bit | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | SRAM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | SRAM | BGA-165 | 450 MHz | 0 to 85 °C | Tray | GS81302TT19E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1 A | Pipelined | 8 M x 18 | 144 Mbit | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT10E-450I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 16 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 85 C | 1.9 V | - 40 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR-II | Industrial grade | SRAM | BGA-165 | 450 MHz | -40 to 100 °C | Tray | GS81302TT10E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1.01 A | Pipelined | 16 M x 9 | 23 Bit | 144 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS71108AGU-7I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 3.3000 V | 3 V | Asynchronous | 128 kWords | 8 Bit | 3.6 V | 表面贴装 | TFBGA, | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | 128000 | PLASTIC/EPOXY | -40 °C | 未说明 | 7 ns | 85 °C | 有 | GS71108AGU-7I | 3.3 V | TFBGA | RECTANGULAR | GSI技术 | 活跃 | GSI TECHNOLOGY | 5.22 | BGA | Industrial grade | YES | 48 | FBGA | -40 to 85 °C | e1 | 有 | 3A991.B.2.B | 锡银铜 | 8542.32.00.41 | CMOS | BOTTOM | BALL | 260 | 1 | 0.75 mm | compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | 1 | ASYNCHRONOUS | 128KX8 | 1.2 mm | 8 | 17 Bit | 1 Mbit | 1048576 bit | Industrial | PARALLEL | 标准SRAM | 8 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302D20E-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QDR | 1.8000 V | 1.7 V | Synchronous | 8 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | QDR-II | Commercial grade | SRAM | BGA-165 | 400 MHz | 0 to 85 °C | Tray | GS81302D20E | SigmaQuad-II+ | Memory & Data Storage | 144 Mbit | 2 | 1.175 A | Pipelined | 8 M x 18 | 21 Bit | 144 Mbit | Commercial | SRAM |