类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 界面 | 内存大小 | uPs/uCs/外围ICs类型 | 数据率 | 使用的 IC/零件 | 议定书 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 消费者集成电路类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 固件版本 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | DP1203C4333LF | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 21 | -40°C~85°C | Tape & Reel (TR) | e3 | yes | Obsolete | 1 (Unlimited) | 21 | 哑光锡 | 8542.39.00.01 | 2.4V~3.6V | UNSPECIFIED | UNSPECIFIED | 未说明 | 1 | 3.3V | unknown | 433MHz | 未说明 | DP1203 | 21 | 不合格 | 152.3kbps | XE1203 | 电信电路 | 11dBm | General ISM < 1GHz | 不包括天线 | SPI | 14mA | 33mA~62mA | -111 dBm | 30.5mm | 18.5mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | BM64SPKS1MC1-00M2AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | NO | Automotive grade | -20°C~70°C | 活跃 | 1 (Unlimited) | 43 | 3.2V~4.2V | UNSPECIFIED | UNSPECIFIED | 1 | compliant | 2.4GHz | R-XXMA-X43 | 4.2V | 3.2V | 3Mbps | Bluetooth v5.0 | TS 16949 | 15dBm | Bluetooth | Integrated, Trace | 消费电路 | -90dBm | I2S, UART | 15mA | 8DPSK, DQPSK, GFSK | 2.5mm | 32mm | 15mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | 2609011181000 | Würth Elektronik | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 23-SMD Module | -40°C~85°C | Cut Tape (CT) | WIRL-PRO8 | 活跃 | 3 (168 Hours) | 2.2V~3.8V | 865MHz~870MHz | 128kB Flash 20kB RAM | 100Kbps | 14dBm | General ISM < 1GHz | Antenna Not Included, Castellation | -124dBm | UART | 8mA | 26mA | DSSS, FSK, GFSK, GMSK, MSK, OOK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | BGM13S22F512GA-V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | 蓝壁虎 | Discontinued | 6 (Time on Label) | 1.8V~3.8V | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | EFR32BG13 | Bluetooth v5.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -90.2dBm | I2C, I2S, IrDA, SPI, UART | 10.5mA | 8.9mA | GFSK | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
![]() | ATWINC3400-MR210CA122-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 36-SMD Module | YES | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 36 | SEATED HGT-CALCULATED | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.6V | 1.204mm | 2.4GHz | ATWINC3400 | R-XXMA-N36 | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 18.3dBm | WiFi | Integrated, Chip | -95dBm | I2C, SPI, UART | 63.9mA | 232mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 1.2.2 | 2.087mm | 22.428mm | 14.732mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | MGM12P02F1024GA-V1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Module | Strip | 活跃 | 3 (168 Hours) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 2608011024010 | Würth Elektronik | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 42 Weeks | 表面贴装 | 17-SMD Module | -40°C~85°C TA | Tape & Reel (TR) | Proteus-II | 活跃 | 3 (168 Hours) | 1.8V~3.6V | 2.402GHz~2.48GHz | 512kB Flash | 2Mbps | nRF52832 | Bluetooth v5.0 | -2dBm | Bluetooth | Integrated, Trace | -91dBm | UART | 5.4mA | 7.5mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | ADRV9009BBCZ-REEL | Analog Devices Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 196-LFBGA, CSPBGA | YES | -40°C~85°C | Tape & Reel (TR) | no | 活跃 | 3 (168 Hours) | 196 | 1.3V~1.8V | BOTTOM | BALL | 1 | 1.3V | 0.8mm | 75MHz~6GHz | 196 | S-PBGA-B196 | 12.3Gbps | 电信电路 | 9dBm | Cellular | JTAG, SPI | 1.27mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | DP1205C915 | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | e3 | yes | Obsolete | 1 (Unlimited) | 19 | 哑光锡 | 8542.39.00.01 | 2.4V~3.6V | UNSPECIFIED | UNSPECIFIED | 未说明 | 1 | 3.3V | unknown | 915MHz | 未说明 | DP1205 | 19 | R-XXMA-X19 | 不合格 | 152.3kbps | XE1205 | 电信电路 | 15dBm | General ISM < 1GHz | 不包括天线 | SPI | 14mA | 33mA~62mA | -118 dBm | 30.5mm | 18.5mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
![]() | DP1205C868 | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Bulk | e3 | yes | Obsolete | 1 (Unlimited) | 19 | 哑光锡 | 8542.39.00.01 | 2.4V~3.6V | UNSPECIFIED | UNSPECIFIED | 未说明 | 1 | 3.3V | 868MHz | 未说明 | DP1205 | 19 | R-XXMA-X19 | 不合格 | 152.3kbps | XE1205 | 电信电路 | 15dBm | General ISM < 1GHz | 不包括天线 | SPI | 14mA | 33mA~62mA | -118 dBm | 30.5mm | 18.5mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
![]() | DP1205C433LF | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 19 | -40°C~85°C | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 85°C | -40°C | 2.4V~3.6V | 433MHz | DP1205 | SPI | 152.3kbps | XE1205 | 15dBm | General ISM < 1GHz | 不包括天线 | -118dBm | SPI | 14mA | 33mA~62mA | -118 dBm | 30.5mm | 18.5mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||
![]() | DP1283C433 | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 36 | -40°C~85°C | Bulk | Obsolete | 1 (Unlimited) | 36 | 8542.39.00.01 | 2.4V | UNSPECIFIED | UNSPECIFIED | 1 | 3.3V | unknown | 433MHz | DP1283 | 36 | 不合格 | 152.3kbps | XE1283 | 电信电路 | 15dBm | General ISM < 1GHz | 不包括天线 | SPI | 14mA | 33mA~72mA | -113 dBm | 33.5mm | 23mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
![]() | MPCI-L210-03S | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 52-SMD Module | -40°C~85°C | Tray | MPCI-L2 | 活跃 | 1 (Unlimited) | 3.3V | 700MHz 850MHz 900MHz 1.7GHz 1.8GHz 1.9GHz 2.1GHz 2.6GHz | 150Mbps | LTE | Cellular | Antenna Not Included, Castellation | UART, USB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210PB1952-T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 28-SMD Module | YES | -40°C~85°C | Tape & Reel (TR) | SmartConnect | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 1.016mm | 2.4GHz | R-XXMA-N28 | 4MB Flash 128kB RAM | 网络控制器 | 72.2Mbps | ATWINC1500 | 802.11b/g/n | 19.5dBm | WiFi | Integrated, Trace | -98dBm | I2C, SPI, UART | 58.5mA | 244mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.5.2 | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | ENW-89837A5KF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 2.7V~3.6V | 未说明 | 2.4GHz | 未说明 | TC35661 | Bluetooth v4.2 | 电信电路 | 4dBm | Bluetooth | Integrated, Chip | -88dBm | UART | 62mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
![]() | ZM5202AH-CME3R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | Module | Cut Tape (CT) | Z-Wave® | 活跃 | 3 (168 Hours) | 2.3V~3.6V | unknown | 921MHz | 128kB Flash 16kB SRAM | 100Kbps | 3000 SERIES | 电信电路 | 4dBm | General ISM < 1GHz | -103dBm | SPI, UART, USB | 32mA | 41mA | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | BGM13S22F512GN-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 蓝壁虎 | Discontinued | 3 (168 Hours) | 1.8V~3.8V | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | EFR32BG13 | Bluetooth v5.0 | 电信电路 | 8dBm | Bluetooth | 不包括天线 | -90.2dBm | I2C, I2S, IrDA, SPI, UART | 10.5mA | 8.9mA | GFSK | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
![]() | BGM13S22F512GA-V2R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 蓝壁虎 | Discontinued | 3 (168 Hours) | 1.8V~3.8V | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | EFR32BG13 | Bluetooth v5.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -90.2dBm | I2C, I2S, IrDA, SPI, UART | 10.5mA | 8.9mA | GFSK | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
![]() | ENW-89841A3KF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | NO | -40°C~85°C | Tape & Reel (TR) | 2013 | PAN1322 | Obsolete | 3 (168 Hours) | 8542.39.00.01 | 2.7V~3.5V | UNSPECIFIED | UNSPECIFIED | 未说明 | 1 | unknown | 2.4GHz | 未说明 | R-XXSS-X | Bluetooth v2.1 + EDR | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -86dBm | 37mA | 40mA | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | CC-WMX-K77C-TE-1 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Bulk | ConnectCore® 6 | Discontinued | 1 (Unlimited) | 85°C | -40°C | 2.4GHz~2.48GHz 4.9GHz~5.8GHz | I2C, SPI, UART, USB | 4GB Flash 1GB DRAM | 150Mbps | 802.11a/b/g/n | 2dBm | WiFi | I2C, SPI, UART, USB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | RN4870-I/RM130 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 33-SMD Module | YES | Automotive grade | -40°C~85°C | 活跃 | 1 (Unlimited) | 33 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 1 | 3.3V | compliant | 2.4GHz | R-XXMA-N33 | 256kB Flash 32kB ROM 24kB SRAM | 10kbps | RN4870 | Bluetooth v5.0 | TS 16949 | 电信电路 | 0dBm | Bluetooth | Integrated, Chip | -90dBm | I2C, AIO, PIO, PWM, SPI, UART | 13mA | GFSK | 1.3.0 | 2.46mm | 22mm | 12mm | ||||||||||||||||||||||||||||
![]() | SC14WAMDECT SF01T | Dialog Semiconductor GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 88-SMD Module | NO | -40°C~85°C | Tray | 1997 | 活跃 | 3 (168 Hours) | 88 | 3.4V | UNSPECIFIED | UNSPECIFIED | 1 | 1.9GHz | R-XXMA-X88 | 3.45V | 2.1V | 20dBm | General ISM > 1GHZ | Integrated, Chip | 消费电路 | -93dBm | UART | 85mA | 200mA | 2.8mm | 19.6mm | 18mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | WT12-A-AI55C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | Strip | 活跃 | 3 (168 Hours) | BlueCore4 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATWINC1500-MR210UB1961 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 28-SMD Module | YES | Industrial grade | -40°C~85°C | SmartConnect | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | compliant | 2.4GHz | R-XXMA-N28 | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | ATWINC1500 | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Chip + U.FL | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.6.1 | 2.113mm | 21.72mm | 14.73mm | ||||||||||||||||||||||||||||
![]() | NL-SW-LTE-QBG96 | NimbeLink, LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 20-DIP Module | -40°C~85°C | Tube | Skywire® CAT M1/NBIOT | 活跃 | 1 (Unlimited) | 3.4V~4.3V | 700MHz 850MHz 900MHz 1.7GHz 1.8GHz 1.9GHz 2.1GHz | 300kbps | 4G LTE CAT M1/NB-IoT (Global), 2G Fallback | Cellular, Navigation | Antenna Not Included, U.FL | UART, USB |