制造商是'Xilinx'
Xilinx 嵌入式 - 片上系统（SoC）
(1945)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 连接方式 | 建筑学 | 边界扫描 | 内存(字) | 主要属性 | 总线兼容性 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XC7Z100-2FF900I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 900-BBGA, FCBGA | 212 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | 活跃 | 4 (72 Hours) | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 444K Logic Cells | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | XCZU11EG-2FFVC1156I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
 | XCZU6CG-1FFVC900I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
 | XC7Z015-1CL485I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 130 | -40°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | no | 活跃 | 2A (4 Weeks) | 485 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B485 | 1.05V | 0.95V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | 1.6mm | 19mm | 19mm | Non-RoHS Compliant | |||||||
.png) | XCZU7EG-L2FFVF1517E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 464 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B1517 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||
 | XCZU4EG-L1SFVC784I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B784 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||
| XCZU5EV-1FBVB900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XAZU2EG-1SFVC784Q | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 128 | -40°C~125°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.85V | 0.8mm | 未说明 | S-PBGA-B784 | 500MHz, 1.2GHz | 1.2MB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 3.32mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||
| XCZU7EV-2FFVF1517I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1517-BBGA, FCBGA | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XCZU5EV-L2SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | 活跃 | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B784 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||
| XCZU5EV-3SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XCZU6EG-1FFVB1156I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | 328 | -40°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||
| XCZU6EG-L2FFVB1156E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B1156 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||
| XCZU5EG-2SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||
| XCZU5EG-L2SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B784 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||
| XCZU15EG-3FFVC900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XCZU5EG-L2FBVB900E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B900 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||
 | XC7Z014S-2CLG400I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 125 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | 活跃 | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1V | 0.8mm | 未说明 | S-PBGA-B400 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 65K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||
| XCZU6CG-2FFVB1156E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | 328 | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||
 | XCZU3EG-2SFVA625E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 625-BFBGA, FCBGA | 180 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||
| XCZU15EG-3FFVB1156E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | 328 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XCZU2EG-2SFVA625I | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 625 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.85V | 未说明 | R-PBGA-B625 | 0.876V | 0.825V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||
| XCZU7EG-L2FFVC1156E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 0.72V | 未说明 | R-PBGA-B1156 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||
| XCZU11EG-3FFVC1760E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 1760-BBGA, FCBGA | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||
| XCZU5EG-3SFVC784E | Xilinx Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | 活跃 | 4 (72 Hours) | 8542.31.00.01 | 未说明 | 未说明 | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant |