制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | MKL16Z256VMP4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 54 | 262144 | 表面贴装 | 64-LFBGA | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2013 | Kinetis KL1 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MKL16Z256 | S-PBGA-B64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||
 | MK10DX64VLH7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 44 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 26x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DX64 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||
 | MK22FN1M0AVLL12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 66 | 表面贴装 | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2005 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
| MK64FN1M0VLL12R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 66 | 表面贴装 | 100-LQFP | YES | A/D 32x16b; D/A 1x12b | -40°C~105°C TA | Tape & Reel (TR) | 2015 | Kinetis K60 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | YES | YES | YES | YES | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MK82FN256VDC15 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 87 | 表面贴装 | 121-XFBGA | A/D 18x16b; D/A 2x6b, 1x12b | -40°C~105°C TA | Tray | 2014 | Kinetis K8x | 活跃 | 3 (168 Hours) | 5A992 | 8542.31.00.01 | 未说明 | 未说明 | Internal | 150MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MK64FX512VDC12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 86 | 表面贴装 | 121-XFBGA | YES | A/D 37x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2015 | Kinetis K60 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 40 | S-PBGA-B121 | 3.6V | 1.71V | Internal | 120MHz | 192K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | YES | YES | YES | YES | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||
 | MC68332ACEH25 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 132-BQFP Bumpered | YES | 15 | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 132 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.635mm | 30 | MC68332 | S-PQFP-G132 | 不合格 | Internal | 25MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | |||||||||||||||||||||
| S9S12G128F0MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 131072 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 12x10b | -40°C~125°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G128 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||
 | MK10DN512VMD10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 104 | 524288 | 表面贴装 | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK10DN512 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||
| MIMXRT1021CAF4A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 57 | 表面贴装 | 100-LQFP | A/D 10x12b | -40°C~105°C TJ | Tray | RT1020 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal/External | 396MHz | 128K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 外部程序存储器 | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MKL26Z128VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 23 | 131072 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2013 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL26Z128 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||
 | MCF5474VR266 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | 不用于新设计 | 3 (168 Hours) | 388 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5474 | S-PBGA-B388 | 不合格 | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||
 | MK40DX256VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 98 | 262144 | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK40DX256 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
 | LPC1833JET100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 49 | 524288 | 表面贴装 | 100-TFBGA | YES | A/D 4x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2010 | LPC18xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 3.3V | 0.8mm | LPC1833 | 100 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 16K x 8 | CORTEX-M3 | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||
 | MKE04Z128VLD4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 38 | 表面贴装 | 44-LQFP | A/D 12x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2014 | Kinetis KE04 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 260 | 40 | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| MKE06Z128VLH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 58 | 16384 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE06 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 48MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
 | MC908GP32CFBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 33 | 表面贴装 | 44-QFP | YES | A/D 8x8b | -40°C~85°C TA | Tray | 2006 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | 哑光锡 | ALSO OPERATES AT 3V MINIMUM SUPPLY AT 4.1 MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908GP32 | S-PQFP-G44 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32.8MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||
| LPC1768FET100,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 70 | 524288 | 表面贴装 | 100-TFBGA | YES | A/D 8x12b; D/A 1x10b | -40°C~85°C TA | Tray | 2009 | LPC17xx | e1 | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 未说明 | LPC1768 | 100 | S-PBGA-B100 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M3 | 1.2mm | 9mm | 9mm | ROHS3 Compliant | ||||||||||||||
| MK20DX256VMC7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 70 | 262144 | 表面贴装 | 121-LFBGA | YES | A/D 35x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK20DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||
 | MC68HC705C8ACFNE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 44-LCC (J-Lead) | YES | 24 | -40°C~85°C TA | Tube | 1998 | HC05 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY @ 1 MHZ | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68HC705 | S-PQCC-J44 | 不合格 | 5.5V | 4.5V | Internal | 2.1MHz | 304 x 8 | 3V~5.5V | MICROCONTROLLER | POR, WDT | 4.2MHz | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | 8 | NO | NO | NO | NO | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | |||||||||||||||||||
| MC56F8257VLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F8257 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 4K x 16 | 3V~3.6V | MICROCONTROLLER | 56800E | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 32K x 16 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | NO | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
| MK10DX256VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 104 | 262144 | 表面贴装 | 144-LQFP | YES | A/D 46x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DX256 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
 | MKL03Z32VFK4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 22 | 2048 | 32768 | 表面贴装 | 24-VFQFN Exposed Pad | YES | A/D 7x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL03 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 未说明 | 3.3V | 0.5mm | 未说明 | S-XQCC-N24 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | YES | CORTEX-M0 | 0.65mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||
| MKL03Z8VFK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 22 | 8192 | 表面贴装 | 24-UFQFN Exposed Pad | YES | A/D 7x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL03 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL03Z8 | S-XQCC-N24 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | YES | CORTEX-M0 | 0.65mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||
| MK60FX512VMD12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 524288 | 表面贴装 | 144-LBGA | YES | A/D 58x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK60FX512 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 1.7mm | 13mm | 13mm | ROHS3 Compliant |