制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S9S08DZ32F2VLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 25 | 表面贴装 | 32-LQFP | YES | A/D 10x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | S08 | 活跃 | 3 (168 Hours) | 32 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | 5.5V | 2.7V | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 1K x 8 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MMC2114CFCVF33 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 | 表面贴装 | 196-LBGA | A/D 8x10b | -40°C~85°C TA | Tray | 2002 | MCore | Obsolete | 3 (168 Hours) | unknown | MMC2114 | Internal | 33MHz | 32K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | M210 | LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, SCI, SPI | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
 | SC68376BGVAB25 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 | 表面贴装 | 160-BQFP | 160-QFP (28x28) | A/D 16x10b | -40°C~105°C TA | Tray | 1996 | M683xx | 不用于新设计 | 3 (168 Hours) | SC68376 | External | 25MHz | 7.5K x 8 | 4.75V~5.25V | CPU32 | POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | SPC5747CGK0AVKU6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | -40°C~105°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | S912XDT384J1MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 20480 | 393216 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 112 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 20K x 8 | 3.15V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
 | FS32K144MAT0VLHT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 64-LQFP | A/D 16x12b; D/A 1x8b | -40°C~105°C TA | Tray | S32K | 活跃 | Internal | 64MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | |||||||||||||||||||||||||||||||||||||||||||||
 | MCF5307FT90B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 208-BFQFP | 16 | 0°C~70°C TA | Tray | 1999 | MCF530x | Obsolete | 3 (168 Hours) | MCF5307 | External | 90MHz | 4K x 8 | 3V~3.6V | Coldfire V3 | DMA, POR, WDT | ROMless | 32-Bit | EBI/EMI, I2C, UART/USART | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | P87C51FA-4A,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 表面贴装 | 44-LCC (J-Lead) | YES | 32 | 0°C~70°C TA | Tube | 2003 | 87C | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 245 | 4V | 1.27mm | 30 | P87C51 | 44 | S-PQCC-J44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR, PWM | 16MHz | OTP | 8-Bit | 8KB 8K x 8 | EBI/EMI, UART/USART | 15mA | 8 | NO | NO | YES | NO | 4.57mm | 16.585mm | 16.585mm | ROHS3 Compliant | |||||||||||||||
 | S9S12ZVLS1F0MFM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 19 | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | A/D 6x10b | -40°C~125°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MC908GZ60MFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-QFP | YES | A/D 24x10b | -40°C~125°C TA | Tray | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY @ 4MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908GZ60 | S-PQFP-G64 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 2K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | 8 | YES | NO | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||
 | LPC4327JET100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 49 | 1048576 | 表面贴装 | 100-TFBGA | YES | A/D 4x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2010 | LPC43xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 未说明 | 3.3V | 0.8mm | 未说明 | LPC4327 | 100 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | 25MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | NO | YES | 24 | 16K x 8 | CORTEX-M4 | 32 | 1.2mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||
 | S912XDT256F1MAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 59 | 16384 | 262144 | 表面贴装 | 80-QFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | 不用于新设计 | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 2.5V | 0.635mm | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 16K x 8 | 3.15V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
 | MCF51JE256VML | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 69 | 262144 | 表面贴装 | 104-LFBGA | YES | A/D 12x12b; D/A 1x12b | -40°C~105°C TA | Box | 2010 | MCF51JE | e1 | 活跃 | 3 (168 Hours) | 104 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 0.8mm | 40 | MCF51JE256 | S-PBGA-B104 | 不合格 | 3.6V | 2/3.3V | 1.8V | External | 50MHz | 32K x 8 | 1.8V~3.6V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | YES | 1.52mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||
 | MKV44F128VLL16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 74 | 表面贴装 | 100-LQFP | YES | A/D 38x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 未说明 | 3.6V | 1.71V | Internal | 168MHz | 24K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | YES | YES | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||
 | LPC2146FBD64,557 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 45 | 262144 | 表面贴装 | 64-LQFP | YES | A/D 14x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2003 | LPC2100 | e3 | 不用于新设计 | 2 (1 Year) | 64 | Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC214* | 64 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 40K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 256KB 256K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | NO | YES | YES | 2013-06-14 00:00:00 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||
 | P80C51FA-4N,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | 0°C~70°C TA | Tube | 2006 | 80C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | 8542.31.00.01 | DUAL | 未说明 | 4V | 2.54mm | unknown | 未说明 | P80C51 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR, PWM | 16MHz | ROMless | 8-Bit | EBI/EMI, UART/USART | 15mA | 8 | NO | NO | YES | NO | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | ||||||||||||||||
 | SPC5606EF2VMC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 39 | 表面贴装 | 121-LFBGA | A/D 4x10b | -40°C~105°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5606 | Internal | 64MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MC908JL8MPE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 | 通孔 | 28-DIP (0.600, 15.24mm) | 28-PDIP | A/D 13x8b | -40°C~125°C TA | Tube | 2005 | HC08 | Obsolete | 1 (Unlimited) | MC908JL8 | Internal | 8MHz | 256 x 8 | 4.5V~5.5V | HC08 | LED, LVD, POR, PWM | FLASH | 8-Bit | 8KB 8K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| S912ZVL64F0VFM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 19 | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | A/D 6x10b | -40°C~105°C TA | Tray | S12 MagniV | 活跃 | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | 512 x 8 | |||||||||||||||||||||||||||||||||||||||||||||
 | MC908QT1ACPE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | 8-PDIP | 5 | -40°C~85°C TA | Tube | 2010 | HC08 | Obsolete | 不适用 | MC908QT1 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | HC08 | LVD, POR, PWM | FLASH | 8-Bit | 1.5KB 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | P89LPC932A1FDH,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8192 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | 26 | -40°C~85°C TA | Tube | 2000 | LPC900 | e4 | Obsolete | 2 (1 Year) | 28 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 30 | P89LPC932 | 28 | R-PDSO-G28 | 不合格 | 3.6V | 2.5/3.3V | 2.4V | Internal | 18MHz | 768 x 8 | 2.4V~3.6V | MICROCONTROLLER | 8051 | Brown-out Detect/Reset, LED, POR, PWM, WDT | 12MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 18mA | 8 | NO | NO | YES | NO | 1.1mm | 9.7mm | 4.4mm | ROHS3 Compliant | |||||||||||||||
| MC908GZ60CFJE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 21 | 表面贴装 | 32-LQFP | A/D 24x10b | -40°C~85°C TA | Tray | 2007 | HC08 | Obsolete | 3 (168 Hours) | MC908GZ60 | Internal | 8MHz | 2K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | SPC5675KFAVMM2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 257-LFBGA | A/D 22x12b | -40°C~105°C TA | Tray | 2012 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5675 | Internal | 180MHz | 512K x 8 | 1.14V~5.5V | e200z7d | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S912XEG384BCAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 24576 | 393216 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||
 | MC908SR12CBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 29 | 通孔 | 42-SDIP (0.600, 15.24mm) | 42-PDIP | A/D 11x10b | -40°C~85°C TA | Tube | HC08 | Obsolete | 1 (Unlimited) | MC908SR12 | Internal | 8MHz | 512 x 8 | 2.7V~5.5V | HC08 | LVD, POR, PWM, Temp Sensor | FLASH | 8-Bit | 12KB 12K x 8 | I2C, SCI | ROHS3 Compliant |