制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | MC908QY4MDWER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 5 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | A/D 4x8b | -40°C~125°C TA | Tape & Reel (TR) | 2005 | HC08 | Obsolete | 3 (168 Hours) | MC908QY4 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08DV60AMLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 53 | 表面贴装 | 64-LQFP | A/D 16x12b | -40°C~125°C TA | Tray | 2016 | S08 | Obsolete | 2 (1 Year) | MC9S08DV60 | External | 40MHz | 3K x 8 | 2.7V~5.5V | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MCL908QY2CDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 4x8b | -40°C~85°C TA | Tube | 2005 | HC08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | MCL908QY2 | Internal | 2MHz | 128 x 8 | 2.4V~3.6V | MICROCONTROLLER | LVD, POR, PWM | FLASH | 8-Bit | 1.5KB 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S9S12G96ACLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 3K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
.png) | MK22FN128CAK10R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 35 | 24576 | 131072 | 表面贴装 | 49-UFBGA, WLCSP | YES | A/D 2x16b; D/A 1x12b | -40°C~85°C TA | Tape & Reel (TR) | 2015 | Kinetis K20 | 活跃 | 1 (Unlimited) | 49 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 3.3V | 0.4mm | 未说明 | R-PBGA-B49 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 3.142mm | 2.915mm | ROHS3 Compliant | |||||||||||||||
| S9S12GA64F0MLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 12x12b | -40°C~125°C TA | Tape & Reel (TR) | 2013 | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MC705C8ACPBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LQFP | 44-LQFP (10x10) | 24 | -40°C~85°C TA | Tray | 2002 | HC05 | Obsolete | 3 (168 Hours) | MC705C8 | Internal | 2.1MHz | 304 x 8 | 3V~5.5V | HC05 | POR, WDT | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S912ZVMC12F1VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~105°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | Internal | 50MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | S912XDG128F2MAAR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 59 | 12288 | 131072 | 表面贴装 | 80-QFP | YES | A/D 8x10b, 16x10b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | 不用于新设计 | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 2.5V | 0.635mm | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 12K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | 23 | 2K x 8 | CPU12 | 16 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||
 | MC9S08PL32CLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 30 | 表面贴装 | 32-LQFP | YES | A/D 12x10b | -40°C~85°C TA | S08 | 活跃 | 3 (168 Hours) | 32 | QUAD | 鸥翼 | 3V | 0.8mm | 5.5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 20MHz | FLASH | 32-Bit | 32KB 32K x 8 | LINbus, SCI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
| S9S12GA64F0WLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 65536 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 12x12b | -40°C~150°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 3A001.A.2.A | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S-PQFP-G48 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 20mA | 16 | YES | NO | YES | 2K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||
 | LPC54114J256BD64QL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 50 | 196608 | 262144 | 表面贴装 | 64-LQFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2010 | LPC54100 | e3 | 活跃 | 1 (Unlimited) | 64 | Tin (Sn) | QUAD | 鸥翼 | 3.3V | 0.5mm | 64 | S-PQFP-G64 | 3.6V | 1.62V | Internal | 100MHz | 192K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit Dual-Core | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | 32 | YES | YES | YES | NO | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
| S9S12GA48AMLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 12x12b | -40°C~125°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MC912D60ACPV8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 68 | 表面贴装 | 112-LQFP | YES | A/D 16x8/10b | -40°C~85°C TA | Tray | 2000 | HC12 | Obsolete | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.65mm | MC912D60 | S-PQFP-G112 | 5.5V | 4.5V | Internal | 8MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 60KB 60K x 8 | CANbus, MI Bus, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 1K x 8 | 16 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||
| MC705L16CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 80-QFP | 80-QFP (14x14) | 16 | -40°C~85°C TA | Tray | 2005 | HC05 | Obsolete | 3 (168 Hours) | MC705 | Internal | 2.1MHz | 512 x 8 | 3V~5.5V | HC05 | LCD, POR, WDT | OTP | 8-Bit | 16KB 16K x 8 | SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| LPC2132FBD64,151 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 47 | 65536 | 表面贴装 | 64-LQFP | YES | A/D 8x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2003 | LPC2100 | Obsolete | 1 (Unlimited) | 64 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | unknown | 未说明 | LPC2132 | 64 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 64KB 64K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | NO | YES | YES | 8 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||
| LPC804M111JDH24J | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 20 | 表面贴装 | 24-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b; D/A 1x10b | -40°C~105°C TA | Tape & Reel (TR) | LPC80xM | 活跃 | 1 (Unlimited) | 24 | DUAL | 鸥翼 | 260 | 3.3V | 0.65mm | 未说明 | 3.6V | 1.71V | Internal | 15MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 15MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 8 | YES | YES | YES | 7.8mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||
| S912ZVML32F1MKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~125°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | Internal | 50MHz | 4K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | SPC5516GBMLQ66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 111 | 表面贴装 | 144-LQFP | A/D 40x12b | -40°C~125°C TA | Tray | 2006 | MPC55xx Qorivva | Obsolete | 3 (168 Hours) | SPC5516 | Internal | 66MHz | 64K x 8 | 4.5V~5.25V | e200z0, e200z1 | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | P89LPC915HDH,129 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 | 表面贴装 | 14-TSSOP (0.173, 4.40mm Width) | 14-TSSOP | A/D 4x8b; D/A 1x8b | -40°C~125°C TA | Tube | 2009 | LPC900 | Obsolete | 1 (Unlimited) | P89LPC915 | Internal | 18MHz | 256 x 8 | 2.4V~3.6V | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | FLASH | 8-Bit | 2KB 2K x 8 | I2C, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MCR908JL3ECDWER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 23 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | A/D 12x8b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | 不用于新设计 | 3 (168 Hours) | 260 | 40 | External | 8MHz | 128 x 8 | 2.7V~3.3V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | P89LPC9107FN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 | 1024 | 通孔 | 14-DIP (0.300, 7.62mm) | NO | A/D 4x10b | -40°C~85°C TA | Tube | 2003 | LPC900 | e4 | Obsolete | 1 (Unlimited) | 14 | 镍钯金 | 8542.31.00.01 | DUAL | 260 | 3.3V | 2.54mm | 30 | P89LPC910* | 14 | R-PDIP-T14 | 不合格 | 3.6V | 2.5/3.3V | 3V | Internal | 18MHz | 128 x 8 | 2.4V~3.6V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | 18MHz | FLASH | 8-Bit | 1KB 1K x 8 | UART/USART | 11mA | 8 | YES | NO | YES | YES | 4.2mm | 19.025mm | 7.62mm | ROHS3 Compliant | ||||||||||||||
 | LPC11H35FBD64/401, | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Tray | 2012 | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908GZ48CFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 表面贴装 | 48-LQFP | A/D 24x10b | -40°C~85°C TA | Tray | 2007 | HC08 | Obsolete | 3 (168 Hours) | MC908GZ48 | Internal | 8MHz | 1.5K x 8 | 3V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC68HC908QT2CFQ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 8-VDFN Exposed Pad | YES | 5 | -40°C~85°C TA | Tray | 2010 | HC08 | Obsolete | 1 (Unlimited) | 8 | DUAL | 无铅 | 5V | 0.8mm | MC68HC908 | R-PDSO-N8 | 不合格 | 2.7V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | 7mA | 8 | YES | NO | YES | 4mm | 4mm | ROHS3 Compliant |