制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||
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 | LPC54005JBD100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 64 | 表面贴装 | 100-LQFP | A/D 12x12b | -40°C~105°C TA | Tray | LPC540xx | 活跃 | 3 (168 Hours) | Internal | 180MHz | 360K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | ROMless | 32-Bit | EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MCF5481CVR166 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 388-BBGA | YES | 99 | -40°C~85°C TA | Tray | 2001 | MCF548x | e1 | 不用于新设计 | 3 (168 Hours) | 388 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5481 | S-PBGA-B388 | 不合格 | 3.6V | 3V | External | 166MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.67MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | 浮点 | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||
 | S9S12G48BCLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 表面贴装 | 32-LQFP | YES | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | 32 | QUAD | 鸥翼 | 5V | 0.8mm | S-PQFP-G32 | 5.5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | NO | 1.5K x 8 | 8 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||
| S9S12GN16BMLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 表面贴装 | 32-LQFP | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 1K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MC705C8ACFNER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | 24 | -40°C~85°C TA | Tape & Reel (TR) | 1994 | HC05 | 不用于新设计 | 3 (168 Hours) | MC705C8 | Internal | 2.1MHz | 304 x 8 | 3V~5.5V | HC05 | POR, WDT | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | S912ZVMC12F1MKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~125°C TA | Tape & Reel (TR) | 2012 | S12 MagniV | Obsolete | 3 (168 Hours) | Internal | 50MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| S912ZVML12F1WKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 8192 | 表面贴装 | 64-LQFP Exposed Pad | YES | A/D 9x12b | -40°C~150°C TA | Tape & Reel (TR) | 2012 | S12 MagniV | Obsolete | 3 (168 Hours) | 64 | 3A001.A.2.A | QUAD | 鸥翼 | 0.5mm | S-PQFP-G64 | 不合格 | 5.5/18V | Internal | 50MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 55mA | 16 | 512 x 8 | CPU12 | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| S912ZVML12F1MKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 表面贴装 | 64-LQFP Exposed Pad | 64-LQFP (10x10) | A/D 9x12b | -40°C~125°C TA | Tape & Reel (TR) | 2011 | S12 MagniV | Obsolete | 3 (168 Hours) | Internal | 50MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC68332GCAG25 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 15 | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 144 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC68332 | S-PQFP-G144 | 不合格 | Internal | 25MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||
.png) | SPC5748CK0AMMJ6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 178 | 表面贴装 | 256-LBGA | YES | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | SPC5675KFF0VMM2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 257-LFBGA | A/D 22x12b | -40°C~105°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5675 | Internal | 180MHz | 512K x 8 | 1.14V~5.5V | MICROCONTROLLER | e200z7d | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | LPC812M101FDH20FP | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16384 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 18 | -40°C~105°C TA | Tube | 2010 | LPC81xM | Obsolete | 1 (Unlimited) | 20 | DUAL | 鸥翼 | 未说明 | 3.3V | 0.65mm | 未说明 | LPC812M | 20 | R-PDSO-G20 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | NO | NO | NO | NO | CORTEX-M0 | 1.1mm | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||
 | MC9S12E64CPV | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 92 | 表面贴装 | 112-LQFP | YES | A/D 16x10b; D/A 2x8b | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | Obsolete | 3 (168 Hours) | 112 | EAR99 | 哑光锡 | ALSO REQUIRES 3.3V OR 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12E64 | S-PQFP-G112 | 不合格 | 2.75V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~2.75V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 16 | 16 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||
| S912XET256BCAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 表面贴装 | 144-LQFP | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 16K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MC68HC908QY2CPE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 通孔 | 16-DIP (0.300, 7.62mm) | A/D 4x8b | -40°C~85°C TA | Tube | 2005 | HC08 | Obsolete | 1 (Unlimited) | MC68HC908 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 1.5KB 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5746GK1MKU6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | FLASH | 32-Bit Tri-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||
 | MCHC912B32VFUE8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 63 | 表面贴装 | 80-QFP | YES | A/D 8x10b | -40°C~105°C TA | Tray | 1994 | HC12 | e3 | 不用于新设计 | 3 (168 Hours) | 80 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MCHC912B32 | S-PQFP-G80 | 不合格 | 5.5V | 4.5V | External | 8MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | SCI, SPI | 16 | YES | NO | YES | NO | 16 | 768 x 8 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | SP5746BFK1AVMH6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 65 | 表面贴装 | 100-LBGA | YES | A/D 36x10b, 16x12b | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 160MHz | 384K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 11mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MC9S08QE128CLHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 54 | 表面贴装 | 64-LQFP | A/D 22x12b | -40°C~85°C TA | Tape & Reel (TR) | 2014 | S08 | Obsolete | 3 (168 Hours) | MC9S08QE128 | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | LVD, PWM, WDT | FLASH | 8-Bit | 128KB 128K x 8 | I2C, LINbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| SPC5603EEF2MLHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 39 | 表面贴装 | 64-LQFP | A/D 4x10b | -40°C~125°C TA | Tape & Reel (TR) | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5603 | Internal | 64MHz | 96K x 8 | 3V~3.6V | e200z0h | DMA, POR, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC68HC16Z1VEH16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 | 0 | 表面贴装 | 132-BQFP Bumpered | YES | A/D 8x10b | -40°C~105°C TA | Tray | 1996 | HC16 | 不用于新设计 | 3 (168 Hours) | 132 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.635mm | MC68HC16 | S-PQFP-G132 | 不合格 | 5V | Internal | 16MHz | 1K x 8 | 2.7V~5.5V | CPU16 | POR, PWM, WDT | ROMless | 16-Bit | EBI/EMI, SCI, SPI | 16 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | MCF5270CVM150R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 196-LBGA | YES | 97 | -40°C~85°C TA | Tape & Reel (TR) | 1997 | MCF527x | e1 | 不用于新设计 | 3 (168 Hours) | 196 | 5A992 | 锡银铜 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5270 | S-PBGA-B196 | 不合格 | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | 固定点 | YES | 1.6mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||
| P89LPC952FA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 8192 | 表面贴装 | 44-LCC (J-Lead) | YES | A/D 8x10b | -40°C~85°C TA | Tube | 2003 | LPC900 | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | ALSO OPERATES AT 2.4V SUPPLY | 8542.31.00.01 | QUAD | J BEND | 245 | 3.3V | 1.27mm | 30 | P89LPC95* | 44 | S-PQCC-J44 | 不合格 | 3.6V | 2.5/3.3V | 3V | Internal | 18MHz | 512 x 8 | 2.4V~3.6V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, POR, PWM, WDT | 18MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 23mA | 8 | YES | NO | YES | YES | 4.57mm | 16.585mm | 16.585mm | ROHS3 Compliant | ||||||||||||||
 | MC68HRC908JK1CDW | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | A/D 12x8b | -40°C~85°C TA | Tube | HC08 | Obsolete | 1 (Unlimited) | 8542.31.00.01 | MC68HRC908 | External | 8MHz | 128 x 8 | 2.7V~3.3V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 1.5KB 1.5K x 8 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | P80C32X2BBD,157 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 | 表面贴装 | 44-LQFP | YES | 32 | 0°C~70°C TA | Tray | 2003 | 80C | e3 | Obsolete | 1 (Unlimited) | 44 | Tin (Sn) | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 30 | P80C32 | 44 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 4.5V | Internal | 33MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 33MHz | ROMless | 8-Bit | EBI/EMI, UART/USART | 8 | NO | NO | NO | NO | 16 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant |