制造商是'Qualcomm'
Qualcomm 谐振器
(92)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 零件状态 | 湿度敏感性等级(MSL) | 类型 | 电容量 | 频率 | 频率稳定性 | 阻抗 | 频率容差 | 特征 | 高度 | RoHS状态 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | B39391R882H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2007 | B39391 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 390MHz | 50Ohms | 0.057 1.45mm | |||||||
| B39321R805H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2007 | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 318MHz | 50Ohms | 0.057 1.45mm | |||||||
| B39311R884H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2004 | B39311 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 310MHz | 50Ohms | 0.057 1.45mm | |||||||
| B39321R883H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 315.15MHz | 50Ohms | 0.057 1.45mm | |||||||
| B39421R853H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2002 | B39421 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 423.22MHz | 50Ohms | 0.057 1.45mm | |||||||
 | B39301R734U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~120°C | Tape & Reel (TR) | B39301 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 304.325MHz | 50Ohms | 0.053 1.35mm | ||||||||
 | B39871R0858H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | B39871 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 868.35MHz | ±75kHz | 0.057 1.45mm | ||||||||
 | B39431R1903A310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 6-SMD, No Lead | -45°C~125°C | Tape & Reel (TR) | R1900 | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 433.92MHz | 26Ohms | 0.039 1.00mm | |||||||
| B39921R2906H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Cut Tape (CT) | 2014 | B39921 | 0.118Lx0.118W 3.00mmx3.00mm | Discontinued | 3 (168 Hours) | SAW | 915MHz | 无电容 | 0.039 1.00mm | ROHS3 Compliant | ||||||
 | B39321R903U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Cut Tape (CT) | B39321 | 0.118Lx0.118W 3.00mmx3.00mm | Discontinued | 1 (Unlimited) | SAW | 2.6pF | 315.5MHz | 50Ohms | 无电容 | 0.043 1.09mm | ROHS3 Compliant | |||||
| B39321R922H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | 2013 | R922 | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 321MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ||||||
| B39311R0966H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -45°C~125°C | Tape & Reel (TR) | R966 | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 314.9MHz | ±50ppm | 50Ohms | 0.039 1.00mm | |||||||
| B39871R0808H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | Tape & Reel (TR) | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 0.057 1.45mm | ||||||||||||
| B39321R951U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | |||||||||||||||||
| B39431R856H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 0.057 1.45mm | |||||||||||
| B39431R971H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 0.057 1.45mm | |||||||||||
| B39921R973H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | Tape & Reel (TR) | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 0.039 1.00mm |