制造商是'Xilinx'
Xilinx 存储器 - 用于 FPGA 的配置 PROM
(261)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 可编程类型 | 界面 | 内存大小 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 组织结构 | 输出特性 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 访问时间（最大） | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 耐力 | 数据保持时间 | 最大结点温度（Tj） | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 页面尺寸 | 准备就绪/忙碌 | 环境温度范围高 | 通用闪存接口 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | XCF01SVO20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | -40°C~85°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 1.8/3.33V | 3V | 系统内可编程 | 1Mb | 1MX1 | 1 | 0.001A | 1048576 bit | SERIAL | 配置存储器 | 20 | 1.19mm | 6.5024mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
 | XC17S100AVO8C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | 0°C~70°C | Tube | 1999 | e0 | no | Obsolete | 1 (Unlimited) | 8 | EAR99 | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 1.27mm | 30 | XC17S100A | 8 | 3.3V | 3.6V | 3V | OTP | 3-STATE | 1 | 1 Mb | 0.001A | SERIAL | COMMON | 配置存储器 | 1.2mm | 4.9mm | 3.9mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||
| XCF02SVOG20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | XCF02SVOG20C | FLASH | -40°C~85°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 50MHz | 30 | XCF*S | 20 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel | 2Mb | SYNCHRONOUS | 2MX1 | 0.001A | SERIAL | 20 | 125°C | 85°C | 1.19mm | 6.5mm | 4.39mm | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
| XCF04SVO20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 20 | -40°C~85°C | Tube | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | 4Mb | 33MHz | 4MX1 | 1 | 0.001A | 4194304 bit | SERIAL | 配置存储器 | 1.19mm | 6.5024mm | 4.4mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||
 | XCF32PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH, PROM | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | SMD/SMT | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 30 | XCF*P | 48 | 不合格 | 2V | 1.5/3.31.8V | 1.65V | 系统内可编程 | Parallel, Serial | 32Mb | SYNCHRONOUS | 32MX1 | 33554432 bit | 20000 Write/Erase Cycles | 20 | 860μm | 9mm | 8mm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
| XCF08PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel, Serial | 8Mb | 8MX1 | 0.001A | 8388608 bit | 20000 Write/Erase Cycles | 860μm | 9mm | 8mm | 无 | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
 | XCF08PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | FLASH | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel | 8Mb | 8MX1 | 0.001A | 8388608 bit | SERIAL | 20000 Write/Erase Cycles | 85°C | 1.2mm | 12.1mm | 18.5mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
 | XC18V04VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TQFP | 44 | 0°C~70°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 30 | XC18V04 | 44 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | SYNCHRONOUS | 20MHz | 10 ns | 512KX8 | 4 Mb | 0.01A | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| XCF04SVOG20C | Xilinx Inc. | 数据表 | 5665 In Stock |
| 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | FLASH | -40°C~85°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 30 | XCF*S | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | 4Mb | 33MHz | 4MX1 | 0.001A | 4194304 bit | 20 | 1.04mm | 6.5mm | 4.39mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
| XC18V01VQ44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-TQFP | YES | 44 | 0°C~70°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | QUAD | 鸥翼 | 225 | 1 | 3.3V | 0.8mm | 30 | XC18V01 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 33MHz | 128KX8 | 8 | 1 Mb | 0.01A | 15 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1.2mm | 10mm | 10mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
| XCF16PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | YES | 48 | FLASH | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 50MHz | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel | 16Mb | 16MX1 | 1 | 16777216 bit | SERIAL | 20000 Write/Erase Cycles | 20 | 125°C | 85°C | 1.2mm | 18.45mm | 12mm | 无 | Unknown | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
| XCF32PVOG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFSOP (0.724, 18.40mm Width) | 48 | -40°C~85°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 48 | 3A991.B.1 | Matte Tin (Sn) | 8542.32.00.61 | 1.65V~2V | DUAL | 鸥翼 | 260 | 1 | 1.8V | 0.5mm | 30 | XCF*P | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | 32Mb | 32MX1 | 0.001A | 33554432 bit | SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1mm | 12.1mm | 18.5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
| XCF16PFSG48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | FLASH | -40°C~85°C | Tray | 1999 | e2 | yes | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 50MHz | 30 | XCF*P | 48 | 不合格 | 1.8V | 2V | 1.65V | 系统内可编程 | Parallel, Serial | 16Mb | SYNCHRONOUS | 16MX1 | 16777216 bit | 20000 Write/Erase Cycles | 20 | 860μm | 9mm | 8mm | Unknown | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | XCF128XFTG64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 64-TBGA | YES | 64 | FLASH | -40°C~85°C | Tray | 2005 | e1 | 活跃 | 3 (168 Hours) | 64 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V~2V | BOTTOM | BALL | 260 | 1 | 1.8V | 1mm | 50MHz | 30 | XCF128X | 64 | 2V | 1.81.8/3.3V | 1.7V | 系统内可编程 | 128Mb | 85 ns | 8MX16 | 16 | 0.000075A | 134217728 bit | PARALLEL | 1.8V | NO | NO | YES | 4127 | 4words | YES | YES | 1.2mm | 13mm | 10mm | 无 | Unknown | ROHS3 Compliant | |||||||||||||||||||||||||
 | XC18V04PCG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-LCC (J-Lead) | 44 | 0°C~70°C | Tray | 1998 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 3V~3.6V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | 30 | XC18V04 | 44 | 不合格 | 3.3V | 3.6V | 3V | 系统内可编程 | Parallel, Serial | SYNCHRONOUS | 20MHz | 10 ns | 512KX8 | 4 Mb | 0.01A | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 3.68mm | 16.66mm | 16.66mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| XC18V04PC44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | 0°C~70°C | Tube | 1998 | e0 | no | 活跃 | 3 (168 Hours) | 44 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | QUAD | J BEND | 225 | 1 | 3.3V | 1.27mm | 30 | XC18V04 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 20MHz | 512KX8 | 8 | 4 Mb | 0.01A | 20 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 4.572mm | 16.5862mm | 16.5862mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||
| XC18V02VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-TQFP | YES | 44 | 0°C~70°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 30 | XC18V02 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 20MHz | 256KX8 | 8 | 2 Mb | 0.01A | 20 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1.2mm | 10mm | 10mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
.png) | XCF128XFT64C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 64-TBGA | 64 | -40°C~85°C | Tray | 2007 | e0 | no | 活跃 | 3 (168 Hours) | 64 | EAR99 | Tin/Lead (Sn63Pb37) | 1.7V~2V | BOTTOM | BALL | 225 | 1 | 1.8V | 1mm | 30 | XCF128X | 64 | 2V | 1.81.8/3.3V | 1.7V | 系统内可编程 | 128Mb | 8MX16 | 16 | 0.000075A | 134217728 bit | 85 ns | PARALLEL | FLASH | 1.8V | NO | NO | YES | 4127 | 4words | YES | YES | 1.2mm | 13mm | 10mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| XC18V02PCG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | 0°C~70°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 3V~3.6V | QUAD | J BEND | 245 | 1 | 3.3V | 1.27mm | 30 | XC18V02 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 20MHz | 256KX8 | 8 | 2 Mb | 0.01A | 20 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 4.572mm | 16.5862mm | 16.5862mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | XC18V01SOG20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | 0°C~70°C | Tube | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 3V~3.6V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1.27mm | 30 | XC18V01 | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | 33MHz | 128KX8 | 8 | 1 Mb | 0.01A | 15 ns | PARALLEL/SERIAL | 配置存储器 | 20 | 2.6416mm | 12.827mm | 7.5184mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
| XC18V01VQG44C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-TQFP | YES | 44 | 0°C~70°C | Tray | 1999 | e3 | yes | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | 3V~3.6V | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.8mm | 30 | XC18V01 | 44 | 3.3V | 3.6V | 3V | 系统内可编程 | 33MHz | 128KX8 | 8 | 1 Mb | 0.01A | 15 ns | PARALLEL/SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1.2mm | 10mm | 10mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| XCF08PFS48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 48-TFBGA, CSPBGA | 48 | -40°C~85°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 1 | 1.8V | XCF08PFS48C | 48 | 1.8V | 2V | 1.65V | 系统内可编程 | 8Mb | 33MHz | 8MX1 | 0.001A | 8388608 bit | SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 860μm | 9mm | 8mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| XC18V01SO20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 20 | 0°C~70°C | Tube | 1998 | e0 | no | 活跃 | 1 (Unlimited) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 3V~3.6V | DUAL | 鸥翼 | 225 | 1 | 3.3V | 1.27mm | 30 | XC18V01 | 20 | 3.3V | 3.6V | 3V | 系统内可编程 | 33MHz | 128KX8 | 8 | 1 Mb | 0.01A | 15 ns | PARALLEL/SERIAL | 配置存储器 | 20 | 2.6416mm | 12.827mm | 7.5184mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||
| XCF32PFS48C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 48-TFBGA, CSPBGA | YES | 48 | -40°C~85°C | Tray | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 48 | EAR99 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL | 8542.32.00.51 | 1.65V~2V | BOTTOM | BALL | 未说明 | 1 | 1.8V | 0.8mm | not_compliant | 未说明 | XCF*P | 48 | 不合格 | 1.8V | 2V | 1.65V | 系统内可编程 | 32Mb | SYNCHRONOUS | 32MX1 | 1 | 33554432 bit | SERIAL | 配置存储器 | 20000 Write/Erase Cycles | 20 | 1.2mm | 9mm | 8mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||
 | XC1736EPC20C | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-LCC (J-Lead) | YES | 20 | 0°C~70°C | Tube | 2000 | e0 | Obsolete | 3 (168 Hours) | 20 | EAR99 | Tin/Lead (Sn85Pb15) | 用于存储赛灵思FPGAS的配置比特流 | 8542.32.00.61 | 4.75V~5.25V | QUAD | J BEND | 225 | 1 | 5V | 1.27mm | not_compliant | 30 | XC1736E | 20 | 不合格 | 5.25V | 5V | 4.75V | OTP | 36kb | SYNCHRONOUS | 10MHz | 0.01mA | 36288X1 | 3-STATE | 1 | 0.00005A | 36288 bit | SERIAL | COMMON | 配置存储器 | 4.572mm | 8.9662mm | 8.9662mm | Non-RoHS Compliant | 含铅 |