制造商是'NXP'
NXP 嵌入式 - 微处理器
(5314)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 总线兼容性 | 保安功能 | 最大数据传输率 | 显示和界面控制器 | 通信协议 | 萨塔 | 数据编码/解码方式 | 座位高度(最大) | 长度 | RoHS状态 | ||
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 | MPC8358ECVVADDEA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 740-LBGA | 740-TBGA (37.5x37.5) | -40°C~105°C TA | Tray | 2006 | MPC83xx | Obsolete | 1 (Unlimited) | MPC8358 | 266MHz | PowerPC e300 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MC68EC000CAA10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 64-QFP | 64-QFP (14x14) | -40°C~85°C TA | Tray | 1998 | M680x0 | Obsolete | 3 (168 Hours) | MC68EC000 | 10MHz | EC000 | 5.0V | 1 Core 32-Bit | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | LS1023ASE7MNLB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MC68LC040RC40A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 179-BEPGA | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 3 (168 Hours) | MC68LC040 | 40MHz | 68040 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
.png) | T1024NSE7PQA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 780-FBGA | YES | 0°C~105°C TA | 2014 | QorIQ T1 | e1 | 活跃 | 3 (168 Hours) | 780 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | 30 | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.33MHz | 64 | 16 | YES | YES | 64 | YES | GbE (8) | 2 Core 64-Bit | 无 | DDR3L, DDR4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||||||||||||||||
 | KMPC8560PX667LC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 784-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2002 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8560 | 667MHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | I2C, PCI, RapidIO, SPI, TDM, UART | Communications; CPM | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | P3041NXE1NNB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1295-BBGA, FCBGA | -40°C~105°C TA | Tray | 2006 | QorIQ P3 | Obsolete | 3 (168 Hours) | P3041 | 1.333GHz | PowerPC e500mc | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MCIMX6L3EVN10AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Industrial grade | 432-TFBGA | YES | 162 | -40°C~105°C TA | Tray | 2002 | i.MX6SL | e1 | 活跃 | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | 不合格 | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | ||||||||
 | MCIMX6S6AVM08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||
 | MIMX8MD6CVAHZAB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MD | 活跃 | 3 (168 Hours) | 621 | BOTTOM | BALL | 1V | 0.65mm | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 2 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||
| MIMX8MD6DVAJZAB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 621-FBGA, FCBGA | 0°C~95°C TJ | Tray | i.MX8MD | 活跃 | 3 (168 Hours) | 1.5GHz | ARM® Cortex®-A53 | GbE | 2 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| P3041NXN7MMC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 1295-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P3 | e1 | 活跃 | 3 (168 Hours) | 3A991.A.1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | P3041 | S-PBGA-B1295 | 1.05V | 0.95V | 1.2GHz | MICROPROCESSOR, RISC | PowerPC e500mc | 133MHz | YES | YES | 固定点 | YES | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | SATA 3Gbps (2) | 3.53mm | 37.5mm | ROHS3 Compliant | |||||||||||||||||
 | MIMX8MM6CVTKZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 486-LFBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MM | 活跃 | 3 (168 Hours) | 486 | BOTTOM | BALL | 0.95V | 0.5mm | S-PBGA-B486 | 1V | 0.9V | 1.6GHz | ARM® Cortex®-A53 | YES | 288K | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | 1.25mm | 14mm | ||||||||||||||||||||||||||
| MIMX8MM5DVTLZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 486-LFBGA, FCBGA | 0°C~95°C TJ | Tray | i.MX8MM | 活跃 | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A53 | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | |||||||||||||||||||||||||||||||||||||||||
 | MC68360ZQ25VL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 357-BBGA | YES | 0°C~70°C TA | Tray | 1995 | M683xx | e0 | 最后一次购买 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 5V | 1.27mm | 40 | MC68360 | S-PBGA-B357 | 5.25V | 4.75V | 25MHz | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | CPU32+ | 25MHz | 32 | YES | YES | 32 | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | MC68040; MC68030 | 1.25 MBps | BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP | NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | 1.86mm | 25mm | Non-RoHS Compliant | ||||||||||||||
| MIMX8MM5CVTKZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 486-LFBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MM | 活跃 | 3 (168 Hours) | 486 | BOTTOM | BALL | 0.95V | 0.5mm | S-PBGA-B486 | 1V | 0.9V | 1.6GHz | ARM® Cortex®-A53 | YES | 288K | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | 1.25mm | 14mm | ||||||||||||||||||||||||||
| MIMX8MQ6CVAHZAB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | Industrial grade | 621-FBGA, FCBGA | YES | 16 | -40°C~105°C TJ | Tray | i.MX8MQ | 活跃 | 3 (168 Hours) | 621 | BOTTOM | BALL | 1V | 0.65mm | S-PBGA-B621 | 1.05V | 0.9V | 1.3GHz | ARM® Cortex®-A53 | 40MHz | YES | 160K | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | 2.18mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||
| MIMX8MQ6DVAJZAB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 621-FBGA, FCBGA | Commercial grade | 0°C~95°C TJ | Tray | i.MX8MQ | 活跃 | 3 (168 Hours) | 1.5GHz | ARM® Cortex®-A53 | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, UART, uSDHC | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | eDP, HDMI, MIPI-CSI, MIPI-DSI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| MIMX8MM6DVTLZAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 486-LFBGA, FCBGA | 0°C~95°C TJ | Tray | i.MX8MM | 活跃 | 3 (168 Hours) | 1.8GHz | ARM® Cortex®-A53 | GbE | 4 Core 32-Bit | 有 | DDR3L, DDR4, LPDDR4 | USB 2.0 + PHY (2) | I2C, PCIe, SDHC, SPI, UART | ARM® Cortex®-M4 | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | MIPI-DSI | |||||||||||||||||||||||||||||||||||||||||
 | MPC5200CBV400 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 272-BBGA | YES | -40°C~85°C TA | Tray | 2003 | MPC52xx | e0 | 不用于新设计 | 3 (168 Hours) | 272 | 3A991.A.2 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.31.00.01 | BOTTOM | BALL | 240 | 1.5V | 1.27mm | 30 | PC5200 | S-PBGA-B272 | 1.58V | 1.42V | 400MHz | MICROPROCESSOR | PowerPC G2_LE | 35MHz | 32 | YES | YES | 32 | 浮点 | YES | 2.5V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 1.1 (2) | AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART | 2.65mm | 27mm | Non-RoHS Compliant | |||||||||||||||
 | MC68EC040FE40A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 184-BCQFP | 0°C~70°C TA | Tray | 1995 | M680x0 | Obsolete | 1 (Unlimited) | MC68EC040 | 40MHz | 68040 | 5.0V | 1 Core 32-Bit | 无 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MC68MH360RC33L | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 241-BEPGA | 0°C~70°C TA | Tray | 1995 | M683xx | Obsolete | 不适用 | MC68MH360 | 33MHz | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| LS101MASE7EHA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | 0°C~70°C TA | Tray | QorlQ LS1 | Obsolete | 3 (168 Hours) | 650MHz | ARM1136JF-S | GbE (2) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 + PHY (1) | I2C, PCIe, PCM/TDM, SPI, UART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| P3041NSE1MMB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | 0°C~105°C TA | Tray | 2006 | QorIQ P3 | Obsolete | 3 (168 Hours) | P3041 | 1.2GHz | PowerPC e500mc | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (5), 10Gbps (1) | 4 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, RapidIO, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | KMPC8555EVTALF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 783-FCPBGA (29x29) | 0°C~105°C TA | Tray | 2004 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8555 | 667MHz | PowerPC e500 | 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, SDRAM | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; CPM, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant |