制造商是'Qualcomm'
Qualcomm 谐振器
(92)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 零件状态 | 湿度敏感性等级(MSL) | 类型 | 最高工作温度 | 最小工作温度 | 电容量 | 频率 | 频率稳定性 | 阻抗 | 特征 | 高度 | 长度 | 宽度 | RoHS状态 | 无铅 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | B39431R0992H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | R992 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 433.94MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | |||||||||||
 | B39301R807H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39301 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 303.825MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
 | B39921R2706U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2011 | B39921 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 915MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39311R771U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 8-SMD | 8 | -45°C~120°C | Tape & Reel (TR) | 2005 | B39311 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 120°C | -45°C | 314.875MHz | 50Ohms | 0.053 1.35mm | 5.0038mm | 5.0038mm | 符合RoHS标准 | 无铅 | |||||
 | B39871R2711U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2005 | B39871 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 868.35MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39801R2712U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2005 | B39801 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 804.5MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39431R850H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 2.7pF | 433.94MHz | 50Ohms | 内置电容器 | 0.057 1.45mm | |||||||||||
| B39431R715U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2011 | B39431 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 433.32MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39431R800H210W3 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -45°C~125°C | Tape & Reel (TR) | 2011 | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 433.92MHz | 50Ohms | 0.057 1.45mm | |||||||||||||
| B39321R733U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~120°C | Tape & Reel (TR) | 2005 | B39321 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 315.03MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39431R770U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~120°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 2.4pF | 433.81MHz | 50Ohms | 内置电容器 | 0.053 1.35mm | |||||||||||
| B39301R852H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39301 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 304.3MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39311R2710U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2005 | B39311 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 1.8pF | 311.063MHz | 50Ohms | 内置电容器 | 0.053 1.35mm | |||||||||||
| B39321R851H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 315.02MHz | 50Ohms | 0.057 1.45mm | |||||||||||||
| B39431R806H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 2.4pF | 433.42MHz | 50Ohms | 内置电容器 | 0.057 1.45mm | |||||||||||
| B39301R2707U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2005 | B39301 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 303.825MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39401R724U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2011 | B39401 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 403.966MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39321R0822H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | 319.508MHz | 50Ohms | 0.057 1.45mm | ROHS3 Compliant | ||||||||||||
| B39311R854H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39311 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 314.5MHz | 50Ohms | 0.057 1.45mm | |||||||||||||
 | B39321R901U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Cut Tape (CT) | B39321 | 0.118Lx0.118W 3.00mmx3.00mm | Discontinued | 1 (Unlimited) | SAW | 3.3pF | 315MHz | 50Ohms | 无电容 | 0.043 1.09mm | ROHS3 Compliant | |||||||||||
| B39431R723U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 434.42MHz | 50Ohms | 0.053 1.35mm | |||||||||||||
| B39321R0821H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Cut Tape (CT) | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | Discontinued | 1 (Unlimited) | SAW | 2.8pF | 315MHz | 50Ohms | 无电容 | 0.057 1.45mm | ROHS3 Compliant | |||||||||||
| B39401R709U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | B39401 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 3.7pF | 403.55MHz | 50Ohms | 内置电容器 | 0.053 1.35mm | ||||||||||||
| B39871R804H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | B39871 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 868.35MHz | 50Ohms | 0.057 1.45mm | ||||||||||||||
| B39871R2709U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2011 | B39871 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 868.3MHz | 0.053 1.35mm |