类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 上升时间 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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 | BR93L56FJ-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 锡铜 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 10 | BR93L56 | 8 | 不合格 | 5V | Serial | 2Kb 128 x 16 | SYNCHRONOUS | 2MHz | 2 μs | EEPROM | SPI | 16 | 5ms | 0.000002A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 40 | SOFTWARE | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT25DF081A-SH-T | Adesto Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 1997 | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 8 | 3.3V | 3.6V | 2.7V | SPI, Serial | 8Mb 256Bytes x 4096 pages | 20mA | 100MHz | FLASH | SPI | 8b | 1 | 7μs, 3ms | 1b | 8 Mb | 0.00001A | Synchronous | 8b | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | 2.16mm | 5.29mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF1682-70-4I-B3KE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2000 | SST39 MPF™ | e1 | yes | 活跃 | 2 (1 Year) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | SST39VF1682 | 48 | 3.3V | 3.6V | 2.7V | 16Mb 2M x 8 | 18mA | 70ns | FLASH | Parallel | 8b | 2MX8 | 8 | 10μs | 21b | 16 Mb | 0.00002A | Asynchronous | 8b | 2.7V | YES | YES | YES | 512 | 4K | YES | TOP | YES | 1.2mm | 8mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | AT24CS04-XHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Cut Tape (CT) | 2005 | e4 | yes | Discontinued | 3 (168 Hours) | 8 | 1.7V~5.5V | DUAL | 1 | 5V | 0.65mm | AT24CS04 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 4Kb 512 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDMR | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 93C66AT-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 93C66A | 8 | 5V | 5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | IS25LP128-JLLE-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | SEATED HGT-CALCULATED | 2.3V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 10 | 3V | 3.6V | 2.7V | SPI, Serial | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI | 8 | 1ms | 24b | 128 Mb | 3V | 1 | 256B | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1265XV18-633BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1265 | 165 | 1.8V | 1.9V | 1.7V | 36Mb 1M x 36 | 2 | 633MHz | 50 ns | SRAM | Parallel | 1MX36 | 3-STATE | 36 | 18b | 36 Mb | 1.66A | SEPARATE | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT21CS01-SSHM12-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2005 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | AT21CS01 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | N25Q032A11ESE40G | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 1.7V~2V | DUAL | 260 | 1 | 1.8V | 1.27mm | 30 | N25Q032 | 8 | 1.8V | 1.7V | SPI, Serial | 32Mb 8M x 4 | 20mA | 108MHz | 7 ns | FLASH | SPI | 1MX32 | 8ms, 5ms | 22b | 32 Mb | Synchronous | 8b | 256B | 1.91mm | 5.49mm | 5.49mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AT21CS01-SSHM13-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TC | Tape & Reel (TR) | 2014 | e4 | yes | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~3.6V | DUAL | 260 | 1 | 1.8V | 1.27mm | 40 | AT21CS01 | 3.6V | 1.7V | 1Kb 128 x 8 | SYNCHRONOUS | 125kHz | EEPROM | I2C, Single Wire | 8 | 5ms | 1024 bit | SERIAL | 1-WIRE | 5ms | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1353G-100AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2004 | NoBL™ | e3 | yes | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | FLOW-THROUGH ARCHITECTURE | 3.135V~3.465V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1353 | 100 | 3.3V | 3.6V | 3.135V | 4.5Mb 256K x 18 | 2 | 205mA | 100MHz | 8ns | SRAM | Parallel | 18 | 18b | 4 Mb | Synchronous | 18b | 1.6mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B116S-BZ25XI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Non-Volatile | -40°C~85°C TA | Tray | 2014 | 活跃 | 3 (168 Hours) | 165 | 3A991.B.2.B | 8542.32.00.41 | 2.7V~3.6V | BOTTOM | 未说明 | 1 | 3V | 1mm | 未说明 | 3V | 3.6V | 2.7V | 16Mb 512K x 32 | ASYNCHRONOUS | NVSRAM | Parallel | 32b | 512KX32 | 32 | 25ns | 16 Mb | 25 ns | 1.4mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S29GL256S10TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | GL-S | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | 256Mb 16M x 16 | 60mA | 100ns | FLASH | Parallel | 16b | 32MX8 | 8 | 60ns | 24b | 256 Mb | 0.0001A | Asynchronous | 16b | 2.7V | YES | YES | YES | 256 | 64K | 32B | YES | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C256C-MAHL-E | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e4 | 活跃 | 3 (168 Hours) | 8 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES 1.7V AT 400 KHZ | 8542.32.00.51 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | AT24C256C | R-PDSO-N8 | 5.5V | 1.7V | 256Kb 32K x 8 | SYNCHRONOUS | 1MHz | 550ns | EEPROM | I2C | 32KX8 | 8 | 5ms | 262144 bit | SERIAL | I2C | 5ms | 0.6mm | 3mm | 2mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S25FS256SDSNFI001 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 16 | 10.886217mg | Non-Volatile | -40°C~85°C TA | Tube | 2013 | FS-S | 活跃 | 3 (168 Hours) | 8 | 8542.32.00.51 | 1.7V~2V | DUAL | 1 | 1.8V | 1.27mm | R-PDSO-N8 | 1.8V | 2V | 1.7V | SPI, Serial | 256Mb 32M x 8 | 90mA | 80MHz | FLASH | SPI - Quad I/O, QPI | 8b | 64MX4 | 4 | 256 Mb | 2 | 0.8mm | 8mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT29LV040A-15JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | 32-PLCC (13.97x11.43) | Non-Volatile | -40°C~85°C TC | Tube | 1997 | Obsolete | 2 (1 Year) | 3V~3.6V | AT29LV040 | 4Mb 512K x 8 | 150ns | FLASH | Parallel | 20ms | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39VF802C-70-4I-MAQE | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 48-WFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | SST39 MPF™ | e1 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | TOP BOOT BLOCK | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 0.5mm | 5MHz | 40 | SST39VF802C | 48 | 3.3V | 3.6V | 2.7V | 8Mb 512K x 16 | 18mA | 70ns | FLASH | Parallel | 16b | 512KX16 | 10μs | 19b | 8 Mb | 0.00002A | Asynchronous | 16b | 2.7V | YES | YES | YES | 256 | 2K | YES | TOP | YES | 530μm | 6mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| 25LC080B-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC080B | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 8Kb 1K x 8 | 6mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000005A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | IS61NLP25618A-200TQLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Industrial grade | 表面贴装 | 100-LQFP | YES | 100 | Volatile | -40°C~85°C TA | Tray | e3 | yes | 活跃 | 2 (1 Year) | 100 | Matte Tin (Sn) - annealed | 流水线结构 | 3.135V~3.465V | QUAD | 260 | 1 | 3.3V | 0.65mm | 40 | 100 | 3.3V | 3.465V | 3.135V | 4.5Mb 256K x 18 | 2 | 210mA | 200MHz | 3.1ns | SRAM | Parallel | 3-STATE | 18 | 18b | 4 Mb | 0.035A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62128DV30LL-70SI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-SOIC (0.445, 11.30mm Width) | YES | Volatile | -40°C~85°C TA | Tube | 2006 | MoBL® | e0 | Obsolete | 1 (Unlimited) | 32 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | 2.2V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | not_compliant | 70GHz | 未说明 | CY62128 | 32 | R-PDSO-G32 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | 1Mb 128K x 8 | 0.01mA | SRAM | Parallel | 128KX8 | 3-STATE | 8 | 70ns | 0.000003A | 1048576 bit | 70 ns | COMMON | 1.5V | 2.997mm | 20.4465mm | 11.303mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | CY62138FLL-45ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-SOIC (0.400, 10.16mm Width) | 32 | Volatile | -40°C~85°C TA | Tube | 2001 | MoBL® | e3 | yes | Obsolete | 3 (168 Hours) | 32 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 20 | CY62138 | 32 | 5V | 5V | 2Mb 256K x 8 | 1 | 18mA | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 45ns | 18b | 2 Mb | 0.000005A | 22MHz | 45 ns | COMMON | Asynchronous | 8b | 2V | 20.95mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C2564XV18-366BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C2564 | 165 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.165A | 366MHz | 450 ps | SRAM | Parallel | 4MX18 | 3-STATE | 18 | 20b | 72 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY6264-70SNC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | 28 | Volatile | 0°C~70°C TA | Tube | 1996 | MoBL® | e0 | Obsolete | 3 (168 Hours) | 28 | EAR99 | Tin/Lead (Sn/Pb) | 4.5V~5.5V | DUAL | 225 | 1 | 5V | 70GHz | 30 | CY6264 | 28 | 5V | 5V | 64Kb 8K x 8 | 1 | 100mA | SRAM | Parallel | 8KX8 | 3-STATE | 8 | 70ns | 13b | 64 kb | COMMON | Asynchronous | 8b | YES | 2.794mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95512-DRMN8TP/K | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~105°C TA | Tape & Reel (TR) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 1.27mm | 未说明 | M95512 | 不合格 | 5.5V | 2/5V | SPI, Serial | 512Kb 64K x 8 | SYNCHRONOUS | 16MHz | EEPROM | SPI | 8 | 4ms | 0.000001A | SPI | 900000 Write/Erase Cycles | 4ms | 50 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CAT93C56XI-T2 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 5V | 1.27mm | CAT93C56 | 8 | 5V | Serial | 2Kb 256 x 8 128 x 16 | 1mA | 2MHz | 250 ns | EEPROM | SPI | 2 kb | 0.000002A | MICROWIRE | 1000000 Write/Erase Cycles | 100 | SOFTWARE | 1.78mm | 5.38mm | 5.33mm | 无 | ROHS3 Compliant |