类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 功率(瓦特) | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 电路数量 | 工作电源电流 | 电源电流 | 电源电流-最大值 | 电流源 | 逻辑功能 | 通信IC类型 | 消费者集成电路类型 | D/A转换器数量 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
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![]() | XRT86VL38IB484 | Exar Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | BGA | e0 | no | 484 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 | 1.8V | 1mm | 未说明 | 484 | 不合格 | 1.83.3V | INDUSTRIAL | FRAMER | 2.08mm | 23mm | 23mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||||||||||||||||||||||
![]() | BCM56445XB0KFSBLG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI32177-B-GM | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 42-WFQFN Exposed Pad | 32 | -40°C~85°C | Tray | 2000 | ProSLIC® | Obsolete | 3 (168 Hours) | 3.3V | 3.3V | 0.5mm | SI3217 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 1 | 电信电路 | 0.7mm | 7mm | 5mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
![]() | SI3205-D-GSR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.154, 3.90mm Width) | Tape & Reel (TR) | 2015 | ProSLIC® | Obsolete | 3 (168 Hours) | 3.3V | SI3205 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 4 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI3225-BQ | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | -40°C~85°C | Tray | 1998 | ProSLIC® | Obsolete | 3 (168 Hours) | 64 | 941mW | 3.3V 5V | QUAD | 鸥翼 | 3.3V | 0.5mm | SI3225 | Subscriber Line Interface Concept (SLIC), CODEC | 不合格 | GCI, PCM, SPI | 2 | 65mA | 22mA | 10mm | 10mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||
![]() | 82V2048SDA | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 3.13V~3.47V | IDT82V2048 | Line Interface Unit (LIU) | LIU | 55mA | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI3225-G-FQ | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-TQFP | 252.254057mg | 0°C~70°C | Tray | 2015 | ProSLIC® | yes | Obsolete | 3 (168 Hours) | 64 | 941mW | 3.3V 5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3225 | S-PQFP-G64 | Subscriber Line Interface Concept (SLIC), CODEC | 不合格 | GCI, PCM, SPI | 2 | 65mA | 10mm | 10mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | SI3225-G-GQR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-TQFP | -40°C~85°C | Tape & Reel (TR) | 2001 | ProSLIC® | Obsolete | 3 (168 Hours) | 941mW | 3.3V 5V | SI3225 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 2 | 65mA | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA18267HB/C1E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M-8888-01T | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20-SOIC | -40°C~85°C | Tape & Reel (TR) | 2001 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 78.75mW | 78.75mW | 4.75V~5.25V | DTMF 收发器 | 1 | 10mA | 10mA | 收发器 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SI3232-G-GQ | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 64-TQFP | 64 | 252.254057mg | -40°C~85°C | Tray | 1998 | e3 | yes | Obsolete | 3 (168 Hours) | 64 | Matte Tin (Sn) | 280mW | 3.13V~3.47V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SI3232 | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | ISDN | 2 | 28mA | 28mA | 10mm | 10mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
![]() | SI3019-C-FT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 0°C~70°C | Tube | 1999 | yes | Obsolete | 1 (Unlimited) | 16 | 3V~3.6V | DUAL | 鸥翼 | 未说明 | 0.65mm | 未说明 | SI3019 | Direct Access Arrangement (DAA) | 不合格 | 3.6V | 3V | GCI, PCM, SPI | 1 | 8.5mA | 消费电路 | 5mm | 4.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
![]() | 82V2054DAG | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | Industrial grade | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 3.13V~3.47V | IDT82V2054 | Line Interface Unit (LIU) | Logic | 15mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 82P2816ABBG | Renesas Electronics America Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 416-BGA | Industrial grade | -40°C~85°C | Tray | 活跃 | 3 (168 Hours) | 3.3V | Line Interface Unit (LIU) | Parallel, Serial | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI3206-B-GQR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 48-TQFP | Tape & Reel (TR) | 2014 | ProSLIC® | Obsolete | 3 (168 Hours) | 3.3V | SI3206 | Subscriber Line Interface Concept (SLIC), CODEC | GCI, PCM, SPI | 4 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SI32177-B-FMR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 42-WFQFN Exposed Pad | 42 | 0°C~70°C | Tape & Reel (TR) | 2000 | ProSLIC® | Obsolete | 3 (168 Hours) | Subscriber Line Interface Concept (SLIC), CODEC | 3.3V | GCI, PCM, SPI | 1 | 电信电路 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8870DE1-1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 通孔 | 通孔 | 18-DIP (0.300, 7.62mm) | 18 | -40°C~85°C | Tube | 1997 | e3 | yes | Obsolete | 1 (Unlimited) | 18 | EAR99 | 哑光锡 | 4.75V~5.25V | DUAL | 260 | 5V | 2.54mm | 3.58MHz | 30 | DTMF接收器 | 5V | 5V | 1 | 3mA | 9mA | Receiver | DTMF信号电路 | 5.33mm | 22.86mm | 7.62mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | MT8965AE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 18-DIP (0.300, 7.62mm) | 18 | 0°C~70°C | Tube | yes | Obsolete | 1 (Unlimited) | 18 | 4.75V~5.25V | DUAL | 5V | 2.54mm | PCM 编解码器 | 5V | PCM | 3mA | 0.004mA | 1 | YES | A-LAW | -5V | 0.25dB | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | ZL49010DAA1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | -40°C~85°C | Tube | 2007 | e3 | Obsolete | 1 (Unlimited) | 8 | 哑光锡 | 4.75V~5.25V | DUAL | 5V | 2.54mm | 3.579MHz | DTMF接收器 | 5V | 5V | 1 | 3mA | Receiver | DTMF信号电路 | 5.33mm | 9.59mm | 7.62mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | MT88L85AE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | 通孔 | 24-DIP (0.300, 7.62mm) | 24 | -40°C~85°C | Tube | 2006 | e3 | yes | Obsolete | 1 (Unlimited) | 24 | 哑光锡 | 2.7V~3.6V | DUAL | 3V | 2.54mm | 3.58MHz | DTMF 收发器 | 3V | 1 | 3.1mA | 收发器 | DTMF信号电路 | 5.334mm | 7.62mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
![]() | ZL49031DDF1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | -40°C~85°C | Tape & Reel (TR) | 2007 | e3 | Obsolete | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 5V | 0.65mm | 3.579MHz | DTMF接收器 | 5V | 5V | 1 | 3mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
![]() | ZL50057GAG2 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | -40°C~85°C | Tray | Obsolete | 1 (Unlimited) | 85°C | -40°C | 1.71V~1.89V | ZL50057 | Switch | 240mA | 240mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT3371BSR1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 18-SOIC (0.295, 7.50mm Width) | 18 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | Obsolete | 1 (Unlimited) | 18 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 260 | 5V | 4.19MHz | 30 | DTMF接收器 | 5V | 5V | Parallel | 1 | 3mA | 8mA | Receiver | DTMF信号电路 | 2.65mm | 7.5mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | ZL49031DDE1 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 20-SSOP (0.209, 5.30mm Width) | 20 | -40°C~85°C | Tube | 2007 | e3 | Obsolete | 3 (168 Hours) | 20 | 哑光锡 | 4.75V~5.25V | DUAL | 鸥翼 | 5V | 0.65mm | 3.579MHz | DTMF接收器 | 5V | 5V | 1 | 3mA | 8mA | Receiver | DTMF信号电路 | 2mm | 7.2mm | 5.3mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
![]() | BCM8707SBIFBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 2016 | 活跃 | 1 (Unlimited) | ROHS3 Compliant |