类别是'评估板 - 嵌入式 - 复杂逻辑器件(FPGA, CPLD)'
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 引脚数 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 筛选水平 | 速度等级 | 输出功能 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||
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![]() | XCV600E-6HQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | XILINX INC | QFP | HLFQFP, HQFP240,1.37SQ,20 | 5.53 | 3 | PLASTIC/EPOXY | HLFQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 240 | XCV600E-6HQG240I | e3 | Matte Tin (Sn) | QUAD | 鸥翼 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 现场可编程门阵列 | 15552 | ||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-7FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | FBGA-456 | 5.8 | 400 MHz | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | 456 | XCV300E-7FGG456I | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 456 | S-PBGA-B456 | 312 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | 16 kB | 312 | 1536 CLBS, 82944 GATES | 2.6 mm | 现场可编程门阵列 | 7 | 0.42 ns | 1536 | 6912 | 82944 | 23 mm | 23 mm | 无 | |||||||||||||||
![]() | XCS30XL-3BGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.82 | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | 256 | XCS30XL-3BGG256I | e1 | 有 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | 576 CLBS, 10000 GATES | 3.5 mm | 现场可编程门阵列 | 576 | 10000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
![]() | XC3142A-3PP132C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 无 | Obsolete | XILINX INC | PGA | PGA, PGA132,14X14 | 8.73 | 270 MHz | 1 | 85 °C | PLASTIC/EPOXY | PGA | PGA132,14X14 | SQUARE | 网格排列 | 5.25 V | 5 V | 未说明 | 4.75 V | 132 | XC3142A-3PP132C | TYP. GATES = 2000-3000 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 225 | 2.54 mm | unknown | 132 | S-PPGA-P132 | 96 | 不合格 | 5 V | OTHER | 96 | 144 CLBS, 2000 GATES | 4.191 mm | 现场可编程门阵列 | 2.7 ns | 144 | 144 | 2000 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||
![]() | XCV1000-4BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.8 | 250 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | 560 | XCV1000-4BGG560I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | 6144 CLBS, 1124022 GATES | 1.7 mm | 现场可编程门阵列 | 0.8 ns | 6144 | 1124022 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||
![]() | XC6VSX475T-3FFG1759C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | XILINX INC | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | 5.27 | 4 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | 1759 | XC6VSX475T-3FFG1759C | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | S-PBGA-B1759 | OTHER | 37200 CLBS | 3.5 mm | 现场可编程门阵列 | 0.59 ns | 37200 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||
![]() | XC3190A-1TQ144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | PLASTIC, TQFP-144 | 5.8 | 323 MHz | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | 144 | XC3190A-1TQ144C | e0 | 无 | Tin/Lead (Sn85Pb15) | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | not_compliant | 144 | S-PQFP-G144 | 122 | 不合格 | 5 V | OTHER | 122 | 320 CLBS, 5000 GATES | 1.6 mm | 现场可编程门阵列 | 1.75 ns | 320 | 320 | 5000 | 20 mm | 20 mm | ||||||||||||||||||||
![]() | XC4VFX140-11FFG1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | XILINX INC | BGA | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | 5.24 | 1205 MHz | 4 | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.14 V | 1760 | XC4VFX140-11FFG1760I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 896 | 不合格 | 1.2,1.2/3.3,2.5 V | 896 | 15792 CLBS | 3.5 mm | 现场可编程门阵列 | 15792 | 142128 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||
![]() | XC3142A-4PG132B | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | XILINX INC | PGA | PGA, | 5.77 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 5 V | Military grade | 132 | XC3142A-4PG132B | 3A001.A.2.C | 3000 LOGIC GATES CAN ALSO BE USED | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | 不合格 | MILITARY | 144 CLBS, 2000 GATES | 4.318 mm | 现场可编程门阵列 | MIL-STD-883 Class B | 3.3 ns | 144 | 2000 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||
![]() | XC9536XV-7PCG44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | LCC | QCCJ, LDCC44,.7SQ | 5.66 | 3 | 34 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 2.62 V | 2.5 V | 40 | 2.37 V | 44 | XC9536XV-7PCG44I | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 34 I/O | 4.57 mm | 闪存 PLD | MACROCELL | 36 | YES | YES | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||
![]() | XC6VSX475T-2FF1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | 活跃 | XILINX INC | BGA | BGA, BGA1156,34X34,40 | 5.22 | 1286 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 未说明 | 0.95 V | 1156 | XC6VSX475T-2FF1156I | e0 | 无 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 1156 | S-PBGA-B1156 | 600 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 600 | 3.5 mm | 现场可编程门阵列 | 4.29 ns | 476160 | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | XC4044XLA-08BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.81 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | 432 | XC4044XLA-08BGG432C | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 80000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | OTHER | 1600 CLBS, 27000 GATES | 1.7 mm | 现场可编程门阵列 | 1 ns | 1600 | 27000 | 40 mm | 40 mm | ||||||||||||||||||||||||||
![]() | XC4044XLA-09HQG208I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.81 | 227 MHz | 3 | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | 208 | XC4044XLA-09HQG208I | e3 | Matte Tin (Sn) | CAN ALSO USE 80000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 208 | S-PQFP-G208 | 不合格 | 1600 CLBS, 27000 GATES | 4.1 mm | 现场可编程门阵列 | 1.1 ns | 1600 | 27000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
![]() | XC2V4000-6FFG1152I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | 35 X 35 MM, 1 MM PITCH, MS-034AAR-1, FLIP CHIP, FBGA-1152 | 5.8 | 820 MHz | 4 | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | 1.425 V | 1152 | XC2V4000-6FFG1152I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 824 | 不合格 | 1.5,1.5/3.3,3.3 V | 824 | 5760 CLBS, 4000000 GATES | 3.4 mm | 现场可编程门阵列 | 0.35 ns | 5760 | 51840 | 4000000 | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | XC4062XLA-08HQG304I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | QFP | HFQFP, | 5.81 | 263 MHz | PLASTIC/EPOXY | HFQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | 3.6 V | 3.3 V | 3 V | 304 | XC4062XLA-08HQG304I | CAN ALSO USE 130000 GATES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | compliant | 304 | S-PQFP-G304 | 不合格 | 2304 CLBS, 40000 GATES | 4.5 mm | 现场可编程门阵列 | 1 ns | 2304 | 40000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||
![]() | XC4085XLA-08BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.82 | 263 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 30 | 3 V | 560 | XC4085XLA-08BGG560I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 180000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | 3136 CLBS, 55000 GATES | 1.7 mm | 现场可编程门阵列 | 1 ns | 3136 | 55000 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||
![]() | XC7451ARX700RE | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Transferred | FREESCALE SEMICONDUCTOR INC | , | 5.8 | XC7451ARX700RE | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7K325T-2FFG900E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | 活跃 | XILINX INC | BGA | LEAD FREE, FBGA-900 | 5.76 | 4 | PLASTIC/EPOXY | 网格排列 | 30 | 900 | XC7K325T-2FFG900E | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | not_compliant | 900 | 不合格 | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600-6BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.8 | 333 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | 432 | XCV600-6BGG432C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 不合格 | OTHER | 3456 CLBS, 661111 GATES | 1.7 mm | 现场可编程门阵列 | 0.6 ns | 3456 | 661111 | 40 mm | 40 mm | |||||||||||||||||||||||||
![]() | XC2S300E-7FTG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LEAD FREE, FBGA-256 | 5.79 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | 256 | 256 | XC2S300E-7FTG256C | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85 °C | 0 °C | MAXIMUM USABLE GATES = 300000 | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 256 | S-PBGA-B256 | 329 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 8 kB | 329 | 1536 CLBS, 93000 GATES | 2 mm | 现场可编程门阵列 | 7 | 0.42 ns | 1536 | 6912 | 93000 | 17 mm | 17 mm | 无 | |||||||||||
![]() | XC5204-4PQ160C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | QFP, QFP160,1.2SQ | 5.81 | 83 MHz | 3 | 85 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 5.25 V | 5 V | 30 | Compliant | 4.75 V | 160 | 160 | XC5204-4PQ160C | e0 | 无 | Tin/Lead (Sn85Pb15) | 85 °C | 0 °C | MAX AVAILABLE 6000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.65 mm | not_compliant | 160 | S-PQFP-G160 | 124 | 不合格 | 5 V | 5 V | OTHER | 124 | 120 CLBS, 4000 GATES | 4.1 mm | 现场可编程门阵列 | 4 | 480 | 3.8 ns | 120 | 120 | 4000 | 28 mm | 28 mm | 无 | ||||||||||||
![]() | XC4062XLA-08BGG352I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.79 | 263 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 3.6 V | 3.3 V | 40 | 3 V | 352 | XC4062XLA-08BGG352I | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | 2304 CLBS, 40000 GATES | 1.7 mm | 现场可编程门阵列 | 1 ns | 2304 | 40000 | 35 mm | 35 mm | ||||||||||||||||||||||||||||
![]() | XC2VP30-7FFG1152I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | BGA | 1 MM PITCH, FLIP CHIP, FBGA-1152 | 5.81 | 1350 MHz | 4 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 30 | 1.5 V | 1.575 V | 1.425 V | 1152 | XC2VP30-7FFG1152I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 不合格 | 3424 CLBS | 3.4 mm | 现场可编程门阵列 | 0.28 ns | 3424 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | XC5202-3VQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 无 | Obsolete | XILINX INC | QFP | PLASTIC, VQFP-100 | 5.81 | 83 MHz | 3 | 85 °C | PLASTIC/EPOXY | TFQFP | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 5.25 V | 5 V | 30 | Compliant | 4.75 V | 100 | 100 | XC5202-3VQ100C | e0 | 无 | EAR99 | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | MAX AVAILABLE 3000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 84 | 不合格 | 5 V | 5 V | OTHER | 84 | 64 CLBS, 2000 GATES | 1.2 mm | 现场可编程门阵列 | 3 | 256 | 3 ns | 64 | 64 | 2000 | 14 mm | 14 mm | 无 | |||||||||||
![]() | XCS05XL-3PCG84C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 有 | Obsolete | XILINX INC | LCC | QCCJ, | 5.81 | 3 | 85 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 3.6 V | 3.3 V | 30 | 3 V | 84 | XCS05XL-3PCG84C | e3 | 有 | Matte Tin (Sn) | QUAD | J BEND | 245 | 1.27 mm | compliant | 84 | S-PQCC-J84 | 不合格 | OTHER | 100 CLBS, 2000 GATES | 5.08 mm | 现场可编程门阵列 | 100 | 2000 | 29.3116 mm | 29.3116 mm |