类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 写入周期时间 - 最大值 | 待机电压-最小值 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
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AT28C256E-15LM/883-815 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 Weeks | Military grade | 表面贴装 | 32-CLCC | YES | Non-Volatile | -55°C~125°C TC | Tube | 活跃 | 3 (168 Hours) | 32 | 自动写入 | 4.5V~5.5V | QUAD | 1 | 5V | 1.27mm | R-CQCC-N32 | 5.5V | 4.5V | 256Kb 32K x 8 | ASYNCHRONOUS | 150ns | EEPROM | Parallel | 32KX8 | 8 | 10ms | 262144 bit | MIL-STD-883 Class C | 5V | 10ms | 2.54mm | 13.97mm | 11.43mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1361C-133AJXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2003 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1361 | 100 | 3.3V | 3.6V | 3.135V | 9Mb 256K x 36 | 4 | 250mA | 133MHz | 6.5ns | SRAM | Parallel | 256KX36 | 3-STATE | 36 | 18b | 9 Mb | COMMON | Synchronous | 36b | 1.6mm | 20mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C09369V-9AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 1997 | e4 | yes | Obsolete | 3 (168 Hours) | 100 | Nickel/Palladium/Gold (Ni/Pd/Au) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 20 | CY7C09369 | 100 | 3.3V | 3.6V | 3V | 288Kb 16K x 18 | 2 | 230mA | 67MHz | 9ns | SRAM | Parallel | 16KX18 | 3-STATE | 18 | 14b | 288 kb | COMMON | Synchronous | 18b | 3V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342T19BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 2000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 未说明 | 0.45 ns | 85 °C | 无 | GS8342T19BD-333I | 333 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | Industrial grade | SRAM | BGA-165 | YES | 165 | 333 MHz | -40 to 100 °C | Tray | GS8342T19BD | e0 | 3A991.B.2.B | SigmaDDR-II+ B2 | Tin/Lead (Sn/Pb) | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 1 | SYNCHRONOUS | 525 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 20 Bit | 36 Mbit | 0.205 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
GS8182Q09BGD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | SRAM | BGA-165 | 有 | Tray | GS8182Q09BGD | SigmaQuad-II | Memory & Data Storage | 18 Mbit | 500 mA | 2 M x 9 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8162Z18DB-150IV | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 1 MWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 85 C | 2.7 V | - 40 C | 21 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | Industrial grade | SRAM | BGA-119 | 133.3@Flow-Through/150@Pipelined MHz | -40 to 100 °C | Tray | GS8162Z18DB | NBT Pipeline/Flow Through | Memory & Data Storage | 119 | 18 Mbit | 2 | 180 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 18 | 20 Bit | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342D20BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 0.45 ns | 70 °C | 无 | GS8342D20BD-450 | 450 MHz | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.21 | BGA | Commercial grade | SRAM | BGA-165 | YES | 165 | 450 MHz | 0 to 85 °C | Tray | GS8342D20BD | 3A991.B.2.B | SigmaQuad-II+ | 流水线结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 785 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | 19 Bit | 36 Mbit | 0.24 A | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||
GS8182D08BGD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 8 Bit | 1.9 V | 表面贴装 | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | DDR | Commercial grade | SRAM | BGA-165 | 375 MHz | 0 to 70 °C | Tray | GS8182D08BGD | SigmaQuad-II | Memory & Data Storage | 165 | 18 Mbit | 2 | 680 mA | Pipelined | 2 M x 8 | 19 Bit | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342S09BGD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | Details | DDR | SRAM | BGA-165 | 有 | Tray | GS8342S09BGD | SigmaSIO DDR-II | Memory & Data Storage | 36 Mbit | 705 mA | 4 M x 9 | 36 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8162Z18DGB-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 400 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | 未说明 | 4 ns | 85 °C | 有 | GS8162Z18DGB-400 | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.27 | BGA | Commercial grade | SRAM | BGA-119 | YES | 119 | 250@Flow-Through/400@Pipelined MHz | 0 to 85 °C | Tray | GS8162Z18DGB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | OTHER | 2.3 V | 18 Mbit | 2 | SYNCHRONOUS | 255 mA, 335 mA | 4 ns | Flow-Through/Pipelined | 1 M x 18 | 1.99 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
GS8342Q18BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | SRAM | BGA-165 | 333 MHz | -40 to 100 °C | Tray | GS8342Q18BD | SigmaQuad-II | Memory & Data Storage | 165 | 36 Mbit | 2 | 895 mA | Pipelined | 2 M x 18 | 20 Bit | 36 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8672T20BGE-633 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 633 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | Details | DDR-II | SRAM | BGA-165 | 有 | Tray | GS8672T20BGE | SigmaDDR-II+ B2 | Memory & Data Storage | 72 Mbit | 1.5 A | 4 M x 18 | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8182D08BD-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | 1.8000 V | 1.7 V | Synchronous | 8 Bit | 1.9 V | 有 | 375 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Commercial grade | SRAM | BGA-165 | 375 MHz | 0 to 70 °C | Tray | GS8182D08BD | SigmaQuad-II | Memory & Data Storage | 165 | 18 Mbit | 680 mA | 0.45 | 2 M x 8 | 19 Bit | 18 | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8182S08BD-167 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 167 MHz | + 70 C | 1.9 V | 0 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO DDR-II | N | DDR | SRAM | BGA-165 | 有 | Tray | GS8182S08BD | SigmaSIO DDR-II | Memory & Data Storage | 18 Mbit | 315 mA | 2 M x 8 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8182D08BGD-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 85 C | 1.9 V | - 40 C | 1.7 V | SMD/SMT | Parallel | BGA-165 | 200 MHz | 18 Mbit | 365 mA | 2 M x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8672D18BGE-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | Details | QDR-II | SRAM | BGA-165 | 有 | Tray | GS8672D18BGE | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 850 mA | 4 M x 18 | 72 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342T11BD-400 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | Synchronous | 4 MWords | 9 Bit | 表面贴装 | 有 | 400 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR | Commercial grade | SRAM | BGA-165 | 400 MHz | 0 to 85 °C | Tray | GS8342T11BD | SigmaQuad-II+ | Memory & Data Storage | 165 | 36 Mbit | 1 | 600 mA | Pipelined | 4 M x 9 | 21 Bit | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS816218DD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 250 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | SRAM | BGA-165 | 有 | Tray | GS816218DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 210 mA, 230 mA | 5.5 ns | 1 M x 18 | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8182Q09BD-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | QDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 9 Bit | 1.9 V | 表面贴装 | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 18 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | DDR | Industrial grade | SRAM | BGA-165 | 333 MHz | -40 to 85 °C | Tray | GS8182Q09BD | SigmaQuad-II | Memory & Data Storage | 18 Mbit | 2 | 870 mA | Pipelined | 2 M x 9 | 20 Bit | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8322Z36AD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 14 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 1000000 | PLASTIC/EPOXY | BGA165,11X15,40 | 未说明 | 7.5 ns | 70 °C | 无 | GS8322Z36AD-150 | 150 MHz | 2.5 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.12 | BGA | Commercial grade | SRAM | BGA-165 | YES | 165 | FBGA | 0 to 85 °C | Tray | GS8322Z36AD | e0 | 无 | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 36 Mbit | 4 | SYNCHRONOUS | 190 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||
GS8162Z18DB-375 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 1 MWords | 18 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 375 MHz | + 70 C | 3.6 V | 0 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | BGA, | 网格排列 | 1000000 | PLASTIC/EPOXY | 未说明 | 4.2 ns | 85 °C | 无 | GS8162Z18DB-375 | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.27 | BGA | Commercial grade | SRAM | BGA-119 | YES | 119 | 238@Flow-Through/375@Pipelined MHz | 0 to 85 °C | Tray | GS8162Z18DB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | OTHER | 2.3 V | 18 Mbit | 2 | SYNCHRONOUS | 250 mA, 320 mA | 4.2 ns | Flow-Through/Pipelined | 1 M x 18 | 1.99 mm | 18 | 20 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
GS8342S18BGD-350 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 350 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaSIO-II | Details | DDR | Commercial grade | SRAM | BGA-165 | 350 MHz | 0 to 85 °C | Tray | GS8342S18BGD | SigmaSIO DDR-II | Memory & Data Storage | 165 | 36 Mbit | 2 | 665 mA | Pipelined | 2 M x 18 | 20 Bit | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8161E36DGT-200I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 200 MHz | + 85 C | 3.6 V | - 40 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | QFP, | FLATPACK | 512000 | UNSPECIFIED | -40 °C | 未说明 | 4.2 ns | 85 °C | 有 | GS8161E36DGT-200I | 524288 words | 2.5 V | QFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.64 | QFP | SRAM | TQFP-100 | YES | 100 | 有 | Tray | GS8161E36DGT | 3A991.B.2.B | DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 未说明 | 1 | compliant | 100 | R-XQFP-G100 | 不合格 | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | SYNCHRONOUS | 230 mA | 6.5 ns | 512 k x 36 | 36 | 18874368 bit | PARALLEL | 缓存SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342DT11BD-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | 1.8000 V | 1.7 V | Synchronous | 9 Bit | 1.9 V | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II+ | N | DDR | Commercial grade | SRAM | BGA-165 | 450 MHz | 0 to 85 °C | Tray | GS8342DT11BD | SigmaQuad-II+ | Memory & Data Storage | 165 | 36 Mbit | 785 mA | 0.45 | 4 M x 9 | 36 | Commercial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
GS8342T18BD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | FBGA | DDR | 1.8000 V | 1.7 V | Synchronous | 2 MWords | 18 Bit | 1.9 V | 表面贴装 | 有 | 250 MHz | + 70 C | 1.9 V | 0 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II | N | DDR | Commercial grade | SRAM | BGA-165 | 250 MHz | 0 to 85 °C | Tray | GS8342T18BD | SigmaDDR-II B2 | Memory & Data Storage | 165 | 36 Mbit | 1 | 395 mA | Pipelined | 2 M x 18 | 21 Bit | 36 Mbit | Commercial | SRAM |