类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 长度 | 宽度 | ||||||||||||||
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![]() | NWK914SCGGH1N | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ZARLINK SEMICONDUCTOR INC | QFP, QFP52,.52SQ | 70 °C | PLASTIC/EPOXY | QFP | QFP52,.52SQ | SQUARE | FLATPACK | 5 V | 52 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.635 mm | unknown | S-PQFP-G52 | 不合格 | COMMERCIAL | 100000 Mbps | 以太网收发器 | 1 | |||||||||||||||||
![]() | SE5516A | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | SKYWORKS SOLUTIONS INC | LGA-24 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HLGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.3 V | 24 | 有 | 8542.39.00.01 | BOTTOM | BUTT | 240 | 1 | 0.5 mm | unknown | S-PBGA-B24 | INDUSTRIAL | 1.11 mm | 电信电路 | 4 mm | 4 mm | ||||||||||||||||
![]() | PBL3795 | Ericsson | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | RS8973EPFSE | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | PEB22617H | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | INTEL CORP | 2017-10-29 | Obsolete | compliant | 电路接口 | ||||||||||||||||||||||||||||||||||||||
![]() | MC14419 | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | MOTOROLA INC | DIP-16 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | 5 V | 16 | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-CDIP-T16 | 不合格 | INDUSTRIAL | 电话拨号电路 | ||||||||||||||||||||||
![]() | TMXF281553BAL3C | Legerity | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | RF9986 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RF MICRO DEVICES INC | SSOP | SSOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.6 V | 24 | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.635 mm | unknown | 24 | R-PDSO-G24 | 不合格 | INDUSTRIAL | 1.7475 mm | 射频和基带电路 | 8.6487 mm | 3.9 mm | |||||||||||||
![]() | KSZ8061RNDV | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | WQFN-32 | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 32 | 有 | e3 | EAR99 | 哑光锡 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N32 | INDUSTRIAL | 100000 Mbps | 0.9 mm | AEC-Q100; TS 16949 | 以太网收发器 | 1 | 5 mm | 5 mm | |||||||||||
![]() | QM48184SR | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QORVO INC | , | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | LCC24,.12X16,20 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.7 V | 24 | 有 | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PQCC-N24 | 0.715 mm | 无线局域网电路 | 1 | 4 mm | 3 mm | |||||||||||||||
![]() | MC145574PBR2 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | QT2025 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | APPLIED MICRO CIRCUITS CORP | , | Transferred | compliant | |||||||||||||||||||||||||||||||||||||||
![]() | QT2025 | MACOM | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | M/A-COM TECHNOLOGY SOLUTIONS INC | , | 活跃 | 8542.39.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||
![]() | BCM3140A1IQME | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SKY58095-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | SKYWORKS SOLUTIONS INC | 110 °C | -40 °C | VFLGA | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH | 3.4 V | 62 | 2019-11-01 | 有 | 8542.39.00.01 | BOTTOM | 无铅 | 未说明 | 1 | 0.44 mm | unknown | 未说明 | R-XBGA-N62 | 0.8 mm | 射频和基带电路 | 8.6 mm | 6.5 mm | ||||||||||||||||||
![]() | TH72005 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MELEXIS N V | QFN | HVSON, | 125 °C | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 10 | Obsolete | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||
![]() | STAC9204X5TAEB2XR | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | QFP | ROHS COMPLIANT, LQFP-48 | 3 | 70 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.3 V | 48 | 有 | e3 | EAR99 | Matte Tin (Sn) - annealed | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 30 | 48 | S-PQFP-G48 | 不合格 | COMMERCIAL | SYNCHRONOUS | 1.6 mm | PCM 编解码器 | YES | 7 mm | 7 mm | ||||||||
![]() | RFAC3612SR | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | QORVO INC | 2 X 2.50 MM, GREEN, PACKAGE-10 | 85 °C | -40 °C | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | 2.85 V | 10 | Obsolete | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | compliant | R-PBCC-B10 | INDUSTRIAL | 1.195 mm | 电信电路 | 2.5 mm | 2 mm | |||||||||||||||||||
![]() | TC35207P | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | 活跃 | TOSHIBA CORP | DIP | DIP, | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 24 | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-PDIP-T24 | 不合格 | 4.45 mm | 电话拨号电路 | 29.8 mm | 7.62 mm | ||||||||||||||||
![]() | TH72035 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | MELEXIS N V | QFN | HVSON, | 125 °C | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 10 | Obsolete | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||
![]() | S3053TT | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | APPLIED MICRO CIRCUITS CORP | QFP | HLQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | HLQFP | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE | 3.3 V | 52 | Obsolete | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | unknown | 52 | S-PQFP-G52 | 不合格 | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH MUX/DEMUX | 10 mm | 10 mm | ||||||||||||||||
![]() | TA31075AS | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | TOSHIBA CORP | SIP | SLIM, PLASTIC, SIP-9 | 70 °C | -30 °C | PLASTIC/EPOXY | SIP | RECTANGULAR | IN-LINE | 9 | 无 | SINGLE | THROUGH-HOLE | 240 | 1 | 2.54 mm | unknown | 未说明 | 9 | R-PSIP-T9 | 不合格 | OTHER | 5.7 mm | 电话铃声 | 22.8 mm | 2.8 mm | |||||||||||||||
![]() | SKY77611-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | SMI10022KCP | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | |||||||||||||||||||||||||||||||||||||||||||
![]() | TM266HVB1 | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | PULSE ELECTRONICS CORP | SOP, SOP16,.4 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3.3 V | 16 | 无 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | MILITARY | ATM/SONET/SDH TRANSCEIVER |