制造商是'NXP'
NXP 嵌入式 - 微处理器
(5314)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 速度 | uPs/uCs/外围ICs类型 | 核心处理器 | 时钟频率 | 位元大小 | 地址总线宽度 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 串行I/O数 | 协处理器/DSP | 总线兼容性 | 保安功能 | 显示和界面控制器 | 萨塔 | 座位高度(最大) | 长度 | RoHS状态 | ||
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 | MPC8343VRAGDB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8343 | S-PBGA-B620 | 1.26V | 1.22.53.3V | 1.14V | 400MHz | MICROPROCESSOR | PowerPC e300 | 66MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (2) | DUART, I2C, PCI, SPI | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||
 | LS1021ASN7KQB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 525-FBGA, FCBGA | YES | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 525 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 40 | S-PBGA-B525 | 1.03V | 0.97V | 1.0GHz | 微处理器电路 | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 3.0 (1) + PHY | Secure Boot, TrustZone® | 2D-ACE | SATA 6Gbps (1) | 2.07mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MCIMX233CJM4C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 169-LFBGA | Industrial grade | -40°C~85°C TA | Tray | 2004 | i.MX23 | 活跃 | 3 (168 Hours) | MCIMX233 | 454MHz | ARM926EJ-S | 2.0V 2.5V 2.7V 3.0V 3.3V | 1 Core 32-Bit | 无 | DRAM | USB 2.0 + PHY (1) | I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | Data; DCP | Cryptography, Hardware ID | LCD, Touchscreen | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | MCIMX257CJN4A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 347-LFBGA | YES | 6 | -40°C~85°C TA | Tray | 2005 | i.MX25 | e1 | 活跃 | 3 (168 Hours) | 347 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.45V | 0.5mm | 40 | MCIMX257 | S-PBGA-B347 | 1.52V | 1.2/1.51.8/3.3V | 1.38V | 400MHz | MICROPROCESSOR | ARM926EJ-S | 24MHz | 32 | 26 | YES | YES | 16 | 固定点 | YES | 128000 | 2.0V 2.5V 2.7V 3.0V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR, DDR, DDR2 | USB 2.0 + PHY (2) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | I2C; USB | Keypad, LCD, Touchscreen | 1.52mm | 12mm | ROHS3 Compliant | ||||||||
 | MCIMX6DP6AVT1AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6DP | 活跃 | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.35V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MPC8569ECVJAQLJB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 783-BBGA, FCBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC85xx | e1 | 最后一次购买 | 3 (168 Hours) | 783 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 30 | S-PBGA-B783 | 1.03V | 12.5/3.3V | 0.97V | 1.067GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.0V 1.5V 1.8V 2.5V 3.3V | 10/100Mbps (8), 1Gbps (4) | 1 Core 32-Bit | 无 | DDR2, DDR3, SDRAM | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC | Cryptography, Random Number Generator | 3.94mm | 29mm | ROHS3 Compliant | |||||||||||
 | MC68EN360CAI25L | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 240-BFQFP | YES | -40°C~85°C TA | Tray | 1995 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 240 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 40 | MC68EN360 | S-PQFP-G240 | 25MHz | risc微控制器 | CPU32+ | 5.0V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | SCC, SMC, SPI | Communications; CPM | ROHS3 Compliant | |||||||||||||||||||||||||||
| MPC8314VRADDA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 620-BBGA Exposed Pad | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 620 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8314 | S-PBGA-B620 | 1.05V | 13.3V | 0.95V | 266MHz | MICROPROCESSOR | PowerPC e300c3 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, HSSI, I2C, PCI, SPI, TDM | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||||
 | MPC8377VRALGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 689 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | MPC8377 | S-PBGA-B689 | 1.05V | 11.8/2.52.5/3.3V | 0.95V | 667MHz | MICROPROCESSOR | PowerPC e300c4s | 32 | 15 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | SATA 3Gbps (2) | 2.46mm | 31mm | ROHS3 Compliant | ||||||||||||
 | FS32V234CON1VUB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 621-FBGA, FCBGA | YES | -40°C~105°C TA | 2015 | 活跃 | 3 (168 Hours) | 621 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 0.65mm | 40 | S-PBGA-B621 | 1.05V | 0.95V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A53, ARM® Cortex®-M4 | 64 | YES | YES | 浮点 | YES | 1V 1.8V 3.3V | 1Gbps | 4 Core 64-Bit/1 Core 32-Bit | 有 | DDR3, DDR3L, LPDDR2 | I2C, SPI, PCI, UART | Multimedia; NEON™ MPE | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | 2.44mm | 17mm | ROHS3 Compliant | |||||||||||||||||||
 | MCIMX6S1AVM08AC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6S | e1 | 活跃 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 24MHz | 64 | 16 | YES | YES | 32 | 固定点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||
| P1020NSE2DFB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 689-BBGA Exposed Pad | YES | 0°C~125°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 689 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | P1020 | S-PBGA-B689 | 1V | 800MHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 2.5V 3.3V | 10/100/1000Mbps (3) | 2 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I2C, MMC/SD, SPI | Security; SEC 3.3 | Cryptography, Random Number Generator | ROHS3 Compliant | ||||||||||||||||||||||||||
| MCIMX6L7DVN10AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | Commercial grade | 432-TFBGA | YES | 162 | 0°C~95°C TJ | Tray | 2002 | i.MX6SL | e1 | 活跃 | 3 (168 Hours) | 576 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.5mm | 40 | MCIMX6 | S-PBGA-B | 不合格 | 1.5V | 1.375V | 1.0GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 16 | YES | YES | 32 | 固定点 | YES | 32000 | 1.2V 1.8V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (3) | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | Multimedia; NEON™ SIMD | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.1mm | 13mm | ROHS3 Compliant | |||||||
 | P1010NXE5HHB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 425-FBGA | YES | -40°C~105°C TA | Tray | 2002 | QorIQ P1 | 活跃 | 3 (168 Hours) | 425 | 8542.31.00.01 | 1V | P1010 | 1V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500v2 | 32 | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR3, DDR3L | USB 2.0 + PHY (1) | CAN, DUART, I2C, MMC/SD, SPI | Security; SEC 4.4 | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | SATA 3Gbps (2) | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | MCIMX31CVMN4C | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 473-LFBGA | YES | -40°C~85°C TA | Tray | 2004 | i.MX31 | e1 | 活跃 | 3 (168 Hours) | 473 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 0.8mm | 40 | MCIMX31 | S-PBGA-B473 | 不合格 | 1.47V | 1.53.3V | 1.22V | 400MHz | MICROPROCESSOR | ARM1136JF-S | 75MHz | 32 | 26 | YES | YES | 16 | 浮点 | YES | 1.8V 2.0V 2.5V 2.7V 3.0V | 1 Core 32-Bit | 有 | DDR | USB 2.0 (3) | 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART | Multimedia; GPU, IPU, MPEG-4, VFP | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | Keyboard, Keypad, LCD | 1.54mm | 19mm | ROHS3 Compliant | |||||||||
| MCIMX6U7CVM08AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 624-LFBGA | YES | -40°C~105°C TA | Tray | 2002 | i.MX6DL | e1 | 不用于新设计 | 3 (168 Hours) | 624 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | MCIMX6 | S-PBGA-B624 | 1.5V | 1.275V | 800MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | |||||||||||||
 | MPC8321ECVRADDCA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 40 | S-PBGA-B516 | 1.05V | 0.95V | 266MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 66.67MHz | 32 | YES | YES | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||
| MPC8548EVTAUJD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 783-BBGA, FCBGA | 0°C~105°C TA | Tray | 2009 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8548 | 1.333GHz | PowerPC e500 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2, SDRAM | DUART, I2C, PCI, RapidIO | Signal Processing; SPE, Security; SEC | Cryptography, Random Number Generator | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | MCIMX6Y0CVM05AA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 52 Weeks | 289-LFBGA | YES | -40°C~105°C TJ | Tray | 2002 | i.MX6 | 活跃 | 3 (168 Hours) | 289 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 0.8mm | S-PBGA-B289 | 1.5V | 1.275V | 528MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A7 | 528MHz | 16 | YES | 16 | 1.8V 2.8V 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 无 | LPDDR2, DDR3, DDR3L | USB 2.0 OTG + PHY (1) | I2C, SPI, UART | 1 | Multimedia; NEON™ MPE | ETHERNET, I2C, PCI, SPI, UART, USB | A-HAB, ARM TZ, CSU, SJC, SNVS | Electrophoretic, LCD | 1.32mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
 | MC7447AHX1167NB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 360-BCBGA, FCCBGA | YES | 0°C~105°C TA | Tray | 1994 | MPC74xx | e0 | 不用于新设计 | 1 (Unlimited) | 360 | 3A991.A.1 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.3V | 1.27mm | 40 | MC7447 | S-CBGA-B360 | 1.35V | 1.25V | 1.167GHZ | MICROPROCESSOR, RISC | PowerPC G4 | 167MHz | 32 | 36 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V | 1 Core 32-Bit | 无 | Multimedia; SIMD | 3.24mm | 25mm | Non-RoHS Compliant | |||||||||||||||
| MPC8248CVRMIBA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 516-BBGA | YES | -40°C~105°C TA | Tray | 1994 | MPC82xx | e2 | 活跃 | 3 (168 Hours) | 516 | 5A002.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | MPC8248 | S-PBGA-B516 | 1.575V | 1.53.3V | 1.425V | 266MHz | MICROPROCESSOR, RISC | PowerPC G2_LE | 66.67MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 3.3V | 10/100Mbps (2) | 1 Core 32-Bit | 无 | DRAM, SDRAM | USB 2.0 (1) | I2C, SCC, SMC, SPI, UART, USART | Communications; RISC CPM, Security; SEC | Cryptography, Random Number Generator | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||
| MCIMX6U6AVM10AD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 624-LFBGA | YES | -40°C~125°C TJ | Tray | i.MX6DL | 活跃 | 3 (168 Hours) | 624 | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.8mm | 40 | S-PBGA-B624 | 1.5V | 1.4V | 1GHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 2 Core 32-Bit | 有 | LPDDR2, LVDDR3, DDR3 | USB 2.0 + PHY (4) | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | Multimedia; NEON™ SIMD | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Keypad, LCD | 1.6mm | 21mm | ROHS3 Compliant | ||||||||||||||||||
 | MPC8241LZQ200D | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 357-BBGA | YES | 0°C~105°C TA | Tray | 1998 | MPC82xx | e0 | Obsolete | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1.27mm | 40 | MPC8241 | S-PBGA-B357 | 1.9V | 1.7V | 200MHz | MICROPROCESSOR, RISC | PowerPC 603e | 66MHz | 32 | 32 | YES | YES | 64 | 浮点 | YES | 3.3V | 1 Core 32-Bit | 无 | SDRAM | I2C, I2O, PCI, UART | 2.56mm | 25mm | Non-RoHS Compliant | ||||||||||||||||
 | MPC8358CVRAGDGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 668-BBGA Exposed Pad | YES | -40°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 668 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MPC8358 | S-PBGA-B668 | 1.26V | 1.14V | 400MHz | MICROPROCESSOR, RISC | PowerPC e300 | 66.67MHz | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (1) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 1.x (1) | DUART, HDLC, I2C, PCI, SPI, UART | Communications; QUICC Engine | 2.46mm | 29mm | ROHS3 Compliant | ||||||||||||
| MPC860TCZQ66D4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 357-BBGA | YES | -40°C~95°C TA | Tray | 1995 | MPC8xx | e0 | 不用于新设计 | 3 (168 Hours) | 357 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC860 | S-PBGA-B357 | 3.465V | 3.3V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 50MHz | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant |