类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 速度 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||
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![]() | RC28F640J3F75A | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 64-TBGA | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2010 | StrataFlash™ | e0 | no | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Lead (Sn63Pb37) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 235 | 1 | 3V | 1mm | 30 | 28F640J3 | 64 | 3.6V | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | 54mA | FLASH | Parallel | 4MX16 | 16 | 75ns | 64 Mb | 0.00012A | 75 ns | Asynchronous | 2.7V | 8 | NO | NO | YES | 64 | 128K | 4/8words | YES | YES | 1.2mm | 13mm | 10mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L1633EM2I-10G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2011 | MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | 8 | MATTE TIN (800) | IT ALSO CONFIGURED AS 16M X 1 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 16Mb 2M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 4MX4 | 4 | 50μs, 3ms | 16 Mb | 0.00002A | 2.7V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 2 | 2.16mm | 5.28mm | 5.23mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA56/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | Automotive grade | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2004 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 1.8V~5.5V | DUAL | 1 | 3V | 2.54mm | 93AA56 | 8 | 5.5V | 2/5V | Serial | 2Kb 256 x 8 128 x 16 | 3mA | 2MHz | EEPROM | SPI | 3-STATE | 16 | 10ms | 2 kb | 0.00003A | TS 16949 | MICROWIRE | 10000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 8 | 4.32mm | 9.46mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C136-25JXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 52-LCC (J-Lead) | 52 | Volatile | 0°C~70°C TA | Tube | 2003 | e3 | Obsolete | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | QUAD | 260 | 1 | 5V | 25GHz | 20 | CY7C136 | 52 | 5V | 5V | 16Kb 2K x 8 | 2 | 170mA | SRAM | Parallel | 3-STATE | 8 | 25ns | 22b | 16 kb | 0.015A | COMMON | Asynchronous | 8b | 5.08mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL024/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.65mm | 40 | 24VL024 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA56T-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 29 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000K ERASE/WRITE CYCLE; 200 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93AA56 | 8 | 5.5V | 2-Wire, Serial | 2Kb 256 x 8 128 x 16 | 3mA | 2MHz | 6 ms | EEPROM | SPI | 16 | 10ms | 2 kb | MICROWIRE | 10ms | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA128T-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 16000 | PLASTIC/EPOXY | SOP8,.3 | -40 °C | 40 | 2.5 V | SOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.36 | SOIC | 16384 words | 0.4 MHz | 24AA128T-I/SMG | 有 | 85 °C | 表面贴装 | YES | 8 | 8 | Compliant | Tape & Reel (TR) | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 400 kHz | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | I2C, Serial | 5.5 V | 1.8 V | 16 kB | 3 mA | SYNCHRONOUS | 0.003 mA | 900 ns | 16KX8 | 2.03 mm | 8 | 128 kb | 0.000001 A | 131072 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 5.26 mm | 5.25 mm | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT25020HU4I-GT3 | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | Industrial grade | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.8V~5.5V | DUAL | 1 | 5V | 0.5mm | CAT25020 | 8 | 5.5V | 2/5V | SPI, Serial | 2Kb 256 x 8 | 2mA | 10MHz | 40 ns | EEPROM | SPI | 无卤素 | 8 | 5ms | 2 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 0.55mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24C08BY6-YH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | 8-Mini Map (2x3) | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 1MHz | AT24C08 | 5V | 2-Wire, I2C, Serial | 5.5V | 1.8V | 8Kb 1K x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 8 kb | 400kHz | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C66B-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C66B | 8 | 5V | 5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29JL032J60TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Tin | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2015 | JL-J | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.3V | 3.6V | 2.7V | Parallel, Serial | 32Mb 4M x 8 2M x 16 | 16mA | FLASH | Parallel | 8b | 2MX16 | 16 | 60ns | 32 Mb | 0.000005A | 60 ns | Asynchronous | 3V | 8 | YES | YES | 863 | 8K64K | YES | BOTTOM | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 11LC161T-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 11LC161 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | 单线 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL032N90FAI033 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | 表面贴装 | 64-LBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | GL-N | e0 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | Tin/Lead (Sn/Pb) | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 240 | 1 | 3V | 1mm | 30 | 不合格 | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | ASYNCHRONOUS | 0.05mA | FLASH | Parallel | 2MX16 | 16 | 90ns | 0.000005A | 33554432 bit | 90 ns | 3V | 8 | YES | YES | YES | 863 | 8/16words | YES | TOP | YES | 1.4mm | 13mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C66B-E/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2003 | e3 | yes | 活跃 | 不适用 | 8 | EAR99 | 4.5V~5.5V | DUAL | 1 | 2.5V | 2.54mm | 93C66B | 8 | 5V | 5V | Serial | 4Kb 256 x 16 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 256X16 | 16 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 5.33mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93C66A-E/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2011 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 93C66A | 8 | 5V | 5V | Serial | 4Kb 512 x 8 | 2mA | 2MHz | 250 ns | EEPROM | SPI | 8 | 2ms | 4 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS62WV10248BLL-55BLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Industrial grade | 表面贴装 | 表面贴装 | 48-TFBGA | 48 | Volatile | -40°C~85°C TA | Tray | e1 | yes | 活跃 | 2 (1 Year) | 48 | Tin/Silver/Copper (Sn/Ag/Cu) | 2.5V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 40 | 48 | 3.3V | 3.6V | 2.5V | 8Mb 1M x 8 | 1 | 35mA | SRAM | Parallel | 3-STATE | 8 | 55ns | 20b | 8 Mb | 0.00002A | 55 ns | COMMON | Asynchronous | 8b | 8.7mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AS4C1M16S-7TCN | Alliance Memory, Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Commercial grade | 表面贴装 | 表面贴装 | 50-TSOP (0.400, 10.16mm Width) | 50 | Volatile | 0°C~70°C TA | Tray | 2012 | yes | 活跃 | 3 (168 Hours) | 50 | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 0.8mm | 未说明 | 50 | 3.3V | 3.6V | 3V | 16Mb 1M x 16 | 1 | SYNCHRONOUS | 70mA | 143MHz | 5.4ns | DRAM | Parallel | 16b | 1MX16 | 2ns | 12b | 16 Mb | 1.1mm | 21.08mm | 10.29mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24HC02B-TH-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | 8-TSSOP | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 1MHz | AT24HC02 | 5V | 2-Wire, I2C, Serial | 5.5V | 1.8V | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 2 kb | 400kHz | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C1565KV18-500BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 1mm | 30 | CY7C1565 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 72Mb 2M x 36 | 2 | 1.21A | 500MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 19b | 72 Mb | 0.36A | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24MAC602-SSHM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | AT24MAC602 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 550ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 1010DDDR | 1.5mm | 5.05mm | 3.99mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL024T/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -20°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.5V~3.6V | DUAL | 260 | 1 | 1.8V | 0.95mm | 40 | 24VL024 | 8 | 不合格 | 3.3V | 3.6V | 1.5V | 2-Wire, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | N25Q128A13BSF40G | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Gold | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | 16 | Non-Volatile | -40°C~85°C TA | Tube | 2011 | yes | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | N25Q128A13 | 16 | 3/3.3V | 2.7V | SPI, Serial | 128Mb 16M x 8 | 20mA | 108MHz | 7 ns | FLASH | SPI | 8 | 8ms, 5ms | 24b | 128 Mb | 0.0001A | Synchronous | 8b | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 256B | BOTTOM | 2.65mm | 10.3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL01GP11TFCR10 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | 0°C~85°C TA | Tray | 2012 | GL-P | e3 | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 3V~3.6V | DUAL | 260 | 1 | 3.3V | 0.5mm | 40 | 3.3V | 3.6V | 3V | 1Gb 128M x 8 | 110mA | FLASH | Parallel | 8b | 1GX1 | 1 | 110ns | 1 Gb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 1K | 128K | 8/16words | YES | YES | 1.2mm | 18.4mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC08BHT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC08BH | 8 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS25LP064-JBLE-TR | Integrated Silicon Solution, Inc. (ISSI) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks, 6 Days | SMD/SMT | 2.3 V | 15 mA | SPI | 133 MHz | Synchronous | - 40 C | + 105 C | NOR | 有 | 2000 | 0.019048 oz | 3.6 V | SOP, | 小概要 | 64000000 | PLASTIC/EPOXY | -40 °C | 未说明 | 105 °C | 有 | IS25LP064-JBLE-TR | 133 MHz | 67108864 words | 3 V | SOP | SQUARE | 活跃 | INTEGRATED SILICON SOLUTION INC | 5.26 | SOIC-Wide-8 | YES | 8 | Details | Reel | IS25LP064 | CMOS | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | S-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.3 V | Serial (SPI) | 64 Mbit | 133 MHz | SYNCHRONOUS | 15 mA | 7 | Sector | 8 bit | 8 M x 8 | 2.16 mm | 1 | 64 | SERIAL | FLASH | 3 V | 5.28 mm | 5.28 mm |