制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPC5553MZQ132 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 220 | 1572864 | 表面贴装 | 324-BBGA | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e0 | 活跃 | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | PC5553 | S-PBGA-B324 | 不合格 | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 32 | YES | NO | YES | NO | 24 | 32 | 2.55mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||
 | MC9S08DZ96MLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 87 | 98304 | 表面贴装 | 100-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 2002 | S08 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ96 | S-PQFP-G100 | 不合格 | 5.5V | 3/5V | 2.7V | External | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 16 | 2K x 8 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||
 | DSP56F826BU80E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100-LQFP | 100-LQFP (14x14) | 46 | -40°C~85°C TA | Tray | 1998 | 56F8xx | 不用于新设计 | 3 (168 Hours) | DSP56F826 | External | 80MHz | 4K x 16 | 2.25V~2.75V | 56800 | POR, WDT | FLASH | 16-Bit | 64KB 32K x 16 | EBI/EMI, SCI, SPI, SSI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MC9S12HZ256VAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 85 | 262144 | 表面贴装 | 112-LQFP | YES | A/D 16x10b | -40°C~105°C TA | Tray | 1998 | HCS12 | e3 | 不用于新设计 | 3 (168 Hours) | 112 | EAR99 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | 9S12HZ256 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 25MHz | 12K x 8 | 2.35V~5.5V | MICROCONTROLLER | LCD, Motor control PWM, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | 16 | 2K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
 | MC68HC16Z1CEH25 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 16 | 表面贴装 | 132-BQFP Bumpered | YES | A/D 8x10b | -40°C~85°C TA | Tray | 1996 | HC16 | e3 | 不用于新设计 | 3 (168 Hours) | 132 | EAR99 | Matte Tin (Sn) | IT ASLO OPERATES AT 3V | 8542.31.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.635mm | 30 | MC68HC16 | S-PQFP-G132 | 不合格 | 5.5V | 4.5V | Internal | 25MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | CPU16 | POR, PWM, WDT | 25.17MHz | ROMless | 16-Bit | EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 20 | 16 | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | |||||||||||||
 | S912XET256J1MAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 59 | 16384 | 262144 | 表面贴装 | 80-QFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||
 | LPC2103FBD48,118 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 32 | 表面贴装 | 48-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2003 | LPC2100 | e3 | 不用于新设计 | 1 (Unlimited) | 48 | EAR99 | Tin (Sn) | ALSO REQUIRES 3.3 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | LPC2103 | 48 | S-PQFP-G48 | 不合格 | 1.95V | 1.83.3V | 1.65V | Internal | 70MHz | 8K x 8 | 1.65V~3.6V | MICROCONTROLLER, RISC | ARM7® | POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||
 | MK40DX128VLK7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 52 | 131072 | 表面贴装 | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK40DX128 | S-PQFP-G80 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 12mm | 12mm | ROHS3 Compliant | ||||||||||||
 | S9S12P96J0MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 49 | 98304 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 10x12b | -40°C~125°C TA | Tray | 2010 | HCS12 | 活跃 | 3 (168 Hours) | 64 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | 9S12P96 | S-PQFP-G64 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
| MKE16F256VLL16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 89 | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xF | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 5V | 0.5mm | 未说明 | 5.5V | 2.7V | Internal | 168MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | DMA, LVD, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, SPI, UART/USART | 32 | YES | YES | YES | 68K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
 | MK60DX256VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 262144 | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK60DX256 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
| S912ZVHY64F1VLQ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 100 | 65536 | 表面贴装 | 144-LQFP | YES | A/D 8x10b | -40°C~105°C TA | Tray | 2010 | S12 MagniV | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 12V | 0.5mm | S912ZVHY64 | S-PQFP-G144 | 不合格 | 18V | 6/18V | 5.5V | Internal | 32MHz | 4K x 8 | 4.5V~5.5V | MICROCONTROLLER | S12Z | DMA, LCD, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | YES | YES | 32 | 2K x 8 | CPU12 | 32 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||
| S912XEQ512J3MAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 2010 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | S912XEQ512 | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||
 | SPC5644AF0MLU3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 84 | 4194304 | Automotive grade | 表面贴装 | 176-LQFP | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 40 | SPC5644 | S-PQFP-G176 | 不合格 | 1.32V | 1.23.35V | 1.14V | Internal | 80MHz | 192K x 8 | 1.14V~5.25V | MICROCONTROLLER | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 380mA | 32 | YES | YES | YES | AEC-Q100 | 24mm | 24mm | ROHS3 Compliant | ||||||||||||
 | MKL27Z64VDA4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 30 | 表面贴装 | 36-XFBGA | YES | A/D 14x16b | -40°C~105°C TA | Tape & Reel (TR) | Kinetis KL2 | 活跃 | 3 (168 Hours) | 36 | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 3-CH 16-BIT | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | S-PBGA-B36 | 3.6V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, FlexIO, SPI, UART/USART, USB | 32 | YES | YES | YES | NO | 0.5mm | 3.5mm | 3.5mm | ROHS3 Compliant | |||||||||||||||||||
 | MC9S08EL32CTL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 22 | 32768 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | A/D 16x10b | -40°C~85°C TA | Tube | 1998 | S08 | e3 | 活跃 | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08EL32 | R-PDSO-G28 | 不合格 | 5.5V | 3/5V | 2.7V | External | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 512 x 8 | 1.2mm | 9.7mm | 4.4mm | ROHS3 Compliant | |||||||||||||
| SPC5604PEF1MLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 68 | 524288 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 30x10b | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | SPC5604 | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 40K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 89mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 32 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | MC9S12XEP100CVL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 152 | 1048576 | 表面贴装 | 208-BGA | YES | A/D 32x12b | -40°C~85°C TA | Tray | 2012 | HCS12X | e2 | 活跃 | 3 (168 Hours) | 208 | 3A991.A.2 | TIN COPPER/TIN SILVER | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | MC9S12XEP100 | S-PBGA-B208 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 2mm | 17mm | 17mm | ROHS3 Compliant | |||||||||
 | MK22FN128VMP10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 131072 | 表面贴装 | 64-LFBGA | YES | A/D 22x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MK22FN128 | S-PBGA-B64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 5mm | 5mm | ROHS3 Compliant | |||||||||||||
| SPC5602PEF0VLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 79 | 262144 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 16x10b | -40°C~105°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | SPC5602 | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 20K x 8 | 3V~5.5V | 单片机RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 65mA | 32 | YES | YES | YES | 4K x 16 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
 | MK40DX64VMC7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 74 | 65536 | 表面贴装 | 121-LFBGA | YES | A/D 34x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK40DX64 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | ||||||||||||
 | MPC535CZP40 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 56 | 表面贴装 | 388-BBGA | A/D 16x10b | -40°C~85°C TA | Tray | 1999 | MPC5xx | 不用于新设计 | 3 (168 Hours) | 8542.31.00.01 | unknown | MPC535 | External | 40MHz | 36K x 8 | 2.5V~2.7V | PowerPC | POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MCF52223CVM80 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 56 | 262144 | 表面贴装 | 81-LBGA | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2005 | MCF5222x | e1 | 活跃 | 3 (168 Hours) | 81 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF52223 | S-PBGA-B81 | 不合格 | 3.6V | 3/3.3V | 3V | Internal | 80MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 80MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||
| SPC5517SAMLU66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 137 | 196608 | Automotive grade | 表面贴装 | 176-LQFP | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2004 | MPC55xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5517 | S-PQFP-G176 | 不合格 | 5.25V | 5V | 4.5V | Internal | 66MHz | 64K x 8 | 4.5V~5.25V | MICROCONTROLLER, RISC | e200z1 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | 32 | YES | YES | YES | NO | 32 | AEC-Q100 | 32 | 1.6mm | 24mm | 24mm | ROHS3 Compliant | |||||||||
| S912XEQ512J3MALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 32768 | 524288 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 20mm | 20mm | ROHS3 Compliant |