类别是'接口 - 电信'
接口 - 电信 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 线性编码 | 长度 | 宽度 | ||||||||||||||
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![]() | MC6860P | Motorola Mobility LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA INC | DIP | DIP, DIP24,.6 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 24 | 无 | e0 | 锡铅 | HALF DUPLEX; FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-PDIP-T24 | 不合格 | COMMERCIAL | 5.08 mm | MODEM | 31.75 mm | 15.24 mm | |||||||||||||||||
![]() | TCA3382A-DP | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | MOTOROLA INC | DIP, | 60 °C | -20 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 24 | Obsolete | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 5.08 mm | 电话语音电路 | 31.75 mm | 15.24 mm | ||||||||||||||||||||||||
![]() | PT8A976BW | Pericom Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | PERICOM TECHNOLOGY INC | SOP, SOP16,.25 | 40 °C | -10 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 4 V | 16 | Transferred | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | COMMERCIAL | 电信电路 | ||||||||||||||||||||||||||
![]() | LAN88730BM-C | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 活跃 | MICROCHIP TECHNOLOGY INC | HVQCCN, | 105 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | 32 | 有 | e3 | 哑光锡 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-PQCC-N32 | INDUSTRIAL | 0.9 mm | TS 16949 | 以太网收发器 | 5 mm | 5 mm | ||||||||||||||||||||
![]() | MSM7570-TS-K-01 | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | LAPIS SEMICONDUCTOR CO LTD | TSSOP, TSSOP32,.56,20 | 70 °C | -25 °C | PLASTIC/EPOXY | TSSOP | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 32 | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | R-PDSO-G32 | 不合格 | OTHER | 28 mA | PCM 编解码器 | YES | MU-LAW | 1.2 dB | 不提供 | |||||||||||||||||
![]() | RFFM4501FTR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | RF MICRO DEVICES INC | , | 85 °C | -20 °C | UNSPECIFIED | SQUARE | 微电子组件 | 3.3 V | 16 | Transferred | 5A991.G | 8517.62.00.50 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQMA-N16 | OTHER | 1.05 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | RFFM4501FTR7 | Qorvo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | QORVO INC | , | 85 °C | -20 °C | UNSPECIFIED | SQUARE | 微电子组件 | 3.3 V | 16 | Obsolete | 5A991.G | 8517.62.00.50 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQMA-N16 | OTHER | 1.05 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | AK26060002 | TXC Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RJG-LP11H | Methode Electronics Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | METHODE ELECTRONICS INC | 85 °C | -40 °C | UNSPECIFIED | RECTANGULAR | FIBER OPTIC | 3.3 V | 10 | 接触制造商 | 8542.39.00.01 | UNSPECIFIED | THROUGH-HOLE | 1 | unknown | R-XXFO-T10 | 不合格 | INDUSTRIAL | 电信电路 | |||||||||||||||||||||||||||||
![]() | MC1420232FU | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP44,.47SQ,32 | SQUARE | FLATPACK | 3.3 V | 44 | 活跃 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | compliant | S-PQFP-G44 | 不合格 | INDUSTRIAL | PCM 编解码器 | YES | A/MU-LAW | 1 dB | |||||||||||||||||||||||
![]() | QS6611TF | Quality Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | QUALITY SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | QFP | TQFP64,.47SQ | SQUARE | FLATPACK | 5 V | 64 | 无 | e0 | 锡铅 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | S-PQFP-G64 | 不合格 | COMMERCIAL | 120 mA | 100000 Mbps | 以太网收发器 | 1 | ||||||||||||||||||||||
![]() | SKY13730-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF7241 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | RF MICRO DEVICES INC | MODULE | , | 85 °C | -30 °C | UNSPECIFIED | SQUARE | 微电子组件 | 3.4 V | 10 | Transferred | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | 10 | S-XDMA-N10 | 不合格 | OTHER | 1.05 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||||
![]() | OQ2535HP | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | OQ2535HP | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | NXP SEMICONDUCTORS | QFP | HLFQFP, QFP100,.63SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | HLFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | 3.3 V | 100 | 无 | SDH; SONET | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | 100 | S-PQFP-G100 | 不合格 | INDUSTRIAL | 364 mA | 1.6 mm | ATM/SONET/SDH MUX/DEMUX | -4.5 V | 14 mm | 14 mm | ||||||||||||||||
![]() | SIW3500DIF1-T13 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | RF MICRO DEVICES INC | DIE | VFBGA, | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 94 | 有 | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 94 | S-PBGA-B94 | 不合格 | INDUSTRIAL | 0.415 mm | 电信电路 | 3.7 mm | 3.7 mm | |||||||||||||||||||
![]() | MC145611P | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP20,.3 | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 20 | 无 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | unknown | 未说明 | R-PDIP-T20 | 不合格 | 4.57 mm | 会议电路 | 26.415 mm | 7.62 mm | |||||||||||||||||||||
![]() | TCP-3068N-DT | onsemi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | ON SEMICONDUCTOR | VFBGA, | 567KE | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 12 | 有 | 有 | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | R-PBGA-B12 | OTHER | 0.611 mm | 电信电路 | 1.179 mm | 0.722 mm | |||||||||||||||||||||||
![]() | UM6551A | Unicorn Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | UNICORN MICROELECTRONICS CORP | , | Obsolete | unknown | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SM5172-M2 | SamHop Microelectronics Corp. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NO | SAMHOP MICROELECTRONICS CORP | DIP, DIP18(UNSPEC) | PLASTIC/EPOXY | DIP | DIP18(UNSPEC) | RECTANGULAR | IN-LINE | 18 | 接触制造商 | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T18 | 不合格 | 电信电路 | |||||||||||||||||||||||||||||||
![]() | CMX661D4 | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | CML MICROCIRCUITS LTD | SOIC | SOP, SOP16,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3 V | 16 | 有 | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 16 | R-PDSO-G16 | 不合格 | INDUSTRIAL | 2.5 mA | 2.67 mm | 音调解码电路 | 10.26 mm | 7.425 mm | |||||||||||||
![]() | TJA1054AU | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | NXP SEMICONDUCTORS | DIE | DIE, | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | 5 V | 15 | Obsolete | 8542.39.00.01 | UPPER | 无铅 | 1 | unknown | 15 | R-XUUC-N15 | 不合格 | 电路接口 | ||||||||||||||||||||||||||||
![]() | SY8705FCC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TEF8102 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | NXP SEMICONDUCTORS | , | 活跃 | unknown | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TISP6L7591DR | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | Obsolete | BOURNS INC | SOIC | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 8 | 无 | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 未说明 | 8 | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.905 mm |