制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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![]() | MC9S08PA8VTG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 14 | 8192 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2012 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08PA8 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||
![]() | S912ZVCA96F0MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 表面贴装 | 48-LQFP | A/D 10x12b; D/A 1x8b | -40°C~125°C TA | Tray | 2013 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08SH32VTL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 23 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | A/D 16x10b | -40°C~105°C TA | Tube | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08SH32 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | YES | YES | 9.7mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | MC9S08AC32CFJE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 22 | 32768 | 表面贴装 | 32-LQFP | YES | A/D 6x10b | -40°C~85°C TA | Tray | 2008 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC32 | S-PQFP-G32 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||
![]() | MC9S08GT8ACFBER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 8192 | 表面贴装 | 44-QFP | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08GT8 | S-PQFP-G44 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | NO | 2.45mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||
![]() | MC9S12XA512CAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 91 | 524288 | 表面贴装 | 112-LQFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 2005 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | 哑光锡 | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | 9S12XA512 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 32K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
![]() | MPC5534MZQ80 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 192 | 1048576 | 表面贴装 | 324-BBGA | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | e0 | 不用于新设计 | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1.5V | 1mm | 30 | PC5534 | S-PBGA-B324 | 不合格 | 1.65V | 1.53.35V | 1.35V | External | 80MHz | 64K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 32 | YES | NO | YES | YES | 2.55mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||
![]() | MK30DX128VLH7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 22x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K30 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK30DX128 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||
![]() | S912XHY128F0VLM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 88 | 131072 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 12x10b | -40°C~105°C TA | Bulk | 2008 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.65mm | S912XHY128 | S-PQFP-G112 | 不合格 | 5.5V | 1.83.3/5V | 4.5V | External | 40MHz | 8K x 8 | 4.5V~5.5V | MICROCONTROLLER | LCD, Motor control PWM, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 8K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||
![]() | S912ZVHY32F1CLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 73 | 32768 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 4x10b | -40°C~85°C TA | Tray | 2010 | S12 MagniV | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 12V | 0.5mm | S912ZVHY32 | S-PQFP-G100 | 不合格 | 18V | 6/18V | 5.5V | Internal | 32MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | S12Z | DMA, LCD, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 16 | YES | YES | YES | 32 | 2K x 8 | CPU12 | AEC-Q100 | 32 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
![]() | S9S12G192F0VLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 196608 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 16x10b | -40°C~105°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G192 | S-PQFP-G48 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||
![]() | MK20DN64VLH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 表面贴装 | 64-LQFP | YES | A/D 13x16b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DN64 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
![]() | MC9S08PT32VLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 57 | 32768 | 表面贴装 | 64-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2002 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC9S08PT32 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
![]() | SPC5643LF2MLQ8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 1048576 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 32x12b | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5643 | S-PQFP-G144 | 不合格 | 3.6V | 3.3V | 3V | Internal | 80MHz | 128K x 8 | 3V~5.5V | MICROCONTROLLER | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 280mA | 32 | YES | YES | YES | 32 | AEC-Q100 | 64 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||
![]() | MC9S08QE32CLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 26 | 32768 | 表面贴装 | 32-LQFP | YES | A/D 10x12b | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | MC9S08QE32 | S-PQFP-G32 | 不合格 | 3.6V | 1.8/3.6V | 2V | Internal | 50MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||
![]() | MKM14Z128CHH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 | 表面贴装 | 44-VFLGA Exposed Pad | YES | A/D 5x16b, 4x24b | -40°C~85°C TA | Tray | 2002 | 动力学 KM | 不用于新设计 | 3 (168 Hours) | 44 | 3A991.A.2 | VOLTAGE RANGE: 2.7 V TO 3.6 V (WHEN ANALOG FRONT END (AFE) IS USED) | 8542.31.00.01 | BOTTOM | BUTT | 260 | 3.3V | 0.65mm | 40 | MKM14Z128 | S-XBGA-B44 | 3.6V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | NO | NO | 0.98mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | MC9S08PA8VLD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 37 | 2048 | 8192 | 表面贴装 | 44-LQFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2012 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
![]() | S9S12HY64J0CLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 80 | 65536 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2006 | HCS12 | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5mm | S9S12HY64 | S-PQFP-G100 | 不合格 | 1.85V | Internal | 32MHz | 4K x 8 | 4.5V~5.5V | LCD, Motor control PWM, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 20mA | 16 | 4K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | MC56F8355MFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 49 | 262144 | 表面贴装 | 128-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8355 | R-PQFP-G128 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 10K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | 16 | 11 | YES | YES | 4 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||
![]() | SPC5644AF0MLU2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 84 | 4194304 | Automotive grade | 表面贴装 | 176-LQFP | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2005 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 40 | SPC5644 | S-PQFP-G176 | 不合格 | 1.32V | 1.23.35V | 1.14V | Internal | 120MHz | 192K x 8 | 1.14V~5.25V | MICROCONTROLLER | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 4MB 4M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 400mA | 32 | YES | YES | YES | AEC-Q100 | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||
![]() | MC56F8013MFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 26 | 16384 | 表面贴装 | 32-LQFP | YES | A/D 6x12b | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | MC56F8013 | S-PQFP-G32 | 不合格 | 3.6V | 3.3V | 3V | Internal | 32MHz | 2K x 16 | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 8MHz | FLASH | 16-Bit | 16KB 8K x 16 | I2C, SCI, SPI | 16 | YES | YES | 固定点 | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||
![]() | S9S12VR64AF0MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 表面贴装 | 48-LQFP | A/D 6x10b | -40°C~125°C TA | Tray | 2011 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | IrDA, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | MC56F8135VFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 49 | 65536 | 表面贴装 | 128-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8135 | R-PQFP-G128 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 40MHz | 4K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 64KB 32K x 16 | SCI, SPI | 16 | 11 | YES | YES | 4 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||
![]() | FS32K142HFT0MLHT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 58 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | -40°C~125°C TA | Tray | S32K | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 80MHz | 32K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | MC9S12XS128CAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 44 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2004 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC9S12XS128 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 3.135V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | NO | CPU12 | 1.6mm | 10mm | 10mm | ROHS3 Compliant |