制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MKV44F256VLH16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 48 | 表面贴装 | 64-LQFP | YES | A/D 29x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 未说明 | 3.6V | 1.71V | Internal | 168MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MC9S12E128MPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 91 | 表面贴装 | 112-LQFP | YES | A/D 16x10b; D/A 2x8b | -40°C~125°C TA | Tray | 2005 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 112 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 3.3V OR 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12E128 | S-PQFP-G112 | 不合格 | 2.75V | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~2.75V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 16 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||
 | MC9S12DJ256MFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 59 | 262144 | 表面贴装 | 80-QFP | YES | A/D 16x10b | -40°C~125°C TA | Tray | 1996 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12DJ256 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 4K x 8 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||
| MC9S12P64VQK | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 64 | 65536 | 表面贴装 | 80-QFP | YES | A/D 10x12b | -40°C~105°C TA | Tray | 2010 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MC9S12P64 | S-PQFP-G80 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 4K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | NO | 4K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | S9S12GA240F0VLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 86 | 245760 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 2x8b | -40°C~105°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5mm | S9S12GA240 | S-PQFP-G100 | 不合格 | 3.3/5V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | 4K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | MC9S08PA60AVQH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 表面贴装 | 64-QFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2014 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | 256 x 8 | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||
 | MCF5270VM100 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 196-LBGA | YES | 61 | 0°C~70°C TA | Tray | 1997 | MCF527x | e1 | 不用于新设计 | 3 (168 Hours) | 196 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5270 | S-PBGA-B196 | 不合格 | 1.6V | 1.4V | External | 100MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | 固定点 | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||
| SPC5604BAMLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 79 | 表面贴装 | 100-LQFP | A/D 28x10b | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5604 | Internal | 64MHz | 32K x 8 | 3V~5.5V | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC68332GVEH25 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 132-BQFP Bumpered | YES | 15 | -40°C~105°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 132 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.635mm | 30 | MC68332 | S-PQFP-G132 | 不合格 | Internal | 25MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | |||||||||||||||||||||
| MC9S12DT256MFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 59 | 262144 | 表面贴装 | 80-QFP | YES | A/D 8x10b | -40°C~125°C TA | Tray | 2006 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12DT256 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 4K x 8 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||
 | S9S08QD4J2MSCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 4 | Automotive grade | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | -40°C~125°C TA | Tape & Reel (TR) | 2004 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 哑光锡 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | S9S08QD4 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | AEC-Q100 | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||
| MKV31F256VLH12R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 46 | 表面贴装 | 64-LQFP | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KV | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 120MHz | 48K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||
| MKL46Z128VLL4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 84 | 131072 | 表面贴装 | 100-LQFP | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2013 | Kinetis KL4 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | MKL46Z128 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||
| MKE02Z32VLH2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 4096 | 32768 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | CORTEX-M0 | ROHS3 Compliant | |||||||||||||||
 | LPC2368FET100,518 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 70 | 524288 | 表面贴装 | 100-TFBGA | YES | A/D 6x10b; D/A 1x10b | -40°C~85°C TA | Tape & Reel (TR) | 2003 | LPC2300 | e1 | 不用于新设计 | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | LPC2368 | 100 | S-PBGA-B100 | 不合格 | 3.6V | 3.3V | 3V | Internal | 72MHz | 58K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB | 32 | YES | YES | YES | YES | 16 | 1.2mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||
 | MCF51JM32VLK | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 66 | 32768 | 表面贴装 | 80-LQFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | 活跃 | 3 (168 Hours) | 80 | 5A992 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MCF51JM32 | S-PQFP-G80 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 32KB 32K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | 1.74mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| MC9S12XF512MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 42 | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 2005 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | MC9S12XF512 | S-PQFP-G64 | 不合格 | 1.98V | 1.85V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||
 | LPC11E37FBD48/501E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 40 | 131072 | 表面贴装 | 48-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2010 | LPC11E3x | 活跃 | 3 (168 Hours) | 48 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC11E37 | 48 | S-PQFP-G48 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 12K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART | 32 | YES | NO | NO | NO | 4K x 8 | CORTEX-M0 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||
 | MC705P6ACPE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 | 通孔 | 28-DIP (0.600, 15.24mm) | A/D 4x8b | -40°C~85°C TA | Tube | 2005 | HC05 | Obsolete | 不适用 | MC705P6 | Internal | 2.1MHz | 176 x 8 | 3V~5.5V | POR, WDT | OTP | 8-Bit | 4.5KB 4.5K x 8 | SIO | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | LPC11A02UK,118 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 18 | 4096 | 16384 | 表面贴装 | 20-UFBGA, WLCSP | YES | A/D 8x10b; D/A 1x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | LPC11Axx | 活跃 | 1 (Unlimited) | 20 | BOTTOM | BALL | 未说明 | 3.3V | 0.5mm | 未说明 | 20 | S-PBGA-B20 | 不合格 | 3.6V | 3.3V | 2.6V | Internal | 50MHz | 4K x 8 | 2.6V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M0 | 2013-06-14 00:00:00 | 0.65mm | 2.55mm | 2.55mm | ROHS3 Compliant | ||||||||||||||||
| MKV44F128VLF16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 38 | 表面贴装 | 48-LQFP | YES | A/D 21x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 未说明 | 3.6V | 1.71V | Internal | 168MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | YES | YES | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||
| MC9S12XEG128MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 131072 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 2002 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XEG128 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 2K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||
 | SPC5605BK0VLU6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 149 | 表面贴装 | 176-LQFP | YES | A/D 29x10b, 5x12b | -40°C~105°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5605 | 3.6V | 3V | Internal | 64MHz | 64K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 768KB 768K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | S9S12GN32BVLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 表面贴装 | 32-LQFP | A/D 8x10b | -40°C~105°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| MCF52100CAE66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 43 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2007 | MCF521xx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MCF52100 | S-PQFP-G64 | 不合格 | 3.6V | 3/3.3V | 3V | Internal | 66MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | 32 | 32 | 10mm | 10mm | ROHS3 Compliant |