制造商是'XMOS'
XMOS 嵌入式 - 微控制器
(343)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 电源电压 | 端子间距 | 频率 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 数据总线宽度 | 脉宽调制通道 | 数模转换器通道 | 定时器/计数器的数量 | 核心架构 | 片上程序 ROM 宽度 | 最高频率 | 边界扫描 | 速度等级 | 内存(字) | 只读存储器可编程性 | 总线兼容性 | 座位高度(最大) | 长度 | 宽度 | 达到SVHC | RoHS状态 | 无铅 | ||||
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![]() | XS1-L16A-128-QF124-C8 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 131072 | 128kB | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | YES | 124 | 84 | 0°C~70°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | 124 | 3A001.A.3 | 8542.31.00.01 | QUAD | 无铅 | 1V | 0.5mm | 1.05V | 0.95V | External | 128kB | 0.95V~3.6V | MICROCONTROLLER, RISC | XCore | 100MHz | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 32 | NO | NO | NO | NO | 8 | 800 MIPS | OTPROM | 1.11mm | 10mm | 10mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
![]() | XS1-U8A-64-FB96-C5 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | RAM | 38 | 64kB | 表面贴装 | 96-LFBGA | 96 | 96-FBGA (10x10) | A/D 4x12b | 0°C~70°C TA | Tray | 2005 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 500MHz | 1.05V | 950mV | Internal | 500MIPS | 64kB | 3V~3.6V | XCore | PWM | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | XCore | 500 MIPS | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
![]() | XS1-A16A-128-FB217-C10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 90 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | 0°C~70°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | Internal | 128kB | 0.90V~5.5V | XCore | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 1000 MIPS | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-64-TQ128-C5 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64kB | 表面贴装 | 128-TQFP Exposed Pad | 128 | 64 | 0°C~70°C TA | Tray | 1998 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | External | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | 500 MIPS | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L10A-128-QF124-C10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 128kB | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | 124 | 84 | 0°C~70°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | External | 8kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 10-Core | 128KB 32K x 32 | Configurable | 1000 MIPS | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L4A-64-TQ48-C4 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64kB | 表面贴装 | 48-TQFP Exposed Pad | YES | 48 | 28 | 0°C~70°C TA | Tray | 2005 | XS1 | yes | 活跃 | 3 (168 Hours) | 48 | 8542.39.00.01 | QUAD | 鸥翼 | 1V | 0.5mm | 400MHz | 1.05V | 0.95V | External | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 4-Core | 64KB 16K x 32 | Configurable | YES | 400 MIPS | 64000 | SPI, USB | 1.2mm | 7mm | 7mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | XS1-U10A-128-FB217-I10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 73 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | -40°C~85°C TA | Tray | 2014 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | Internal | 128kB | 3V~3.6V | XCore | SRAM | 32-Bit 10-Core | 128KB 32K x 32 | Configurable | 1000 MIPS | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | XU216-512-FB236-C20 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 104 | 表面贴装 | 236-LFBGA | 236 | 236-FBGA (10x10) | ROMless | 0°C~70°C TA | Tray | 2015 | XU | 活跃 | 3 (168 Hours) | 70°C | 0°C | USB | External | 2000MIPS | 512K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 16-Core | USB | XCore | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L16A-128-QF124-C10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 131072 | 128kB | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | YES | 124 | 84 | 0°C~70°C TA | Tray | 2005 | XS1 | 活跃 | 3 (168 Hours) | 124 | 3A001.A.3 | 8542.31.00.01 | QUAD | 无铅 | 1V | 0.5mm | 500MHz | 1.05V | 0.95V | External | 128kB | 0.95V~3.6V | MICROCONTROLLER, RISC | XCore | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 32 | NO | NO | NO | NO | 8 | 1000 MIPS | OTPROM | 1.11mm | 10mm | 10mm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||
![]() | XS1-L6A-64-TQ48-C5 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64kB | 表面贴装 | 48-TQFP Exposed Pad | 48 | 48-TQFP (7x7) | 28 | 0°C~70°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 500MHz | 1.05V | 950mV | External | 500MIPS | 8kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 6-Core | 64KB 16K x 32 | Configurable | 500 MIPS | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
![]() | XU208-128-TQ64-I10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 64-TQFP Exposed Pad | 33 | -40°C~85°C TA | Tray | 2015 | XU | 活跃 | 3 (168 Hours) | External | 1000MIPS | 128K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 8-Core | USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L16A-128-QF124-I8 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 131072 | 128kB | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | YES | 124 | 84 | -40°C~85°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 124 | 3A001.A.3 | 8542.31.00.01 | QUAD | 无铅 | 1V | 0.5mm | 1.05V | 0.95V | External | 128kB | 0.95V~3.6V | MICROCONTROLLER, RISC | XCore | 100MHz | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 32 | NO | NO | NO | NO | 8 | 800 MIPS | OTPROM | 1.11mm | 10mm | 10mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
![]() | XS1-L8A-64-TQ128-C4 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64 | 64kB | 表面贴装 | 128-TQFP Exposed Pad | 128 | 128-TQFP (14x14) | SRAM | 0°C~70°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | External | 400MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | XCore | 400 MIPS | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-64-LQ64-C5 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 36 | 64kB | 表面贴装 | 64-LQFP Exposed Pad | 64 | 64-LQFP (10x10) | SRAM | 0°C~70°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | External | 500MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | XCore | 500 MIPS | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-64-TQ48-C4 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64kB | 表面贴装 | 48-TQFP Exposed Pad | 48 | 28 | 0°C~70°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | External | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | 32b | 400MHz | 400 MIPS | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-64-TQ128-I5 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 128-TQFP Exposed Pad | 128 | 128-TQFP (14x14) | 64 | -40°C~85°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | 85°C | -40°C | External | 500MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | 500 MIPS | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L16A-128-QF124-I10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 131072 | 128kB | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | YES | 124 | 84 | -40°C~85°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 124 | 3A001.A.3 | 8542.31.00.01 | QUAD | 无铅 | 1V | 0.5mm | 1.05V | 0.95V | External | 128kB | 0.95V~3.6V | MICROCONTROLLER, RISC | XCore | 100MHz | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 32 | NO | NO | NO | NO | 8 | 1000 MIPS | OTPROM | 1.11mm | 10mm | 10mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||
![]() | XS1-L02A-QF124-C5-THS | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 84 | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | 124-QFN DualRow (10x10) | SRAM | 0°C~70°C TA | Tray | 2010 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | USB | External | 500MIPS | 128kB | 0.95V~3.6V | XCore | SRAM | 32-Bit Dual-Core | 128KB 32K x 32 | Configurable | XCore | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-A16A-128-FB217-C8 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 90 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | 0°C~70°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | Internal | 128kB | 0.90V~5.5V | XCore | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 800 MIPS | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-A16A-128-FB217-I8 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 90 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | -40°C~85°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | Internal | 128kB | 0.90V~5.5V | XCore | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 800 MIPS | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-A10A-128-FB217-I10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 90 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | -40°C~85°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | Internal | 128kB | 0.90V~5.5V | XCore | SRAM | 32-Bit 10-Core | 128KB 32K x 32 | Configurable | 1000 MIPS | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-U16A-128-FB217-C10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | RAM, SRAM | 73 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | 0°C~70°C TA | Tray | 2012 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | 5.5V | Internal | 128kB | 3V~3.6V | XCore | PWM | SRAM | 32-Bit 16-Core | 128KB 32K x 32 | Configurable | 1 | 1000 MIPS | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
![]() | XS1-U10A-128-FB217-C10 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 73 | 128kB | 表面贴装 | 217-LFBGA | 217 | A/D 8x12b | 0°C~70°C TA | Tray | 2014 | XS1 | 活跃 | 3 (168 Hours) | 500MHz | Internal | 128kB | 3V~3.6V | XCore | SRAM | 32-Bit 10-Core | 128KB 32K x 32 | Configurable | 1000 MIPS | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-128-QF124-C8 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 124-TFQFN Dual Rows, Exposed Pad | 124 | 124-QFN DualRow (10x10) | 84 | 0°C~70°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 70°C | 0°C | External | 800MIPS | 128kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 128KB 32K x 32 | Configurable | 800 MIPS | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | XS1-L8A-64-LQ64-I4 | XMOS | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 36 | 64kB | 表面贴装 | 64-LQFP Exposed Pad | 64 | 64-LQFP (10x10) | SRAM | -40°C~85°C TA | Tray | 2013 | XS1 | 活跃 | 3 (168 Hours) | 85°C | -40°C | External | 400MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 64KB 16K x 32 | Configurable | XCore | 400 MIPS | ROHS3 Compliant |