制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S912XET256W1MAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 59 | 16384 | 262144 | Automotive grade | 表面贴装 | 80-QFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | MC908AB32CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 51 | 表面贴装 | 64-QFP | YES | A/D 8x8b | -40°C~85°C TA | Tray | 2000 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908AB32 | S-PQFP-G64 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 1K x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, PWM | 33.6MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 8 | YES | NO | YES | NO | 512 x 8 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||
 | S9S12XS128J1MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 131072 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 2008 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S9S12XS128 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
 | MK50DN512CLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 96 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 41x16b; D/A 2x12b | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK50DN512 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
 | S9S12XS128J1MAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 44 | 131072 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 2004 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | S9S12XS128 | S-PQFP-G64 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | CPU12 | AEC-Q100 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||
 | MKE06Z64VLK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 71 | 16384 | 131072 | 表面贴装 | 80-LQFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2014 | Kinetis KE06 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S-PQFP-G80 | 5.5V | 2.7V | Internal | 48MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 8 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | MKL03Z8VFG4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 14 | 8192 | 表面贴装 | 16-UFQFN Exposed Pad | YES | A/D 7x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL03 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL03Z8 | S-XQCC-N16 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | CORTEX-M0 | 3mm | 3mm | ROHS3 Compliant | ||||||||||||
 | S9KEAZN8AMTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 14 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x12b | -40°C~125°C TA | Tape & Reel (TR) | 2013 | Kinetis KEA | e3 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.5mm | 40 | R-XQCC-N24 | 5.5V | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | NO | YES | YES | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||
 | FS32K144HFT0VLLR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 89 | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | -40°C~105°C TA | Tape & Reel (TR) | 2011 | S32K | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | 5.5V | 2.7V | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||
 | S912ZVMBA6F0VLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 15 | 表面贴装 | 48-LQFP | A/D 5x10b | -40°C~105°C TA | Tray | 2015 | S12 MagniV | 活跃 | 3 (168 Hours) | unknown | Internal | 32MHz | 4K x 8 | 3.5V~40V | MICROCONTROLLER | S12Z | DMA, LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MK22FN512VMP12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 131072 | 524288 | 表面贴装 | 64-LFBGA | YES | A/D 22x16b; D/A 2x12b | -40°C~105°C TA | Tray | 1996 | Kinetis K20 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | S-PBGA-B64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 5mm | 5mm | ROHS3 Compliant | ||||||||||||
| MK10DN32VLH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 44 | 32768 | 表面贴装 | 64-LQFP | YES | A/D 19x16b | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DN32 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||
| MC9S08JM32CQH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 51 | 32768 | 表面贴装 | 64-QFP | YES | A/D 12x12b | -40°C~85°C TA | Tray | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08JM32 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | External | 48MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 24MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI, USB | 8 | YES | YES | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||
 | S9S12GN32BVLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 表面贴装 | 32-LQFP | A/D 8x10b | -40°C~105°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| MC9S12XDT256MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 91 | 262144 | 表面贴装 | 112-LQFP | YES | A/D 16x10b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12XDT256 | S-PQFP-G112 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 16K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||
| MKL05Z32VLC4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 32768 | 表面贴装 | 32-LQFP | YES | A/D 14x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2010 | Kinetis KL0 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AND 12-BIT DAC AVAILABLE | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | MKL05Z32 | S-PQFP-G32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||
 | MK50DX256CMC10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 78 | 262144 | 表面贴装 | 121-LFBGA | YES | A/D 27x16b; D/A 2x12b | -40°C~85°C TA | Tray | 2002 | Kinetis K50 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK50DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||
| MC9S08QE8CTG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 12 | 8192 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08QE8 | R-PDSO-G16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||
 | MK61FN1M0VMJ12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 128 | 1048576 | 表面贴装 | 256-LBGA | YES | A/D 77x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | 活跃 | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK61FN1M0 | S-PBGA-B256 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||
| MC9S12XS128MAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 59 | 131072 | 表面贴装 | 80-QFP | YES | A/D 8x12b | -40°C~125°C TA | Tray | 2004 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | MC9S12XS128 | S-PQFP-G80 | 不合格 | 5.5V | 3.3/5V | 3.135V | External | 40MHz | 8K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | NO | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||
 | MKL04Z32VFK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 22 | 32768 | 表面贴装 | 24-VFQFN Exposed Pad | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL04Z32 | S-XQCC-N24 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1mm | 4mm | 4mm | ROHS3 Compliant | ||||||||||||
| MCF52236CAF50 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 56 | 262144 | 表面贴装 | 80-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2004 | MCF5223x | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.65mm | 40 | MCF52236 | S-PQFP-G80 | 不合格 | 3.6V | 3.3V | 3V | Internal | 50MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||
| MC9S12XEQ512CAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | MC9S12XEQ512 | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||
| MK10DX256VMC7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 74 | 262144 | 表面贴装 | 121-LFBGA | YES | A/D 39x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||
 | MKL14Z32VFM4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 32768 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 9x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL14Z32 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | NO | CORTEX-M0 | 5mm | 5mm | Non-RoHS Compliant |