制造商是'Qualcomm'
Qualcomm 谐振器
(92)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 零件状态 | 湿度敏感性等级(MSL) | 类型 | 电容量 | 频率 | 频率稳定性 | 阻抗 | 频率容差 | 特征 | 高度 | RoHS状态 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | B39321R0981U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | B39321 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 315MHz | 50Ohms | 0.043 1.09mm | ROHS3 Compliant | ||||||
 | B39421R714U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~120°C | Tape & Reel (TR) | 2011 | B39421 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 423.22MHz | 50Ohms | 0.053 1.35mm | |||||||
| B39421R2702U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~85°C | Tape & Reel (TR) | 2005 | B39421 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 418.05MHz | 50Ohms | 0.053 1.35mm | |||||||
 | B39321R1921A310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 6-SMD | -45°C~125°C | Tape & Reel (TR) | 2014 | R1921 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 315MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | ||||
| B39431R0860H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | 0.057 1.45mm | ROHS3 Compliant | ||||||||||
 | B39431R0904U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 433.42MHz | 50Ohms | 0.043 1.09mm | ROHS3 Compliant | ||||||
| B39431R0964H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 434.15MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | |||||
 | B39431R732U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 433.96MHz | 50Ohms | 0.053 1.35mm | |||||||
| B39321R2704U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2005 | B39321 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 315MHz | 50Ohms | 0.053 1.35mm | |||||||
| B39431R0900U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 433.92MHz | 50Ohms | ±75kHz | 0.043 1.09mm | ROHS3 Compliant | |||||
 | B39431R0960H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 433.92MHz | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | ||||||
| B39401R0983H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | Tape & Reel (TR) | B39401 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | 0.039 1.00mm | ROHS3 Compliant | ||||||||||
| B39431R0969H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 434.42MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | |||||
| B39431R0962H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 433.95MHz | 50Ohms | 0.039 1.00mm | ||||||||
| B39401R983U410 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -45°C~125°C | Tape & Reel (TR) | 2004 | B39401 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 403.55MHz | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | |||||
 | B39351R802H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | 2005 | B39351 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | 345MHz | 50Ohms | 0.057 1.45mm | ROHS3 Compliant | |||||
| B39122R0959H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | R959 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 1.176GHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant | |||||
| B39391R0972H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 6-SMD | -40°C~125°C | Tape & Reel (TR) | R972 | 0.118Lx0.118W 3.00mmx3.00mm | Obsolete | 1 (Unlimited) | SAW | 390MHz | ±50ppm | 50Ohms | 0.039 1.00mm | |||||||
| B39321R801H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -40°C~125°C | Tape & Reel (TR) | 2011 | B39321 | 0.197Lx0.138W 5.00mmx3.50mm | Obsolete | 1 (Unlimited) | SAW | 315MHz | 50Ohms | 0.057 1.45mm | |||||||
| B39431R0820H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | 433.92MHz | 50Ohms | 0.057 1.45mm | ROHS3 Compliant | ||||||
| B39431R2701U310 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-SMD | -45°C~125°C | Tape & Reel (TR) | 2005 | B39431 | 0.197Lx0.197W 5.00mmx5.00mm | Obsolete | 1 (Unlimited) | SAW | 2.3pF | 433.92MHz | 50Ohms | 内置电容器 | 0.053 1.35mm | |||||
| B39431R0880H210 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | 433.92MHz | 50Ohms | 0.057 1.45mm | ROHS3 Compliant | ||||||
| B39431R0990H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | 0.057 1.45mm | ROHS3 Compliant | |||||||||
| B39431R0970H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 4-SMD | -40°C~125°C | Tape & Reel (TR) | B39431 | 0.197Lx0.138W 5.00mmx3.50mm | 活跃 | 1 (Unlimited) | SAW | ±50ppm | 50Ohms | 0.057 1.45mm | ROHS3 Compliant | ||||||
| B39311R0994H110 | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 表面贴装 | 6-SMD | -45°C~125°C | Tape & Reel (TR) | R994 | 0.118Lx0.118W 3.00mmx3.00mm | 活跃 | 1 (Unlimited) | SAW | 314.9MHz | ±50ppm | 50Ohms | 0.039 1.00mm | ROHS3 Compliant |