制造商是'NXP'
NXP 嵌入式 - 微处理器
(5314)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 只读存储器可编程性 | 总线兼容性 | 保安功能 | 显示和界面控制器 | 萨塔 | 座位高度(最大) | 长度 | RoHS状态 | |||
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 | MVF60NS151CMK40 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 0 | 364-LFBGA | YES | 131 | -40°C~85°C TA | Tray | 2002 | Vybrid, VF6xx | e1 | 活跃 | 3 (168 Hours) | 364 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.23V | 0.8mm | 40 | MVF60NS151 | S-PBGA-B364 | 不合格 | 1.26V | 3.3V | 1.16V | 400MHz, 167MHz | MICROCONTROLLER, RISC | ARM® Cortex®-A5 + Cortex®-M4 | 16 | YES | YES | NO | YES | 16 | 16 | 3.3V | 10/100Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, DDR3, DRAM | USB 2.0 OTG + PHY (1) | CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART | Multimedia; NEON™ MPE | FLASH | ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG | DCU, GPU, LCD, VideoADC, VIU | 17mm | ROHS3 Compliant | |||||||||||||
 | MC7447AVU867NB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e2 | 不用于新设计 | 1 (Unlimited) | 360 | 3A991.A.1 | TIN COPPER/TIN SILVER | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 867MHz | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 2.8mm | 25mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MC8641DVJ1333JE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1023-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 2001 | MPC86xx | e2 | 活跃 | 3 (168 Hours) | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.05V | 1mm | 30 | S-CBGA-B1023 | 1.1V | 1V | 1.333GHz | MICROPROCESSOR, RISC | PowerPC e600 | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.77mm | 33mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MPC8315VRAFDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8315 | S-PBGA-B620 | 1.05V | 11.8/2.53.3V | 0.95V | 333MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, PCI, SPI, TDM | SATA 3Gbps (2) | 2.46mm | 29mm | ROHS3 Compliant | |||||||||||||||||
 | MPC8245LZU333D | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 352-LBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 352 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 2V | 1.27mm | 30 | MPC8245 | S-PBGA-B352 | 2.2V | 23.3V | 1.9V | 333MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 3.3V | 1 Core 32-Bit | 无 | SDRAM | I2C, I2O, PCI, UART | 1.65mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||
 | MCIMX503CVM8B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | Commercial grade | 0°C~70°C TA | Tray | 2008 | i.MX50 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.225V | 0.8mm | 40 | MCIMX503 | S-PBGA-B400 | 不合格 | 1.275V | 1.175V | 800MHz | 微处理器电路 | ARM® Cortex®-A8 | 800MHz | YES | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | 1.6mm | 17mm | ROHS3 Compliant | |||||||||||||||||||
 | MCIMX6Y1DVM05AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 289-LFBGA | 0°C~95°C TJ | Tray | 2015 | i.MX6 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 260 | 40 | 528MHz | ARM® Cortex®-A7 | 1.8V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (2) | CAN, I2C, SPI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MC9328MXSVP10R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 225-LFBGA | YES | 0°C~70°C TA | Tape & Reel (TR) | 1994 | i.MXS | e1 | 不用于新设计 | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.8mm | 40 | MC9328MXS | S-PBGA-B225 | 1.9V | 1.7V | 100MHz | MICROPROCESSOR | ARM920T | 16MHz | 32 | 25 | YES | YES | 32 | 固定点 | NO | 1.8V 3.0V | 1 Core 32-Bit | 无 | SDRAM | USB 1.x (1) | I2C, I2S, SPI, SSI, UART | LCD | 1.6mm | 13mm | ROHS3 Compliant | |||||||||||||||||||
 | MC68LC302AF25CT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 100-LQFP | 0°C~70°C TA | Tray | 1995 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 260 | 40 | MC68LC302 | 25MHz | MICROCONTROLLER, RISC | M68000 | 5.0V | 1 Core 8/16-Bit | 无 | DRAM | GCI, IDL, ISDN, NMSI, PCM, SCPI | Communications; RISC CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| MPC8347EVRAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8347 | S-PBGA-B620 | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | Security; SEC | Cryptography, Random Number Generator | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||||
 | MPC8360VVAJDGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 740 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.15V | 533MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 1.69mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||
| MPC8360EVVALFHA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 740-LBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e1 | 活跃 | 3 (168 Hours) | 740 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1mm | 40 | MPC8360 | S-PBGA-B740 | 1.35V | 1.8/2.53.3V | 1.25V | 667MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 1.69mm | 37.5mm | ROHS3 Compliant | ||||||||||||||||
 | MCIMX6X3CVO08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | -40°C~105°C TA | Tray | 2013 | i.MX6SX | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B400 | 1.5V | 1.275V | 200MHz, 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9, ARM® Cortex®-M4 | 15 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 2.8V 3.15V | 10/100/1000Mbps (2) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | 1.53mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||
 | MPC8272VRPIEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA | YES | 57 | 0°C~105°C TA | Tray | 2004 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8272 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 300MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | 27mm | ROHS3 Compliant | |||||||||||||||||
| MCIMX353DVM5B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 400-LFBGA | YES | 4 | -20°C~70°C TA | Tray | 2005 | i.MX35 | e1 | 活跃 | 3 (168 Hours) | 400 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX353 | S-PBGA-B400 | 不合格 | 1.47V | 1.33V | 532MHz | 多功能外围设备 | ARM1136JF-S | 24MHz | YES | 128000 | 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART | 2 | Multimedia; GPU, IPU, VFP | CAN; ETHERNET; I2C; IRDA; SPI; UART; USB | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | 1.6mm | 17mm | ROHS3 Compliant | ||||||||||||||||||
| MPC8323EVRAFDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||
 | MPC8560VT833LC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 784-BBGA, FCBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC85xx | e2 | Obsolete | 3 (168 Hours) | 783 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 1mm | MPC8560 | S-PBGA-B783 | 1.26V | 1.14V | 833MHz | MICROPROCESSOR, RISC | PowerPC e500 | 166MHz | 32 | 64 | YES | YES | 64 | 固定点 | YES | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | 3.85mm | 29mm | ROHS3 Compliant | |||||||||||||||||||||
 | MPC855TZQ66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | 0°C~95°C TA | Tray | 1997 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC855 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (1), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | |||||||||||||||||||
 | MPC8349CVVAJDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 672-LBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 672 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8349 | S-PBGA-B672 | 1.26V | 1.21.8/2.52.5/3.3V | 1.14V | 533MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 1.69mm | 35mm | ROHS3 Compliant | ||||||||||||||||||
| MPC8248CZQTIEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | 57 | -40°C~105°C TA | Tray | 1994 | MPC82xx | e0 | 最后一次购买 | 3 (168 Hours) | 516 | 5A002.A.1 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8248 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 400MHz | MICROCONTROLLER, RISC | PowerPC G2_LE | 66.7MHz | 32 | NO | YES | NO | 30 | 64 | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | 27mm | Non-RoHS Compliant | |||||||||||||||||
 | MPC8378EVRANGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8378 | S-PBGA-B689 | 1.05V | 1.051.8/2.52.5/3.3V | 0.95V | 800MHz | MICROPROCESSOR | PowerPC e300c4s | 66.66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC 3.0 | Cryptography, Random Number Generator | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||||||
 | MPC8306SCVMACDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 369-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 369 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | MPC8306 | S-PBGA-B369 | 1.05V | 11.83.3V | 0.95V | 200MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, I2C, SPI, TDM | Communications; QUICC Engine | 1.61mm | 19mm | ROHS3 Compliant | |||||||||||||||||||
 | P1010NSN5HHA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 425-FBGA | YES | 0°C~105°C TA | Tray | 2002 | QorIQ P1 | e2 | Obsolete | 3 (168 Hours) | 425 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| MPC8275VRMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 516-BBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8275 | S-PBGA-B516 | 1.6V | 1.53.3V | 1.45V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 266MHz | 32 | 32 | YES | NO | 64 | 浮点 | YES | 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM | 2.55mm | 27mm | ROHS3 Compliant | |||||||||||||||||
| MCIMX6G3CVM05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 289-LFBGA | YES | 10 | -40°C~105°C TJ | Tray | 2014 | i.MX6UL | Obsolete | 3 (168 Hours) | 289 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.3V | 1.15V | 528MHz | 多功能外围设备 | ARM® Cortex®-A7 | 16 | YES | 16 | 128000 | 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 + PHY (2) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | 9 | Multimedia; NEON™ SIMD | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; RS-485; SPI; UART; USB | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | LCD, LVDS | 1.32mm | 14mm | ROHS3 Compliant |