制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 以太网 | USB | 只读存储器可编程性 | 源Url状态检查日期 | SPI,SPI | 脉宽调制 | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||||||||||||||||||||||||||||||||||
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 | MCF51QU64VHS | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 31 | 63536 | 表面贴装 | 44-VFLGA Exposed Pad | YES | A/D 11x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2004 | MCF51Qx | 活跃 | 3 (168 Hours) | 44 | 5A992 | QUAD | 无铅 | 260 | 3V | 0.65mm | 40 | MCF51QU64 | S-XQCC-N44 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | External | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | Coldfire V1 | DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 0.98mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC43S20FET180E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 118 | 表面贴装 | 180-TFBGA | A/D 8x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC43xx | Discontinued | 3 (168 Hours) | 未说明 | 未说明 | 180 | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P80C652EBA/04,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 44-LCC (J-Lead) | 32 | 0°C~70°C TA | Tube | 2011 | 80C | Obsolete | 3 (168 Hours) | P80C652 | Internal | 16MHz | 256 x 8 | 4.5V~5.5V | 8051 | POR | ROMless | 8-Bit | EBI/EMI, I2C, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68HC705C8AB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 42-SDIP (0.600, 15.24mm) | 42-PDIP | 24 | 0°C~70°C TA | Tube | HC05 | Obsolete | 1 (Unlimited) | MC68HC705 | Internal | 2.1MHz | 304 x 8 | 3V~5.5V | HC05 | POR, WDT | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912ZVM16F1MKF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 31 | 表面贴装 | 48-LQFP Exposed Pad | A/D 4x12b | -40°C~125°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 50MHz | 2K x 8 | 3.5V~40V | S12Z | DMA, POR, WDT | FLASH | 16-Bit | 16KB 16K x 8 | SCI | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC4350FET180,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 118 | 0 | 表面贴装 | 180-TFBGA | YES | A/D 8x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC43xx | e1 | 活跃 | 3 (168 Hours) | 180 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 未说明 | LPC4350 | 180 | S-PBGA-B180 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | CORTEX-M4 | 32 | FLASH | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12KT256MPVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 91 | 表面贴装 | 112-LQFP | A/D 16x10b | -40°C~125°C TA | Tray | 2003 | HCS12 | Obsolete | 3 (168 Hours) | MC9S12K256 | Internal | 25MHz | 12K x 8 | 2.35V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S12GN32F1CTJR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 14 | 2048 | 32768 | Automotive grade | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 20 | 8542.31.00.01 | DUAL | 鸥翼 | 5V | 0.65mm | R-PDSO-G20 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | 1K x 8 | CPU12 | AEC-Q100 | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P89LPC902FD,512 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | P89 | CISC | 18 | 18 | 8 | 64KB | 有 | UART | 6 | 2 | 0 | 1 | 0 | 0 | 1 | 2 | 2.4 | 2.5|3.3 | 3.6 | 1500 | -40 | 85 | Industrial | 无 | SOP | SO | 表面贴装 | 1.45(Max) | 5(Max) | 4(Max) | 8 | Gull-wing | EAR99 | Tube | Obsolete | 8 | 128B | Flash | 1KB | 8051 | 0 | 0 | 0 | 1 | 80C51 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC1317FHN33,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 65536 | 表面贴装 | 32-VQFN Exposed Pad | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2010 | LPC13xx | 活跃 | 3 (168 Hours) | 33 | QUAD | 无铅 | 未说明 | 3.3V | 0.65mm | 未说明 | LPC1317 | 32 | S-PQCC-N33 | 不合格 | 3.6V | 3.3V | 2V | Internal | 72MHz | 10K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | NO | NO | NO | 4K x 8 | CORTEX-M3 | 2013-06-14 00:00:00 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC1346FHN33,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 49152 | 表面贴装 | 32-VQFN Exposed Pad | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2010 | LPC13xx | 活跃 | 3 (168 Hours) | 33 | QUAD | 无铅 | 未说明 | 3.3V | 0.65mm | 未说明 | LPC1346 | 32 | S-PQCC-N33 | 不合格 | 3.6V | 3.3V | 2V | Internal | 72MHz | 10K x 8 | 2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 48KB 48K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | NO | NO | NO | 4K x 8 | CORTEX-M3 | 2013-06-14 00:00:00 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKE18F256VLL16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 89 | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xF | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 5V | 0.5mm | 未说明 | 5.5V | 2.7V | Internal | 168MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | DMA, LVD, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, SPI, UART/USART | 32 | YES | YES | YES | 68K x 8 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912ZVCA64F0CLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 表面贴装 | 48-LQFP | A/D 10x12b; D/A 1x8b | -40°C~85°C TA | Tape & Reel (TR) | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 4K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MKL33Z128VMP4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 54 | 表面贴装 | 64-LFBGA | YES | A/D 20x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL3 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | S-PBGA-B64 | 3.6V | 1.71V | Internal | 48MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LCD, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S12G240F0MLHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 表面贴装 | 64-LQFP | YES | A/D 16x10b | -40°C~125°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | 5.5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC11A13JHI33/201E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 28 | 表面贴装 | 32-VFQFN Exposed Pad | A/D 8x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2014 | LPC11Axx | 活跃 | 3 (168 Hours) | 未说明 | 未说明 | LPC11A13 | 32 | Internal | 50MHz | 6K x 8 | 2.6V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | FLASH | 32-Bit | 24KB 24K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5746BK1AMMH2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 100-LBGA | A/D 36x10b, 16x12b | -40°C~125°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 120MHz | 384K x 8 | 3.15V~5.5V | e200z4 | DMA, I2S, POR, WDT | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68HC908LJ24CPB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 表面贴装 | 64-LQFP | A/D 6x10b | -40°C~85°C TA | Tray | 2016 | HC08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | MC68HC908 | Internal | 8MHz | 768 x 8 | 3V~5.5V | MICROCONTROLLER | LCD, LVD, POR, PWM | FLASH | 8-Bit | 24KB 24K x 8 | I2C, IRSCI, SPI | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SC511663MZP40 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 101 | 表面贴装 | 272-BBGA | A/D 32x10b | -40°C~125°C TA | Tray | 1998 | MPC5xx | 不用于新设计 | 3 (168 Hours) | SC511663 | External | 40MHz | 26K x 8 | 2.5V~2.7V | PowerPC | POR, PWM, WDT | FLASH | 32-Bit | 448KB 448K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | P87C52X2FN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | -40°C~85°C TA | Tube | 2003 | 87C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ | 8542.31.00.01 | DUAL | 未说明 | 5V | 2.54mm | 未说明 | P87C52 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 4.5V | Internal | 33MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 33MHz | OTP | 8-Bit | 8KB 8K x 8 | EBI/EMI, UART/USART | 8 | NO | NO | NO | NO | 16 | 8 | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51QM32VHS | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 31 | 32768 | 表面贴装 | 44-VFLGA Exposed Pad | YES | A/D 2x16b, 11x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2004 | MCF51Qx | 活跃 | 3 (168 Hours) | 44 | 5A992 | QUAD | 无铅 | 260 | 3V | 0.65mm | 40 | MCF51QM32 | S-XQCC-N44 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | External | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER | Coldfire V1 | DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | EBI/EMI, I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 0.98mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XDT512J1CAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 20480 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | S-PQFP-G144 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 20K x 8 | 3.15V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5747CK1VMJ6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 178 | Automotive grade | 表面贴装 | 256-LBGA | YES | A/D 80x10b, 64x12b | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | yes | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 1.2V | 1mm | S-PBGA-B256 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912XET256W1VAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 表面贴装 | 112-LQFP | A/D 16x12b | -40°C~105°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 16K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC908AP32ACFBER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 32 | 表面贴装 | 44-QFP | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908AP32 | S-PQFP-G44 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 32KB 32K x 8 | I2C, IRSCI, SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 10mm | 10mm | ROHS3 Compliant |