制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S9S12G96AMLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 12x10b | -40°C~125°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 3K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | S912XEG384J2VALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 91 | 表面贴装 | 112-LQFP | A/D 16x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 24K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | SP5745BFK1AVMH2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 65 | 表面贴装 | 100-LBGA | YES | A/D 36x10b, 16x12b | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 120MHz | 256K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 11mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||
 | SPC5748CSK0AVKU2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | -40°C~105°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||
| S912XDP512J1VAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 32768 | 524288 | 表面贴装 | 112-LQFP | YES | A/D 8x10b, 16x10b | -40°C~105°C TA | Tray | 1996 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 112 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 32K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||
 | S912XHY256F0CLL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 99 Weeks | 76 | 12288 | 262144 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 12x10b | -40°C~85°C TA | Tray | 2007 | HCS12X | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S-PQFP-G100 | 不合格 | 5.5V | 1.83.3/5V | 4.5V | External | 40MHz | 12K x 8 | 4.5V~5.5V | MICROCONTROLLER | LCD, Motor control PWM, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 8K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| S9S12GA192F0MLLR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 86 | 11264 | 196608 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 2x8b | -40°C~125°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23.5mA | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||
 | P80C552EFB/08,557 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 表面贴装 | 80-BQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2002 | 80C | Obsolete | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.8mm | P80C552 | 80 | R-PQFP-G80 | 5.5V | 4.5V | Internal | 16MHz | 256 x 8 | 4.5V~5.5V | MICROCONTROLLER | 8051 | POR, PWM, WDT | 16MHz | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | 8 | YES | NO | YES | NO | 16 | 8 | 3.2mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||||||||||
 | P80C32SBPN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | 0°C~70°C TA | Tube | 2003 | 80C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | 8542.31.00.01 | DUAL | 未说明 | 5V | 2.54mm | 未说明 | P80C32 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 16MHz | ROMless | 8-Bit | UART/USART | 15mA | 8 | NO | NO | NO | NO | 16 | 8 | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | |||||||||||||
 | SPC5747CK1CMJ6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 178 | 表面贴装 | 256-LBGA | A/D 80x10b, 64x12b | -40°C~85°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | e200z2, e200z4 | DMA, LVD, POR, WDT | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| S912XEG128BVALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 表面贴装 | 112-LQFP | A/D 16x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 12K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| S912XEG384BVAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 24576 | 393216 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||
| SPC5604CAVLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | A/D 28x10b | 表面贴装 | 100-LQFP | YES | 79 | -40°C~105°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5604 | 5.5V | 4.5V | Internal | 64MHz | 48K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
 | FS32K144MNT0MLHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 58 | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | -40°C~125°C TA | Tape & Reel (TR) | S32K | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | compliant | 40 | 5.5V | 2.7V | Internal | 64MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 10mm | 10mm | 符合RoHS标准 | ||||||||||||||||||||||
 | MCF53010CQT240 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-LQFP | 61 | -40°C~85°C TA | Tray | 2010 | MCF5301x | Obsolete | 3 (168 Hours) | MCF53010 | Internal | 240MHz | 128K x 8 | 1.08V~3.6V | Coldfire V3 | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MCF5473ZP200 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 388-BBGA | 388-PBGA (27x27) | 99 | 0°C~70°C TA | Tray | 2007 | MCF547x | Obsolete | 3 (168 Hours) | MCF5473 | External | 200MHz | 32K x 8 | 1.43V~1.58V | Coldfire V4E | DMA, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MCHC908MR8CFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | A/D 7x10b | 表面贴装 | 32-LQFP | 16 | -40°C~85°C TA | Tray | 2005 | HC08 | Obsolete | 3 (168 Hours) | MCHC908MR8 | Internal | 8MHz | 256 x 8 | 4.5V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S912B32E4MFUE8R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 63 | 表面贴装 | 80-QFP | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 1994 | HC12 | 不用于新设计 | 3 (168 Hours) | External | 8MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | SCI, SPI | 768 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | P89LPC921FN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 20-DIP (0.300, 7.62mm) | 18 | -40°C~85°C TA | Tube | 2003 | LPC900 | Obsolete | 1 (Unlimited) | P89LPC92* | Internal | 18MHz | 256 x 8 | 2.4V~3.6V | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | FLASH | 8-Bit | 4KB 4K x 8 | I2C, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | MK22DN512VDC5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 56 | 表面贴装 | 121-XFBGA | A/D 20x16b; D/A 1x12b | -40°C~105°C TA | Tray | Kinetis K20 | 活跃 | 3 (168 Hours) | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S912ZVC12F0MKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 42 | 表面贴装 | 64-LQFP Exposed Pad | A/D 16x10b; D/A 1x8b | -40°C~125°C TA | Tape & Reel (TR) | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MC9S08GT8ACBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 34 | 通孔 | 42-SDIP (0.600, 15.24mm) | A/D 8x10b | -40°C~85°C TA | Tube | 2006 | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MC9S08GT8 | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
.png) | SP5746CSK1AMMJ6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 178 | 表面贴装 | 256-LBGA | YES | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | LPC1112FHN24/202J | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 19 | 4096 | 16384 | 表面贴装 | 24-VFQFN Exposed Pad | YES | A/D 6x10b | -40°C~85°C TA | Tape & Reel (TR) | 2009 | LPC1100L | 活跃 | 1 (Unlimited) | 24 | QUAD | 无铅 | 3.3V | 0.5mm | 24 | S-PQCC-N24 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 4mm | 4mm | ROHS3 Compliant | ||||||||||||||||||
| MC9S08DZ32MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 39 | 表面贴装 | 48-LQFP | A/D 16x12b | -40°C~125°C TA | Tray | 2005 | S08 | Obsolete | 3 (168 Hours) | unknown | MC9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant |