制造商是'NA'
NA 嵌入式 - 微处理器
(651)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 制造商包装标识符 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 数据总线宽度 | 定时器/计数器的数量 | 地址总线宽度 | 核心架构 | 片上程序 ROM 宽度 | 边界扫描 | 低功率模式 | 格式 | 速度等级 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 定时器数量 | 协处理器/DSP | 只读存储器可编程性 | 核数量 | 总线兼容性 | 桶式移位器 | 内部总线架构 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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 | AM3357BZCZA30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | Cache, RAM, ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | AM3357 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
 | OMAPL138EZCED4E | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 361-LFBGA | YES | 361 | -40°C~90°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.65mm | 456MHz | OMAPL138 | 361 | 微处理器电路 | ARM926EJ-S | ARM | 456 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.3mm | 13mm | 13mm | 890μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||
 | OMAP5910JGZG2 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 160kB | 表面贴装 | 289-TFBGA | 289 | 284.997756mg | FLASH | -40°C~85°C TC | Tray | OMAP-59xx | e0 | 活跃 | 4 (72 Hours) | 289 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.6V | 0.5mm | 150MHz | OMAP5910 | 289 | 1.6V | 1.675V | I2C, MMC, SDIO, UART, USB | 170mA | 32kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | 16 | 32b | 6 | 25 | 16 | YES | YES | 固定点 | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | Signal Processing; C55x, System Control; CP15 | MROM | NO | MULTIPLE | Keypad, LCD | 6 | 1.2mm | 12mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||
| AM3356BZCZD30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Copper, Silver, Tin | 324-LFBGA | YES | 324 | 1.713814g | L2 Cache, RAM, ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 300MHz | 未说明 | AM3356 | 不合格 | 1.1V | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.4mm | 15mm | 15mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | OMAP3515ECUS | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 6 days ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3515 | 423 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
 | AM5726BABCX | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | 760-BFBGA, FCBGA | YES | 760 | 0°C~90°C TJ | Tray | Sitara™ | e1 | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5726 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 浮点 | NO | 1.8V 3.3V | 10 | GbE | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | DSP, IPU, VPE | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | OMAPL137DZKBT3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 128kB | ACTIVE (Last Updated: 6 days ago) | Copper, Silver, Tin | 表面贴装 | 256-BGA | 256 | Cache, FLASH | -40°C~125°C TJ | Tray | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 375MHz | OMAPL137 | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | 32kB | DIGITAL SIGNAL PROCESSOR, OTHER | ARM926EJ-S | 16b | ARM | YES | YES | 浮点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, MMC/SD, SPI, UART | 3 | Signal Processing; C674x, System Control; CP15 | 1 | NO | SINGLE | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
| AM1808BZWT3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | AM1808BZWT3 | 0°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 375MHz | AM1808 | 361 | 1.32V | I2C, SPI, UART, USB | 1.35V | 950mV | 64kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 4 | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | SATA 3Gbps (1) | 16mm | 无SVHC | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||
| OMAP3503ECUS | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Commercial grade | ACTIVE (Last Updated: 5 days ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 600MHz | OMAP3503 | 423 | 1.8V | 1.35V | I2C, SPI, UART, USB | 1.89V | 1.71V | DIGITAL SIGNAL PROCESSOR, OTHER | ARM® Cortex®-A8 | 32b | ARM | YES | YES | 浮点 | YES | 64000 | 1.8V 3.0V | 3 | 1 Core 32-Bit | 无 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 15 | Multimedia; NEON™ SIMD | MROM | 1 | NO | SINGLE | LCD | 1.4mm | 16mm | 16mm | 960μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
| AM3715CUSD100 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 188 | 64kB | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 423-LFBGA, FCBGA | YES | 423 | ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 423 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 1GHz | AM3715 | 423 | 1.1V | 1.8V | I2C, MMC, SD, SPI, UART, USB | 1.5V | 1000 MHz | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 16 | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 有 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
| AM1707DZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 256-BGA | 256 | 2.784008g | L1 Cache, RAM, ROM | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 375MHz | AM1707 | 1.2V | Ethernet, I2C, SPI, UART, USB | 1.32V | 1.14V | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
| AM1806EZWTD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 8kB | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | AM1806 | I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | 1.4mm | 16mm | 16mm | 900μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
| AM5716AABCX | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 5 days ago) | 760-BFBGA, FCBGA | YES | 760 | Automotive grade | 0°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 760 | 5A992C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.15V | 0.8mm | AM5716 | 1.2V | 1.11V | 1.5GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 38.4MHz | YES | YES | 固定点 | NO | 1.8V 3.3V | 10 | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR3, SRAM | USB 2.0 (1), USB 3.0 (1) | CAN, EBI/EMI, HDQ/1-Wire®, I²C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART | Multimedia; GPU, IPU, VFP | SATA 3Gbps (1) | 2.96mm | 23mm | 23mm | 2.39mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | AM3352ZCED50 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | Copper, Silver, Tin | 298-LFBGA | YES | 298 | ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | Obsolete | 3 (168 Hours) | 298 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 500MHz | AM3352 | 298 | 1.1V | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 28 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | Cryptography, Random Number Generator | LCD, Touchscreen | 1.3mm | 13mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
| AM1707DZKBD4 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Copper, Silver, Tin | 表面贴装 | 256-BGA | 256 | 2.784008g | L1 Cache, RAM, ROM | -40°C~90°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 456MHz | AM1707 | 1.3V | Ethernet, I2C, SPI, UART, USB | 1.35V | 1.25V | 128kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | 1 | LCD | 2.05mm | 17mm | 17mm | 1.36mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
| OMAP3530ECUS72 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 170 | 64kB | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 423-LFBGA, FCBGA | 423 | L2 Cache, ROM, SRAM | 0°C~90°C TJ | Tray | OMAP-35xx | e1 | 活跃 | 4 (72 Hours) | 423 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.65mm | 720MHz | OMAP3530 | 423 | 1.35V | I2C, SPI, UART, USB | 1.35V | 985mV | 112kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32b | ARM | 1.8V 3.0V | 3 | 1 Core 32-Bit | 有 | LPDDR | USB 1.x (3), USB 2.0 (1) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Signal Processing; C64x+, Multimedia; NEON™ SIMD | LCD | 1.4mm | 16mm | 16mm | 960μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | AM3703CBCA | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | NRND (Last Updated: 1 week ago) | Copper, Silver, Tin | 515-VFBGA, FCBGA | YES | 515 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 不用于新设计 | 3 (168 Hours) | 515 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.5mm | 800MHz | AM3703 | 515 | 1.1V | 1.8V | I2C, SPI, UART, USB | 1.5V | 32kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 16b | 16 | ARM | YES | YES | 浮点 | YES | 65536 | 4 | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (4) | HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | LCD | 950μm | 14mm | 14mm | 630μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
 | OMAP5910JZDY2 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Industrial grade | 160kB | 表面贴装 | 289-BGA | 289 | 1.241794g | FLASH | -40°C~85°C TC | Tube | OMAP-59xx | e1 | yes | 活跃 | 3 (168 Hours) | 289 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.6V | 1mm | 150MHz | OMAP5910 | 289 | 1.6V | 1.675V | I2C, MMC, SDIO, UART, USB | 170mA | 32kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM9TDMI | 16 | 32b | 6 | 25 | 16 | YES | YES | 固定点 | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | 无 | SDRAM | USB 2.0 (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART | Signal Processing; C55x, System Control; CP15 | MROM | NO | MULTIPLE | Keypad, LCD | 6 | 2.32mm | 19mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
| AM3352ZCE50 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64kB | Copper, Silver, Tin | 表面贴装 | 298-LFBGA | 298 | Cache, RAM, ROM | 0°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 298 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 0.65mm | 500MHz | AM3352 | 1.15V | CAN, Ethernet, I2C, SPI, UART, USB | 1.89V | 1.71V | 320kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 16 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 无 | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| AM1707BZKBA3 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8kB | 表面贴装 | 256-BGA | 256 | -40°C~105°C TJ | Tray | Sitara™ | e1 | no | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.2V | 0.5mm | 375MHz | AM1707 | 256 | 1.2V | 1.32V | I2C, SPI, UART | 1.32V | 1.14V | 16kB | ARM926EJ-S | 32 | 32b | 16 | RISC | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | I2C, McASP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 2.05mm | 17mm | ROHS3 Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||
 | AM4372BZDNA60 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | ACTIVE (Last Updated: 6 days ago) | 491-LFBGA | YES | 491 | -40°C~105°C TJ | Tray | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 491 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1.1V | 0.65mm | AM4372 | 1.144V | 1.056V | 600MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 26MHz | 32 | YES | YES | 浮点 | YES | 65536 | 1.8V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, HDQ/1-Wire, I2C, McASP, MMC/SD/SDIO, QSPI, SPI, SD/SDIO, UART | Multimedia; NEON™ SIMD | 加密加速器 | TSC, WXGA | 64 | 1.3mm | 17mm | 17mm | 900μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| AM3352BZCEA30 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 64kB | ACTIVE (Last Updated: 1 day ago) | Copper, Silver, Tin | 298-LFBGA | YES | 298 | ROM | -40°C~105°C TJ | Tube | Sitara™ | e1 | yes | 活跃 | 3 (168 Hours) | 298 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.1V | 300MHz | 未说明 | AM3352 | 不合格 | 1.144V | CAN, Ethernet, I2C, SPI, UART, USB | 1.144V | 912mV | 64kB | MICROPROCESSOR, RISC | ARM® Cortex®-A8 | 32 | 32b | 10 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 6 | 10/100/1000Mbps (2) | 1 Core 32-Bit | 有 | LPDDR, DDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | Multimedia; NEON™ SIMD | 1 | Cryptography, Random Number Generator | LCD, Touchscreen | 1.3mm | 13mm | 13mm | 890μm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||
.png) | AM5K2E02ABD25 | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | ACTIVE (Last Updated: 2 days ago) | 1089-BFBGA, FCBGA | YES | 1089 | 0°C~85°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.25GHz | AM5K2E02 | 1.05V | 0.95V | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 1GBE (8) | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 2 | 32 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| OMAP5912ZDY | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 250kB | Copper, Silver, Tin | 表面贴装 | 289-BGA | 289 | 1.241794g | FLASH | -40°C~85°C TC | Tube | OMAP-59xx | e1 | yes | 活跃 | 3 (168 Hours) | 289 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.6V | 1mm | 192MHz | OMAP5912 | 289 | 3.3V | 1.65V | I2C, MMC, SDIO, UART, USB | 326mA | 24kB | DIGITAL SIGNAL PROCESSOR, MIXED | ARM926EJ-S | 16 | 32b | 6 | 26 | ARM | YES | YES | 固定点 | YES | 1.8V 2.75V 3.3V | 1 Core 32-Bit | 无 | LPDDR | USB 1.1 (1), USB 1.x (2) | 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD/SDIO, SPI, UART | Signal Processing; C55x, System Control; CP15 | NO | MULTIPLE | Cryptography, Random Number Generator | Keyboard, LCD | 6 | 2.32mm | 19mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||
| OMAPL138EZWTA3R | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | 361-LFBGA | YES | 361 | -40°C~105°C TJ | Tape & Reel (TR) | OMAP-L1x | e1 | yes | 活跃 | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | 3pF | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 375MHz | OMAPL138 | 361 | 微处理器电路 | ARM926EJ-S | ARM | 375 MHz | 1.8V 3.3V | 3 | 10/100Mbps (1) | 1 Core 32-Bit | 无 | SDRAM | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | Signal Processing; C674x, System Control; CP15 | 1 | I2C; SPI; UART; USB | Boot Security, Cryptography | LCD | SATA 3Gbps (1) | 1.4mm | 16mm | 16mm | 900μm | ROHS3 Compliant | 无铅 |