制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 外部数据总线宽度 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | P87C54X2FA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16384 | 表面贴装 | 44-LCC (J-Lead) | YES | 32 | -40°C~85°C TA | Tube | 2003 | 87C | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 30 | P87C54 | 44 | S-PQCC-J44 | 不合格 | 5.5V | 3/5V | 4.5V | Internal | 33MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 33MHz | OTP | 8-Bit | 16KB 16K x 8 | EBI/EMI, UART/USART | 0.05mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | ||||||||||
 | S9S08DZ96F2CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 53 | 表面贴装 | 64-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 2002 | S08 | Obsolete | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3V | 0.5mm | S9S08DZ96 | 5.5V | 2.7V | Internal | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 2K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | P89LPC915FN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 | 2048 | 通孔 | 14-DIP (0.300, 7.62mm) | NO | A/D 4x8b; D/A 1x8b | -40°C~85°C TA | Tube | 2009 | LPC900 | e3 | Obsolete | 1 (Unlimited) | 14 | 哑光锡 | 8542.31.00.01 | DUAL | 未说明 | 2.54mm | unknown | 未说明 | P89LPC915 | 14 | R-PDIP-T14 | 不合格 | 2.5/3.3V | Internal | 18MHz | 256 x 8 | 2.4V~3.6V | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | FLASH | 8-Bit | 2KB 2K x 8 | I2C, UART/USART | 16mA | 8 | ROHS3 Compliant | ||||||||||||||||||||||||
 | PXAH30KFBE,557 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 100-LQFP | 33 | -40°C~85°C TA | Tray | 1999 | XA | Obsolete | 3 (168 Hours) | unknown | PXAH30 | 100 | External | 30MHz | 256 x 8 | 2.7V~5.5V | DMA, WDT | ROMless | 16-Bit | EBI/EMI, UART/USART | 2013-06-14 00:00:00 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P80C557E4EFB/01,51 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 表面贴装 | 80-BQFP | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 1999 | 80C | Obsolete | 3 (168 Hours) | P80C557 | 80 | External | 16MHz | 1K x 8 | 4.5V~5.5V | 8051 | POR, PWM, WDT | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | 2013-06-14 00:00:00 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | S9S12DT12F1MPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 表面贴装 | 112-LQFP | 112-LQFP (20x20) | A/D 16x10b | -40°C~125°C TA | Bulk | 1996 | HCS12 | 不用于新设计 | 3 (168 Hours) | S9S12DT12 | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | HCS12 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| S9S12DJ12F1VPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 表面贴装 | 112-LQFP | YES | A/D 16x10b | -40°C~105°C TA | Bulk | 1996 | HCS12 | yes | 不用于新设计 | 3 (168 Hours) | 112 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12DJ12 | S-PQFP-G112 | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | NO | NO | 16 | 2K x 8 | 8 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||
 | S908GR8E0CDWE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | YES | 17 | e3 | 最后一次购买 | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | 5.5V | 4.5V | 8.2 MHz | MICROCONTROLLER | 32.8MHz | 8 | YES | YES | YES | 17.92mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
.png) | SPC5606SF2CLU6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 133 | 表面贴装 | 176-LQFP | A/D 16x10b | -40°C~85°C TA | Tape & Reel (TR) | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | Internal | 64MHz | 48K x 8 | 3V~5.5V | MICROPROCESSOR, RISC | e200z0h | DMA, LCD, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, QSPI, SCI, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MCF5272CVM66R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 196-LBGA | 196-PBGA (15x15) | 32 | -40°C~85°C TA | Tape & Reel (TR) | 1997 | MCF527x | 不用于新设计 | 3 (168 Hours) | External | 66MHz | 1K x 32 | 3V~3.6V | Coldfire V2 | DMA, WDT | ROM | 32-Bit | 16KB 4K x 32 | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| SPC5747GK0AMMJ6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 178 | 表面贴装 | 256-LBGA | YES | A/D 80x10b, 64x12b | -40°C~125°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 80MHz/120MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | FS32K148URT0VLQR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 128 | 表面贴装 | 144-LQFP | YES | A/D 32x12b; D/A 1x8b | -40°C~105°C TA | Tape & Reel (TR) | S32K | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 112MHz | 256K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | I2S, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||
| FS32K148HNT0VLUT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 176-LQFP | A/D 32x12b; D/A 1x8b | -40°C~105°C TA | Tray | S32K | 活跃 | Internal | 80MHz | 256K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | I2S, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| FS32K148HAT0MLUT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 176-LQFP | A/D 32x12b; D/A 1x8b | -40°C~125°C TA | Tray | S32K | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 80MHz | 256K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | I2S, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MC9S08RC8CFJE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LQFP | 25 | -40°C~85°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MC9S08RC8 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MC9S08RE16CFGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LQFP | 39 | -40°C~85°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MC9S08RE16 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MC9S08RC16FGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LQFP | 39 | 0°C~70°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MC9S08RC16 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MC9S08RD16FJE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LQFP | 25 | 0°C~70°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MC9S08RD16 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MC68336GMAB20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 | 表面贴装 | 160-BQFP | A/D 16x10b | -40°C~125°C TA | Tray | 1996 | M683xx | Obsolete | 3 (168 Hours) | MC68336 | External | 20MHz | 7.5K x 8 | 4.75V~5.25V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| MC68336ACAB20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 | 表面贴装 | 160-BQFP | A/D 16x10b | -40°C~85°C TA | Tray | 1996 | M683xx | Obsolete | 3 (168 Hours) | MC68336 | External | 20MHz | 7.5K x 8 | 4.75V~5.25V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| MC68332AMAG20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | 15 | -40°C~125°C TA | Tray | 1996 | M683xx | Obsolete | 3 (168 Hours) | MC68332 | Internal | 20MHz | 2K x 8 | 4.5V~5.5V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MC68336AMAB20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 | 表面贴装 | 160-BQFP | 160-QFP (28x28) | A/D 16x10b | -40°C~125°C TA | Tray | 1996 | M683xx | Obsolete | 3 (168 Hours) | MC68336 | External | 20MHz | 7.5K x 8 | 4.75V~5.25V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| MC68HC11D0CFNE3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | 26 | -40°C~85°C TA | Tube | HC11 | Obsolete | 3 (168 Hours) | MC68HC11 | Internal | 3MHz | 192 x 8 | 4.5V~5.5V | HC11 | POR, WDT | ROMless | 8-Bit | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MC9S08RC16FJE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LQFP | 25 | 0°C~70°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | MC9S08RC16 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| MC68376BGVAB20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 | 表面贴装 | 160-BQFP | A/D 16x10b | -40°C~105°C TA | Tray | 1996 | M683xx | Obsolete | 3 (168 Hours) | MC68376 | External | 20MHz | 7.5K x 8 | 4.75V~5.25V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant |