类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||
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![]() | 24AA044T-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Automotive grade | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2014 | e3 | 活跃 | 1 (Unlimited) | 8 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA044 | 5.5V | 1.7V | 2-Wire, I2C, Serial | 4Kb 256 x 8 x 2 | SYNCHRONOUS | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | TS 16949 | I2C | 5ms | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29PL032J70BFI120 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2011 | PL-J | e1 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 上下靴块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 40 | 3.6V | 3/3.3V | 2.7V | 32Mb 2M x 16 | 55mA | FLASH | Parallel | 16b | 2MX16 | 16 | 70ns | 21b | 32 Mb | 0.000005A | 70 ns | Asynchronous | 16b | 3V | YES | YES | YES | 1662 | 4K32K | 8words | YES | BOTTOM/TOP | YES | 1mm | 8.15mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
![]() | 93LC46X/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tube | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 3 WIRE INTERFACE; AUTOMATIC WRITE; ERAL AT 4.5V TO 6.0V | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93LC46 | 8 | 6V | 3/5V | 2V | 2-Wire, Serial | 1Kb 128 x 8 64 x 16 | 3mA | 2MHz | 10 ms | EEPROM | SPI | 8 | 1 kb | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 16 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS64WV51216BLL-10CTLA3-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Automotive grade | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 活跃 | 2 (1 Year) | 2.4V~3.6V | 8Mb 512K x 16 | 1 | 140mA | SRAM | Parallel | 10ns | 19b | 8 Mb | Asynchronous | 16b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS63LV1024L-10JLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-BSOJ (0.300, 7.62mm Width) | 32 | Volatile | -40°C~85°C TA | Tube | e3 | yes | 最后一次购买 | 2 (1 Year) | 32 | Matte Tin (Sn) - annealed | 3.15V~3.45V | DUAL | 260 | 1 | 3.3V | 40 | 32 | 3.3V | 3.45V | 1Mb 128K x 8 | 1 | 160mA | SRAM | Parallel | 3-STATE | 8 | 10ns | 17b | 1 Mb | COMMON | Asynchronous | 8b | 2V | 3.56mm | 20.955mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA040T-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 11AA160-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 11AA160 | 8 | 5.5V | 2/5V | Serial | 16Kb 2K x 8 | 5mA | 100kHz | 5 ms | EEPROM | 单线 | 8 | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 1.1mm | 3mm | 3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39WF1601-70-4C-B3KE-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2005 | SST39 MPF™ | 活跃 | 3 (168 Hours) | 48 | 1.65V~1.95V | BOTTOM | 1.8V | 0.8mm | SST39WF1601 | 1.8V | 16Mb 1M x 16 | 10mA | 70ns | FLASH | Parallel | 16b | 1MX16 | 16 | 40μs | 20b | 16 Mb | 0.00004A | Asynchronous | 16b | YES | YES | YES | 512 | 2K | BOTTOM | YES | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C025AV-25AXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2003 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | FLOW-THROUGH | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 1MHz | 30 | CY7C025 | 100 | 3.3V | 3.6V | 3V | 128Kb 8K x 16 | 2 | 165mA | SRAM | Parallel | 8KX16 | 3-STATE | 25ns | 26b | 128 kb | 0.00005A | COMMON | Asynchronous | 16b | 2V | 1.4mm | 14mm | 14mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY62137EV30LL-45BVXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 48-VFBGA | 48 | Volatile | -40°C~85°C TA | Tray | 2001 | MoBL® | e1 | yes | 活跃 | 3 (168 Hours) | 48 | SMD/SMT | Tin/Silver/Copper (Sn/Ag/Cu) | 2.2V~3.6V | BOTTOM | 260 | 1 | 3V | 0.75mm | 1MHz | 30 | CY62137 | 48 | 3V | 3.6V | 2.2V | 2Mb 128K x 16 | 1 | 20mA | SRAM | Parallel | 3-STATE | 16 | 45ns | 17b | 2 Mb | 0.000003A | 45 ns | COMMON | Asynchronous | 16b | 1V | 8mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT49BV802D-70TU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | 48-TSOP | Non-Volatile | -40°C~85°C TC | Tray | 1997 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 2.65V~3.6V | AT49BV802 | Parallel | 3.6V | 2.65V | 8Mb 512K x 16 | 15mA | 70ns | FLASH | Parallel | 16b | 120μs | 8 Mb | Asynchronous | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25PF040CT-40I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.3V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | SST25PF040C | R-PDSO-G8 | 3.6V | 2.3V | 4Mb 512K x 8 | SYNCHRONOUS | 40MHz | 0.015mA | FLASH | SPI | 4MX1 | 1 | 5ms | 0.00001A | 4194304 bit | SERIAL | 3.3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | NO | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 34LC02-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Industrial grade | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.2V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 34LC02 | 8 | 5V | 2.2V | I2C, Serial | 2Kb 256 x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 1.5mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC76A-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC76A | 8 | 不合格 | 5V | Serial | 8Kb 1K x 8 | 3mA | SYNCHRONOUS | 3MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA64X-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2002 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 24AA64 | 8 | 5.5V | 2/5V | I2C, Serial | 64Kb 8K x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.1mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL032N11DFIV22 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 64-LBGA | 64 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | GL-N | 活跃 | 3 (168 Hours) | 64 | 3A991.B.1.A | 8542.32.00.51 | 1.65V~3.6V | BOTTOM | 1 | 3V | 1mm | 不合格 | 3V | 3.6V | 2.7V | 32Mb 4M x 8 2M x 16 | 50mA | FLASH | Parallel | 2MX16 | 16 | 110ns | 32 Mb | 0.000005A | 110 ns | Asynchronous | 3V | 8 | YES | YES | YES | 64 | 64K | 8/16words | YES | BOTTOM/TOP | YES | 1.4mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT29C040A-90JU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LCC (J-Lead) | 32 | 32-PLCC (13.97x11.43) | Non-Volatile | -40°C~85°C TC | Tube | 1997 | Obsolete | 2 (1 Year) | 85°C | -40°C | 4.5V~5.5V | 90GHz | AT29C040 | Parallel | 5.5V | 4.5V | 4Mb 512K x 8 | 90ns | FLASH | Parallel | 8b | 10ms | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C0853V-133BBXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 172-LFBGA | 172 | Volatile | -40°C~85°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 172 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 3.135V~3.465V | BOTTOM | 260 | 1 | 3.3V | 1mm | 40 | CY7C0853 | 172 | 3.3V | 3.465V | 3.135V | 9Mb 256K x 36 | 2 | 400mA | 133MHz | 4.7 ns | SRAM | Parallel | 3-STATE | 36 | 36b | 9 Mb | 0.075A | COMMON | Synchronous | 36b | 3.14V | 15mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M27C512-70XF1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 28-CDIP (0.600, 15.24mm) Window | 28 | Non-Volatile | 0°C~70°C TA | Tube | e0 | Obsolete | 1 (Unlimited) | 28 | EAR99 | 8542.32.00.61 | 4.75V~5.25V | DUAL | 1 | 5V | 2.54mm | 70GHz | M27C512 | 28 | 5V | 5V | 512Kb 64K x 8 | 50mA | 70ns | EPROM | Parallel | 64KX8 | 3-STATE | 512 kb | 0.0001A | COMMON | 4.5mm | 37.34mm | 13.36mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IS63WV1288DBLL-10HLI-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-LFSOP (0.465, 11.80mm Width) | YES | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 32 | 2.4V~3.6V | DUAL | 0.5mm | 不合格 | 2.5/3.3V | 1Mb 128K x 8 | SRAM | Parallel | 128KX8 | 3-STATE | 8 | 10ns | 0.000055A | 1048576 bit | 10 ns | COMMON | 2V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC28F640P30BF65A | Micron Technology Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 64-TBGA | YES | 64 | Non-Volatile | -40°C~85°C TA | Tray | 2009 | StrataFlash™ | Obsolete | 3 (168 Hours) | 64 | 1.7V~2V | BOTTOM | 1mm | 28F640P30 | 1.8V | 1.81.8/3.3V | 1.7V | Parallel, Serial | 64Mb 4M x 16 | 28mA | 52MHz | FLASH | Parallel | 4MX16 | 16 | 65ns | 22b | 64 Mb | 0.000055A | 65 ns | Asynchronous | 16b | NO | NO | 463 | 8words | BOTTOM | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC56CX-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2003 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93LC56C | 8 | 5.5V | 3/5V | 2.5V | Serial | 2Kb 256 x 8 128 x 16 | 2mA | 3MHz | 200 ns | EEPROM | SPI | 16 | 6ms | 2 kb | 0.000001A | MICROWIRE | 1000000 Write/Erase Cycles | 6ms | 200 | SOFTWARE | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25PF040C-40I/MF | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2015 | SST25 | e3 | 活跃 | 3 (168 Hours) | 8 | Matte Tin (Sn) - annealed | 2.3V~3.6V | DUAL | 1 | 3.3V | 1.27mm | SST25PF040C | 3.6V | 2.3V | SPI, Serial | 4Mb 512K x 8 | SYNCHRONOUS | 40MHz | 0.015mA | FLASH | SPI | 4MX1 | 1 | 5ms | 8 b | 0.00001A | 3.3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | NO | 6mm | 5mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL01GS10TFI020 | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2012 | GL-S | 活跃 | 3 (168 Hours) | 56 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3.6V | 3/3.3V | 2.7V | 1Gb 64M x 16 | 60mA | 100ns | FLASH | Parallel | 16b | 128MX8 | 8 | 60ns | 26b | 1 Gb | 0.0001A | Asynchronous | 16b | 3V | YES | YES | YES | 1K | 64K | 32B | YES | BOTTOM/TOP | YES | 1.2mm | 18.4mm | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | IS25LP080D-JBLE | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~105°C TA | Bulk | e3 | 活跃 | 3 (168 Hours) | 8 | Tin (Sn) | 2.3V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | S-PDSO-G8 | 3.6V | 2.3V | 8Mb 1M x 8 | SYNCHRONOUS | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 1MX8 | 8 | 800μs | 8388608 bit | SERIAL | 3V | 1 | 2.16mm | 5.28mm | 5.28mm | ROHS3 Compliant |