制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 外部数据总线宽度 | 只读存储器可编程性 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||
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 | PXAG37KFBD,157 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LQFP | YES | 32 | -40°C~85°C TA | Tray | 2013 | XA | e3 | Obsolete | 1 (Unlimited) | 44 | Tin (Sn) | QUAD | 鸥翼 | 0.8mm | PXAG37 | S-PQFP-G44 | 不合格 | 3/5V | External | 30MHz | 512 x 8 | 2.7V~5.5V | PWM, WDT | OTP | 16-Bit | 32KB 32K x 8 | UART/USART | 80mA | 16 | XA | UVPROM | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | P87C52SFAA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 表面贴装 | 44-LCC (J-Lead) | YES | 32 | -40°C~85°C TA | Tube | 2011 | 87C | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 30 | P87C52 | 44 | S-PQCC-J44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 16MHz | OTP | 8-Bit | 8KB 8K x 8 | EBI/EMI, UART/USART | 15mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.57mm | 16.585mm | 16.585mm | ROHS3 Compliant | |||||||||||
 | P87C52SBPN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | 0°C~70°C TA | Tube | 2011 | 87C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | 8542.31.00.01 | DUAL | 未说明 | 5V | 2.54mm | 未说明 | P87C52 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 16MHz | OTP | 8-Bit | 8KB 8K x 8 | EBI/EMI, UART/USART | 15mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | ||||||||||||
| P89C664HFA/00,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 65536 | 表面贴装 | 44-LCC (J-Lead) | YES | 32 | -40°C~85°C TA | Tube | 2002 | 89C | yes | Obsolete | 3 (168 Hours) | 44 | EAR99 | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 40 | P89C664H | 44 | S-PQCC-J44 | 不合格 | 5.25V | 5V | 4.75V | Internal | 33MHz | 2K x 8 | 4.75V~5.25V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 33MHz | FLASH | 8-Bit | 64KB 64K x 8 | I2C, UART/USART | 64mA | 8 | NO | NO | YES | NO | 16 | 8 | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | |||||||||||
 | MC908LJ24CPKE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 48 | 表面贴装 | 80-LQFP | A/D 6x10b | -40°C~85°C TA | Tray | 2005 | HC08 | Obsolete | 3 (168 Hours) | MC908LJ24 | Internal | 8MHz | 768 x 8 | 3V~5.5V | LCD, LVD, POR, PWM | FLASH | 8-Bit | 24KB 24K x 8 | I2C, IRSCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MC9S08DV128MLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 87 | 表面贴装 | 100-LQFP | A/D 24x12b | -40°C~125°C TA | Tray | 2002 | S08 | Obsolete | 3 (168 Hours) | MC9S08DV128 | External | 40MHz | 6K x 8 | 2.7V~5.5V | LVD, POR, PWM, WDT | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
.png) | SAC57D52LCVLTR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 208-LQFP Exposed Pad | YES | A/D 24x12b | -40°C~105°C TA | Tape & Reel (TR) | MAC57Dxxx | 活跃 | 3 (168 Hours) | 208 | QUAD | 鸥翼 | 1.25V | 0.5mm | 1.32V | 1.2V | Internal | 80MHz, 160MHz, 320MHz | 2.3M x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-A5, -M4, -M0+ | DMA, LCD, LVD/HVD, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI | 32 | YES | YES | YES | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | P87C51FB-4B,557 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-QFP | 32 | 0°C~70°C TA | Tray | 2016 | 87C | Obsolete | 3 (168 Hours) | P87C51 | 44 | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | 8051 | POR, PWM | OTP | 8-Bit | 16KB 16K x 8 | EBI/EMI, UART/USART | 2013-06-14 00:00:00 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MCF51AG96CLK | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 69 | 表面贴装 | 80-LQFP | A/D 24x12b | -40°C~85°C TA | Tray | 2010 | MCF51AG | Obsolete | 3 (168 Hours) | MCF51AG96 | Internal | 50MHz | 16K x 8 | 2.7V~5.5V | Coldfire V1 | DMA, LVD, PWM, WDT | FLASH | 32-Bit | 96KB 96K x 8 | I2C, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P89LPC985FA,529 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 表面贴装 | 28-LCC (J-Lead) | YES | 26 | -40°C~85°C TA | Tube | 2009 | LPC900 | e3 | Obsolete | 1 (Unlimited) | 28 | 哑光锡 | QUAD | J BEND | 225 | 1.27mm | 未说明 | P89LPC98* | 28 | S-PQCC-J28 | 不合格 | 2.5/5V | Internal | 18MHz | 512 x 8 | 2.4V~5.5V | 8051 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 12mA | 8 | ROHS3 Compliant | ||||||||||||||||||||||||||
| P89LPC9351FA,529 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 | 8192 | 表面贴装 | 28-LCC (J-Lead) | YES | A/D 8x8b; D/A 2x8b | -40°C~85°C TA | Tube | 2003 | LPC900 | e3 | Obsolete | 1 (Unlimited) | 28 | Matte Tin (Sn) | QUAD | J BEND | 245 | 1.27mm | 未说明 | P89LPC93*1 | 28 | S-PQCC-J28 | 不合格 | 2.5/3.3V | Internal | 18MHz | 768 x 8 | 2.4V~3.6V | 8051 | Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 23mA | 8 | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||
 | MC9S12E256VFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 60 | 表面贴装 | 80-QFP | 80-QFP (14x14) | A/D 16x10b; D/A 2x8b | -40°C~105°C TA | Tray | 2005 | HCS12 | Obsolete | 3 (168 Hours) | MC9S12E256 | Internal | 25MHz | 16K x 8 | 2.35V~2.75V | HCS12 | POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | EBI/EMI, I2C, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | PK40N512VLQ100 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 98 | 表面贴装 | 144-LQFP | A/D 27x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | Obsolete | 3 (168 Hours) | PK40N512 | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| SAC57D53MCVLT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 208-LQFP Exposed Pad | YES | A/D 24x12b | -40°C~105°C TA | Tray | MAC57Dxxx | 活跃 | 3 (168 Hours) | 208 | QUAD | 鸥翼 | 1.25V | 0.5mm | 1.32V | 1.2V | Internal | 80MHz, 160MHz, 320MHz | 2.3M x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-A5, -M4, -M0+ | DMA, LCD, LVD/HVD, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 3MB 3M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI | 32 | YES | YES | YES | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||||||||||||||
| P89V660FA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16384 | 表面贴装 | 44-LCC (J-Lead) | YES | 36 | -40°C~85°C TA | Tube | 2008 | 89V | Obsolete | 3 (168 Hours) | 44 | 3A991.A.2 | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 40 | P89V66* | 44 | S-PQCC-J44 | 不合格 | 5.5V | 5V | 4.5V | Internal | 40MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 50mA | 8 | NO | NO | YES | NO | 16 | 8 | 4.57mm | 16.585mm | 16.585mm | ROHS3 Compliant | ||||||||||||
 | MC9S08DN32AMLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 39 | 表面贴装 | 48-LQFP | 48-LQFP (7x7) | A/D 16x12b | -40°C~125°C TA | Tray | S08 | Obsolete | 3 (168 Hours) | MC9S08DN32 | External | 40MHz | 1.5K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| P89C660HBA/00,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16384 | 表面贴装 | 44-LCC (J-Lead) | YES | 32 | 0°C~70°C TA | Tube | 2002 | 89C | Obsolete | 3 (168 Hours) | 44 | 3A991.A.2 | 8542.31.00.01 | QUAD | J BEND | 245 | 5V | 1.27mm | 40 | P89C660H | 44 | S-PQCC-J44 | 不合格 | 5.5V | 5V | 4.5V | Internal | 33MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 33MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, UART/USART | 64mA | 8 | NO | NO | YES | NO | 16 | 8 | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | ||||||||||||
| P89LV51RB2BA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 32 | 0°C~70°C TA | Tube | 2009 | 89LV | Obsolete | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | unknown | P89LV51R | 44 | Internal | 33MHz | 512 x 8 | 2.7V~3.6V | 8051 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MC908QB4MDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 10x10b | -40°C~125°C TA | Tube | HC08 | Obsolete | 3 (168 Hours) | MC908QB4 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MK20DN512ZAB10R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 120-UFBGA, WLCSP | 79 | 0°C~70°C TA | Tape & Reel (TR) | 2012 | Kinetis K20 | Obsolete | 3 (168 Hours) | MK20DN512 | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | P89LPC921FDH,518 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | 18 | -40°C~85°C TA | Tape & Reel (TR) | 2003 | LPC900 | Obsolete | 2 (1 Year) | P89LPC92* | 20 | Internal | 18MHz | 256 x 8 | 2.4V~3.6V | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | FLASH | 8-Bit | 4KB 4K x 8 | I2C, UART/USART | 2013-06-14 00:00:00 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| MC908GR48ACFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 表面贴装 | 48-LQFP | A/D 24x10b | -40°C~85°C TA | Tray | 2007 | HC08 | Obsolete | 3 (168 Hours) | MC908GR48 | Internal | 8MHz | 1.5K x 8 | 3V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 48KB 48K x 8 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| P87C661X2FA,529 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | 32 | -40°C~85°C TA | Tube | 2003 | 87C | Obsolete | 3 (168 Hours) | P87C661 | Internal | 33MHz | 512 x 8 | 2.7V~5.5V | 8051 | POR, PWM, WDT | OTP | 8-Bit | 16KB 16K x 8 | EBI/EMI, I2C, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| P87C661X2BBD,157 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LQFP | 32 | 0°C~70°C TA | Tray | 2003 | 87C | Obsolete | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | unknown | P87C661 | 44 | Internal | 33MHz | 512 x 8 | 2.7V~5.5V | 8051 | POR, PWM, WDT | OTP | 8-Bit | 16KB 16K x 8 | EBI/EMI, I2C, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| P87C51RC+4N,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | 0°C~70°C TA | Tube | 87C | e3 | yes | Obsolete | 1 (Unlimited) | 40 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 245 | 4V | 2.54mm | 40 | P87C51 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 16MHz | OTP | 8-Bit | 32KB 32K x 8 | EBI/EMI, UART/USART | 15mA | 8 | NO | NO | YES | NO | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant |