制造商是'ON Semiconductor'
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图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | 包装方式 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出量 | 引脚数量 | 输出的数量 | 资历状况 | 工作电源电压 | 极性 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 电路数量 | 负载电容 | 电源电流 | 输出电流 | 最大电源电流 | 传播延迟 | 静态电流 | 接通延迟时间 | 家人 | 逻辑功能 | 数据率 | 最大输入电压 | 无卤素 | 输入 | 比率-输入:输出 | 差分 - 输入:输出 | Prop. Delay@Nom-Sup | 筛选水平 | 高电平输出电流 | 传播延迟(tpd) | 低水平输出电流 | 最大工作周期 | 施密特触发器 | 电源电流-最大值(ICC) | 输入电流 | fmax-Min | 同边偏斜-最大(tskwd) | 占空比 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||
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MC10EP11DR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 1 day ago) | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | 10EP | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Fanout Buffer (Distribution) | NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V | 3V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 40 | MC10EP11 | ECL, PECL | 8 | 4 | 5.5V | -3.0/-5.5/3.3V | 3V | 1 | 270 ps | 300 ps | 无卤素 | ECL, PECL | 1:2 | Yes/Yes | 0.32 ns | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||
NB6L14SMNTXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 21 hours ago) | Tin | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tape & Reel (TR) | 2009 | AnyLevel™ | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution), Translator | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~2.625V | QUAD | 260 | 1 | 2.5V | 0.5mm | 2GHz | 40 | NB6L14 | LVDS | 16 | 8 | 2.5V | 2.625V | 2.375V | 1 | 65mA | 600 ps | 65mA | 600 ps | 6L | 无卤素 | CML, HSCL, LVDS, LVPECL | 1:4 | Yes/Yes | 0.6 ns | 60 % | 0.2 ns | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||
NB6N14SMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 1 week ago) | Tin | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tube | 2006 | AnyLevel™ ECLinPS MAX™ | yes | 活跃 | 1 (Unlimited) | 16 | EAR99 | Fanout Buffer (Distribution), Translator | Nickel/Gold/Palladium (Ni/Au/Pd) | 3V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 2GHz | 40 | NB6N14S | LVDS | 16 | 8 | 3.3V | 3.6V | 3V | 1 | 65mA | 100mA | 600 ps | 600 ps | 6N | 无卤素 | CML, LVDS, LVPECL | 1:4 | Yes/Yes | 0.6 ns | 0.02 ns | 950μm | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||
NB6L11MMNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 4GHz | -40°C~85°C | Tape & Reel (TR) | 1997 | ECLinPS MAX™ | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~3.63V | QUAD | 260 | 1 | 2.5V | 0.5mm | 40 | NB6L11 | CML | 16 | 4 | 3.63V | +-2.5/+-3.3V | 2.375V | 1 | 325 ps | 325 ps | 6L | 无卤素 | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | 1:2 | Yes/Yes | 0.325 ns | 60 % | 60 % | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
NB6L14MNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 1 day ago) | Tin | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2008 | ECLinPS MAX™ | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Nickel/Gold/Palladium (Ni/Au/Pd) | IT ALSO OPERATES WITH 3.3V SUPPLY | 2.375V~3.63V | QUAD | 260 | 1 | 2.5V | 0.5mm | 40 | NB6L14 | LVCMOS, LVPECL | 16 | 8 | 3.63V | 2.5/3.3V | 2.375V | 1 | 500 ps | 65mA | 500 ps | 6L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:4 | Yes/Yes | 60 % | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
NB7L1008MMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tube | 2008 | GigaComm™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution) | Tin (Sn) | ALSO OPERATES AT 3.3V | 2.375V~3.6V | QUAD | 1 | 2.5V | 8GHz | NB7L1008M | CML | 32 | 16 | 2.625V | 2.5/3.3V | 2.375V | 1 | 315mA | 250 ps | 250 ps | 7L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:8 | Yes/Yes | 0.25 ns | 55 % | 0.025 ns | 55 % | 950μm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
MC100EP11DR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | ACTIVE (Last Updated: 6 days ago) | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | -40°C~85°C | Tape & Reel (TR) | 2000 | 100EP | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Fanout Buffer (Distribution) | NECL MODE: VCC=0 WITH VEE = -3.0V TO -5.5V | 3V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 3GHz | 40 | MC100EP11 | ECL, PECL | 8 | 4 | 5.5V | -3.0/-5.5V | 3V | 1 | 35mA | 270 ps | 300 ps | 无卤素 | ECL, PECL | 1:2 | Yes/Yes | 0.32 ns | 50 % | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
MC10LVEP11DR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 week ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2000 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Fanout Buffer (Distribution) | Tin (Sn) | 2.375V~3.8V | DUAL | 鸥翼 | 260 | 1 | 2.5V | 40 | MC10LVEP11 | ECL, PECL | 8 | 4 | 2.375V | 1 | 310 ps | 360 ps | 2.5V | 无卤素 | CML, LVDS, PECL | 1:2 | Yes/Yes | 0.36 ns | 0.02 ns | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
MC100EP210SFAR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 32-LQFP | 32 | -40°C~85°C | Tape & Reel (TR) | 2005 | 100EP | e3 | yes | 活跃 | 2 (1 Year) | 32 | EAR99 | Fanout Buffer (Distribution) | Tin (Sn) | 2.375V~2.625V | QUAD | 鸥翼 | 260 | 2 | 2.5V | 0.8mm | 1GHz | 40 | MC100EP210 | LVDS | 32 | 20 | 2.5V | 2 | 150mA | 650 ps | 675 ps | 无卤素 | LVDS, LVPECL | 1:5 | Yes/Yes | 0.675 ns | 1.6mm | 7mm | 7mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
MC100LVE111FNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | -40°C~85°C | Tube | 2006 | 100LVE | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | Tin (Sn) | NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V | 3V~3.8V | QUAD | J BEND | 260 | 1 | 3.3V | 1.5GHz | 40 | MC100LVE111 | ECL, PECL | 28 | 18 | 3.8V | +-3/+-3.8V | 3V | 1 | 700 ps | 700 ps | 2.42V | 无卤素 | ECL, PECL | 1:9 | Yes/Yes | 0.65 ns | 55mA | 0.05 ns | 4.57mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
MC100E111FNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 3 days ago) | Tin | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 800MHz | -40°C~85°C | Tape & Reel (TR) | 2006 | 100E | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution) | NECL MODE: VCC = 0 V WITH VEE = -4.2 V TO -5.7 V | 4.2V~5.7V | QUAD | J BEND | 260 | 1 | 5V | 40 | MC100E111 | ECL, PECL | 28 | 18 | 5.7V | -4.5V | 4.2V | 1 | 680 ps | 900 ps | 无卤素 | ECL, PECL | 1:9 | Yes/Yes | 0.68 ns | 0.05 ns | 4.57mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||
NB6L56MNTXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 2.5GHz | -40°C~85°C | Tape & Reel (TR) | 2006 | ECLinPS MAX™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution), Multiplexer, Data | Tin (Sn) | 2.375V~3.6V | QUAD | 2 | 2.5V | 0.5mm | NB6L56 | LVPECL | 32 | 2 | 85mA | 360 ps | 85mA | 400 ps | 6L | 无卤素 | CML, LVDS, LVPECL | 2:1 | Yes/Yes | 0.4 ns | 1mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
NBSG11MNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | LIFETIME (Last Updated: 5 days ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tube | 2005 | yes | 最后一次购买 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~3.465V | QUAD | 260 | 1 | 2.5V | 0.5mm | 12GHz | 40 | NBSG11 | RSECL, RSNECL, RSPECL | 16 | 4 | 3.3V | 2.375V | 1 | 75mA | 160 ps | 160 ps | 11 | 无卤素 | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | 1:2 | Yes/Yes | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
NB3L8504SDTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | 700MHz | -40°C~85°C | Tape & Reel (TR) | 2006 | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution), Translator | 2.375V~3.63V | DUAL | 鸥翼 | 0.635mm | LVDS | 不合格 | 2.5/3.3V | 1 | HCSL, HSTL, LVDS, LVPECL, SSTL | 1:4 | Yes/Yes | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NLV27WZ16DFT2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Automotive grade | ACTIVE (Last Updated: 4 days ago) | 表面贴装 | 表面贴装 | 6-TSSOP, SC-88, SOT-363 | 6 | 2 | -55°C~125°C | Tape & Reel (TR) | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 6 | Buffer/Driver | Tin (Sn) | TR | 1.65V~5.5V | DUAL | 鸥翼 | 未说明 | 2 | 1.8V | 未说明 | NLV27WZ16 | LVCMOS, LVTTL | 6 | 不合格 | Non-Inverting | 5.5V | 50pF | 10.2 ns | 1μA | LVC/LCX/Z | Buffer | 无卤素 | LVCMOS, LVTTL | 1:1 | No/No | AEC-Q100 | -32mA | 32mA | NO | 0.01mA | 1.1mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||
NB7L14MNTXG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | ACTIVE (Last Updated: 1 day ago) | Tin | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | 8GHz | -40°C~85°C | Tape & Reel (TR) | 2009 | GigaComm™ | yes | 活跃 | 1 (Unlimited) | 16 | Fanout Buffer (Distribution) | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~3.6V | QUAD | 1 | 2.5V | 0.5mm | NB7L14M | LVPECL | 16 | 8 | 3.6V | 2.5/3.3V | 2.375V | 1 | 200 ps | 105mA | 200 ps | 7L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:4 | Yes/Yes | 0.2 ns | 55 % | 0.05 ns | 55 % | 3mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
MC100LVEL14DWG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | -40°C~85°C | Tube | 2005 | 100LVEL | e3 | yes | 活跃 | 3 (168 Hours) | 20 | Fanout Buffer (Distribution), Multiplexer | Tin (Sn) | NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V | 3V~3.8V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 1GHz | 40 | MC100LVEL14 | ECL, PECL | 20 | 5 | 3.8V | -3.3V | 3V | 1 | 34mA | Clock | 2.42V | 无卤素 | ECL, PECL | 2:5 | Yes/Yes | 0.88 ns | 0.83 ns | 32mA | 2.4mm | 12.95mm | 7.6mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||
NB7L1008MMNR4G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | -40°C~85°C | Tape & Reel (TR) | 2008 | GigaComm™ | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution) | Tin (Sn) | ALSO OPERATES AT 3.3V | 2.375V~3.6V | QUAD | 1 | 2.5V | 0.5mm | 8GHz | NB7L1008M | CML | 32 | 16 | 2.625V | 2.5/3.3V | 2.375V | 1 | 250 ps | 250 ps | 7L | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:8 | Yes/Yes | 0.25 ns | 55 % | 0.025 ns | 55 % | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||
MC100LVE310FNR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 28-LCC (J-Lead) | 28 | 1GHz | -40°C~85°C | Tape & Reel (TR) | 2006 | 100LVE | e3 | yes | 活跃 | 3 (168 Hours) | 28 | Fanout Buffer (Distribution), Multiplexer | Tin (Sn) | 3V~3.8V | QUAD | J BEND | 260 | 1 | 3.3V | 40 | MC100LVE310 | LVECL, LVPECL | 28 | 8 | -3.3V | 3V | 1 | 850 ps | 850 ps | 2.42V | 无卤素 | LVECL, LVPECL | 2:8 | Yes/Yes | 0.05 ns | 4.57mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
NB7L11MMNG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | LIFETIME (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 16-VFQFN Exposed Pad | 16 | -40°C~85°C | Tube | 2006 | yes | 最后一次购买 | 1 (Unlimited) | 16 | EAR99 | Fanout Buffer (Distribution), Translator, Data | Nickel/Gold/Palladium (Ni/Au/Pd) | 2.375V~3.465V | QUAD | 260 | 1 | 2.5V | 0.5mm | 8GHz | 40 | NB7L11M | CML | 16 | 4 | 2 | 1 | 25mA | 150 ps | 150 ps | 7L | Buffer, Translator | 12 Gbps | 无卤素 | CML, LVCMOS, LVDS, LVPECL, LVTTL | 1:2 | Yes/Yes | 8000 MHz | 3mm | 3mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||
NB3N853501EDTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | 266MHz | -40°C~85°C | Tape & Reel (TR) | 2006 | e4 | yes | 活跃 | 1 (Unlimited) | 20 | Fanout Buffer (Distribution), Multiplexer | 3.135V~3.465V | DUAL | 鸥翼 | 1 | 3.3V | 0.65mm | LVPECL | 20 | 3.3V | 3.465V | 1 | 3N | 无卤素 | LVCMOS, LVTTL | 2:4 | No/Yes | 2 ns | 2 ns | 0.03 ns | 6.5mm | 4.4mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
MC100EP14DTR2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | ACTIVE (Last Updated: 4 days ago) | Gold | 表面贴装 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 20 | 2GHz | -40°C~85°C | Tape & Reel (TR) | 2005 | 100EP | e4 | yes | 活跃 | 1 (Unlimited) | 20 | EAR99 | Fanout Buffer (Distribution), Multiplexer | 3V~5.5V | DUAL | 鸥翼 | 260 | 1 | 3.3V | 40 | MC100EP14 | ECL, PECL | 20 | 5 | 3.3V | 3V | 1 | 480 ps | 480 ps | 无卤素 | ECL, HSTL, PECL | 2:5 | Yes/Yes | 0.6 ns | 4.4mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||
MC10EL11DG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 Weeks | ACTIVE (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | -40°C~85°C | Tube | 2006 | 10EL | e3 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | Fanout Buffer (Distribution) | Tin (Sn) | 4.2V~5.7V | DUAL | 鸥翼 | 260 | 1 | 5V | 1.5GHz | 40 | MC10EL11 | ECL, PECL | 8 | 4 | 5V | Inverting | 5.7V | -5.2V | Logic | 1 | 26mA | 340 ps | 385 ps | Buffer | 4.19V | 无卤素 | ECL, PECL | 1:2 | Yes/Yes | 26mA | 0.02 ns | 1.4986mm | 4.9784mm | 3.9878mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||
MC100LVEP210MNRG | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 32-VFQFN Exposed Pad | 32 | 3GHz | -40°C~85°C | Tape & Reel (TR) | 2005 | 100LVEP | e3 | yes | 活跃 | 1 (Unlimited) | 32 | Fanout Buffer (Distribution) | Tin (Sn) | 2.375V~3.8V | QUAD | 2 | 2.5V | 0.5mm | MC100LVEP210 | ECL, PECL | 32 | 20 | 3.8V | 2 | 430 ps | 500 ps | 无卤素 | ECL, HSTL, LVDS, PECL | 1:5 | Yes/Yes | 1mm | 5mm | 5mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||
NB3RL02FCT2G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | ACTIVE (Last Updated: 1 day ago) | 表面贴装 | 表面贴装 | 8-WFBGA, WLCSP | 8 | 52MHz | -40°C~85°C | Tape & Reel (TR) | 2011 | yes | 活跃 | 1 (Unlimited) | 8 | Fanout Buffer (Distribution) | 2.3V~5.5V | BOTTOM | BALL | 1 | 0.4mm | 26MHz | NB3RL02 | LVCMOS | 8 | 2 | 1 | 12 ns | 3R | 无卤素 | Clock | 1:2 | No/No | 0.5 ns | 0.5mm | 0.77mm | 无 | ROHS3 Compliant | 无铅 |