类别是'存储器'
存储器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 逻辑功能 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间（最大） | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 时间格式 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | I2C控制字节 | 顺序突发长度 | 访问模式 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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 | 93C86AT-E/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SOT-23-6 | 6 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2002 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | 4.5V~5.5V | DUAL | 260 | 1 | 5V | 0.95mm | 40 | 93C86A | 6 | 5V | 5V | Serial | 16Kb 2K x 8 | 3mA | 3MHz | 100 ns | EEPROM | SPI | 2KX8 | 8 | 2ms | 16 kb | 0.000005A | MICROWIRE | 1000000 Write/Erase Cycles | 2ms | 200 | SOFTWARE | 1.45mm | 2.95mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS62WV2568DBLL-45HLI | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-TFSOP (0.465, 11.80mm Width) | YES | 32 | Volatile | -40°C~85°C TA | Tray | 活跃 | 3 (168 Hours) | 32 | 2.5V~3.6V | DUAL | 1 | 3V | 0.5mm | 不合格 | 3.3V | 3.6V | 2.5V | 2Mb 256K x 8 | 1 | 15mA | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 45ns | 18b | 2 Mb | 45 ns | COMMON | Asynchronous | 8b | 1V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC04BHT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Automotive grade | Gold | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2002 | e3 | 活跃 | 1 (Unlimited) | 5 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 40 | 24LC04BH | 5 | 5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 4 kb | ISO/TS-16949 | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | YES | 16words | 1010XXMR | NO | 2.9mm | 1.6mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24AA64FT-I/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24AA64F | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC01BHT-I/OT | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | 活跃 | 1 (Unlimited) | 5 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 4.5V | 40 | 24LC01BH | 5 | 5V | 2-Wire, Serial | 1Kb 128 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 128X8 | 8 | 5ms | 1 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010XXXR | 2.9mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C02AN-10SU-2.7 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.7V~5.5V | 400kHz | AT24C02 | 5V | 2-Wire, Serial | 5.5V | 2.7V | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 5ms | 2 kb | 400kHz | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C11481KV18-400BZXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | Obsolete | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 1 | 1.8V | unknown | CY7C11481 | 165 | 不合格 | 1.8V | 18Mb 1M x 18 | 1 | 750mA | 400MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 19b | 18 Mb | 0.32A | COMMON | Synchronous | 18b | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | MT49H8M36FM-33:B | Micron | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | GRID ARRAY, THIN PROFILE | 8000000 | PLASTIC/EPOXY | BGA144,12X18,40/32 | 无 | MT49H8M36FM-33:B | 333 MHz | 8388608 words | 1.8 V | TBGA | RECTANGULAR | Micron Technology Inc | Obsolete | MICRON TECHNOLOGY INC | 5.71 | YES | 144 | UBGA-144 | 自动刷新 | DRAMs | CMOS | BOTTOM | BALL | 1 | 1 mm | unknown | R-PBGA-B144 | 不合格 | 1.9 V | 1.5/1.8,1.8,2.5 V | 1.7 V | 1 | SYNCHRONOUS | 0.565 mA | 8MX36 | 3-STATE | 1.2 mm | 36 | 301989888 bit | COMMON | DDR DRAM | 2,4,8 | 多库页面突发 | 18.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MX29LV320EBXEI-70G | Macronix | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-LFBGA, CSPBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | 2010 | MX29LV | e1 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 10 | 48 | R-PBGA-B48 | 不合格 | 3.6V | 3/3.3V | 2.7V | 32Mb 4M x 8 | ASYNCHRONOUS | FLASH | Parallel | 2MX16 | 16 | 70ns | 32 Mb | 0.000015A | 70 ns | 3V | 8 | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | YES | 1.3mm | 8mm | 6mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 25LC640AXT-I/ST | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | YES | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC640A | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 34AA02T-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 0.5mm | 40 | 34AA02 | 8 | 不合格 | 5V | 1.7V | I2C, Serial | 2Kb 256 x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 3mm | 2mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 25LC320T-E/SN | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | -40°C~125°C TA | Tape & Reel (TR) | 2002 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 25LC320 | 8 | 5.5V | 3/5V | 2.5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 2MHz | 230 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000001A | SPI | 100000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | IS63LV1024L-12JL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 32-BSOJ (0.300, 7.62mm Width) | 32 | Volatile | 0°C~70°C TA | Tube | e3 | yes | 最后一次购买 | 3 (168 Hours) | 32 | Matte Tin (Sn) - annealed | 3V~3.6V | DUAL | 1 | 3.3V | 32 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 1 | 130mA | SRAM | Parallel | 3-STATE | 12ns | 17b | 1 Mb | 83MHz | COMMON | Asynchronous | 8b | 2V | 2.67mm | 21.08mm | 7.75mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | W25X20CLSVIG | Winbond Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2016 | SpiFlash® | 活跃 | 3 (168 Hours) | 8 | EAR99 | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8542.32.00.51 | 2.3V~3.6V | DUAL | 1 | 3V | 1.27mm | 8 | R-PDSO-G8 | 不合格 | 3.6V | 2.5/3.3V | 2.7V | SPI, Serial | 2Mb 256K x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 2MX1 | 1 | 800μs | 0.000005A | 2097152 bit | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1mm | 4.9mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 24LC04BT-I/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 512 | PLASTIC/EPOXY | TSSOP8,.25 | -40 °C | 40 | 85 °C | 有 | 24LC04BT-I/STG | 0.4 MHz | 512 words | TSSOP | RECTANGULAR | Microchip Technology Inc | 活跃 | MICROCHIP TECHNOLOGY INC | 5.11 | SOIC | YES | 5 | TSSOP, TSSOP8,.25 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 512X8 | 1.2 mm | 8 | 0.000005 A | 4096 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXMR | NO | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CAT25640LI-G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | Gold | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2006 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 100 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 1 | 5V | 2.54mm | CAT25640 | 8 | 5V | SPI, Serial | 64Kb 8K x 8 | 3mA | 20MHz | 40 ns | EEPROM | SPI | 无卤素 | 5ms | 64 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE/SOFTWARE | 4.95mm | 10.16mm | 7.11mm | 无 | 无SVHC | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 24LC32AFT-I/MS | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Gold | 表面贴装 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) - annealed | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 24LC32AF | 8 | 不合格 | 5V | I2C, Serial | 32Kb 4K x 8 | 3mA | SYNCHRONOUS | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 32 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 100 | HARDWARE | 1010DDDR | 1.1mm | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AT24C32E-STUM-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | SOT-23-5 Thin, TSOT-23-5 | YES | Non-Volatile | -40°C~85°C TC | Cut Tape (CT) | 1997 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | Matte Tin (Sn) - annealed | ALSO OPERATES AT MIN 1.7 V AT 100 KHZ AND 400 KHZ | 1.7V~3.6V | DUAL | 260 | 1 | 3V | 0.95mm | 40 | AT24C32E | R-PDSO-G5 | 3.6V | 2.5V | 2-Wire, I2C, Serial | 32Kb 4K x 8 | SYNCHRONOUS | 1MHz | 450ns | EEPROM | I2C | 4KX8 | 8 | 5ms | 32768 bit | I2C | 5ms | 1mm | 2.9mm | 1.6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY14B104M-ZSP45XIT | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Tin | 表面贴装 | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | 54 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2012 | e3 | 活跃 | 3 (168 Hours) | 54 | 3A991.B.2.A | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B104 | 54 | 不合格 | 3.3V | 3.6V | 2.7V | 4Mb 256K x 16 | 52mA | ASYNCHRONOUS | Clock | NVSRAM | Parallel | 16b | 256KX16 | 16 | 45ns | 4 Mb | 0.005A | 45 ns | 16b | HH:MM:SS | 1.2mm | 22.415mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M95640-WMN6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | Tin/Lead (Sn/Pb) | 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION | 2.5V~5.5V | DUAL | 未说明 | 1 | 5V | 1.27mm | 未说明 | M95640 | 8 | 不合格 | 5.5V | 3/5V | 2.5V | SPI, Serial | 64Kb 8K x 8 | 4mA | SYNCHRONOUS | 20MHz | 10 ms | EEPROM | SPI | 3-STATE | 8 | 5ms | 64 kb | 0.000001A | 2.7V | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1.75mm | 4.9mm | 3.9mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1069G30-10ZSXI | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 54-TSOP (0.400, 10.16mm Width) | YES | Volatile | -40°C~85°C TA | Tray | 2012 | e3 | 活跃 | 3 (168 Hours) | 54 | 3A991.B.2.A | Tin (Sn) | 8542.32.00.41 | 2.2V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | R-PDSO-G54 | 3.6V | 2.2V | 16Mb 2M x 8 | SRAM | Parallel | 2MX8 | 8 | 10ns | 16777216 bit | 10 ns | 1.2mm | 22.415mm | 10.16mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BR25S640FJ-WE2 | ROHM Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2005 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.7V~5.5V | DUAL | 未说明 | 1 | 1.8V | 1.27mm | 未说明 | BR25S640 | 8 | 不合格 | 5.5V | 1.7V | SPI, Serial | 64Kb 8K x 8 | SYNCHRONOUS | 20MHz | EEPROM | SPI | 8 | 5ms | 64 kb | 0.000002A | SPI | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1.475mm | 4.9mm | 3.9mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 11AA161-I/P | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | Tin | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2009 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 5V | 2.54mm | 未说明 | 11AA161 | 8 | 不合格 | 5.5V | 2/5V | Serial | 16Kb 2K x 8 | 5mA | SYNCHRONOUS | 100kHz | EEPROM | 单线 | 8 | 5ms | 16 kb | 0.000005A | 1-WIRE | 1000000 Write/Erase Cycles | 10ms | 200 | SOFTWARE | 5.334mm | 9.271mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CY7C1021CV26-15ZSXET | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | Automotive grade | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | -40°C~125°C TA | Tape & Reel (TR) | 1996 | e4 | 活跃 | 3 (168 Hours) | 44 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~2.7V | DUAL | 260 | 1 | 2.6V | 0.8mm | 30 | CY7C1021 | 44 | 2.7V | 2.6V | 2.5V | 1Mb 64K x 16 | 1 | 80mA | SRAM | Parallel | 3-STATE | 16 | 15ns | 16b | 1 Mb | COMMON | Asynchronous | 16b | 2.5V | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SST39LF010-45-4C-MME | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 34-WFBGA | YES | 34 | Non-Volatile | 0°C~70°C TA | Tray | 2004 | SST39 MPF™ | e1 | yes | Obsolete | 3 (168 Hours) | 34 | 3A991.B.1.A | 锡银铜 | 8542.32.00.51 | 3V~3.6V | BOTTOM | 260 | 1 | 3.3V | 0.5mm | 40 | SST39LF010 | 34 | 3.3V | 3.6V | 3V | 1Mb 128K x 8 | 20mA | 45ns | FLASH | Parallel | 8b | 128KX8 | 8 | 20μs | 17b | 1 Mb | 0.000015A | Asynchronous | 8b | 3V | YES | YES | YES | 32 | 4K | 0.73mm | 6mm | 无 | ROHS3 Compliant |