制造商是'TDK'
TDK 模块化连接器 - 磁性插孔
(12)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 底架 | 安装类型 | 包装/外壳 | 房屋材料 | 屏蔽材料 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 连接器类型 | 最高工作温度 | 最小工作温度 | 应用 | 行数 | 方向 | 屏蔽/屏蔽 | 额定电流 | 触点表面处理 | 电感,电感 | 端口的数量 | 方向 | 发光二极管的颜色 | 接片方向 | 每个千斤顶的核数 | 特征 | 长度 | 宽度 | 触点表面处理厚度 | 板上高度 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | TLA-6T785 | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 用户可选 | 通孔 | 100 | -40°C~85°C | Tray | 2012 | TLA | Obsolete | 1 (Unlimited) | Solder | RJ45 | 85°C | -40°C | 10/100 Base-TX, AutoMDIX | 1 | Shielded | 8mA | 200 μH | 1 | Vertical | 不含LED | 用户可选 | 4 | 电路板指南 | 18.2mm | 16mm | 0.472 12.00mm | 符合RoHS标准 | 无铅 | ||||||
 | TLA-6T776F | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Up | 通孔 | 100 | -40°C~85°C | Tray | 2012 | TLA | Obsolete | 1 (Unlimited) | Solder | RJ45 | 85°C | -40°C | 10/100 Base-TX, AutoMDIX | 1 | Shielded, EMI Finger | 8mA | 200 μH | 1 | 90° Angle (Right) | 不含LED | Up | 4 | 板锁 | 13.85mm | 21.45mm | 0.545 13.84mm | 符合RoHS标准 | 无铅 | ||||||
 | B78477P1011A44 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 4 | 90° Angle (Right) | 不含LED | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1008A24 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 2 | 90° Angle (Right) | 不含LED | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1005A314 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | Green - Yellow | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1009A124 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 2 | 90° Angle (Right) | Yellow - Green | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1003A14 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | 不含LED | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1006A114 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | Yellow - Green | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1004A314 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | Green - Yellow | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1010A344 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 4 | 90° Angle (Right) | Green - Yellow | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1002A14 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | -40°C~85°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | 不含LED | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant | |||||||||||
| B78477P1007A114 | TDK Electronics Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | Thermoplastic | Copper Alloy | 磷青铜 | 0°C~70°C | Tray | 2014 | B78477P | Obsolete | 2 (1 Year) | Solder | RJ45 | 10/100 Base-T, AutoMDIX | 1 | Shielded, EMI Finger | Gold | 1 | 90° Angle (Right) | Yellow - Green | Down | 4 | 电路板指南 | 15.0μin 0.38μm | 0.541 13.75mm | ROHS3 Compliant |