制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | LPC54016JET180E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 145 | 表面贴装 | 180-TFBGA | A/D 12x12b | -40°C~105°C TA | Tray | LPC540xx | 活跃 | 3 (168 Hours) | Internal | 180MHz | 360K x 8 | 1.71V~3.6V | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | S9S08RNA8W2VTG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 12 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 8x10b | -40°C~105°C TA | Tube | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | SP5744BBK1AMMH2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 65 | 表面贴装 | 100-LBGA | YES | A/D 36x10b, 16x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 260 | 1.25V | 1mm | 40 | 1.32V | 1.2V | Internal | 120MHz | 192K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 11mm | 11mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | S912DT12PE2VPVER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 67 | 表面贴装 | 112-LQFP | A/D 16x8/10b | -40°C~105°C TA | Tape & Reel (TR) | 2013 | HC12 | 不用于新设计 | 3 (168 Hours) | Internal | 8MHz | 8K x 8 | 4.5V~5.5V | CPU12 | POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | LPC18S37JET100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 49 | 表面贴装 | 100-TFBGA | 100-TFBGA (9x9) | A/D 4x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2010 | LPC18xx | 活跃 | 3 (168 Hours) | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, POR, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | S9S08DV60F2MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 1996 | S08 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 5V | 0.5mm | 未说明 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||
 | S9S08AW32E7CFDER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 38 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2000 | S08 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 无铅 | 3V | 0.5mm | 5.5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| S9S08RNA8W2MTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 12 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | S9S08RNA8W2MLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 26 | 表面贴装 | 32-LQFP | A/D 12x12b | -40°C~125°C TA | Tray | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | SPC5603BAVLQ4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 123 | 表面贴装 | 144-LQFP | A/D 36x10b | -40°C~105°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 260 | 40 | SPC5603 | Internal | 48MHz | 28K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 384KB 384K x 8 | CANbus, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | P87C54X2BN,112 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16384 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 32 | 0°C~70°C TA | Tube | 2003 | 87C | e3 | Obsolete | 1 (Unlimited) | 40 | Tin (Sn) | ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ | 8542.31.00.01 | DUAL | 未说明 | 5V | 2.54mm | unknown | 未说明 | P87C54 | 40 | R-PDIP-T40 | 不合格 | 5.5V | 3/5V | 4.5V | Internal | 33MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | 8051 | POR | 33MHz | OTP | 8-Bit | 16KB 16K x 8 | EBI/EMI, UART/USART | 8 | NO | NO | NO | NO | 16 | 8 | 4.7mm | 52mm | 15.24mm | ROHS3 Compliant | ||||||||||||
| MC68332GVAG16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 144-LQFP | YES | 15 | -40°C~105°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 144 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC68332 | S-PQFP-G144 | 不合格 | Internal | 16MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 16MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||
 | SPC5604CK0CLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | A/D 28x10b | 表面贴装 | 100-LQFP | YES | 79 | -40°C~85°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5604 | 5.5V | 4.5V | Internal | 64MHz | 48K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||
 | SPC5645BF0MMJ1 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 199 | 表面贴装 | 256-LBGA | YES | A/D 33x10b, 10x12b | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 256 | BOTTOM | BALL | 260 | 5V | 1mm | 40 | SPC5645 | 5.5V | 4.5V | Internal | 120MHz | 160K x 8 | 3V~5.5V | 单片机RISC | e200z4d | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||
| MCF5212CAE66R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 55 | 表面贴装 | 64-LQFP | A/D 8x12b | -40°C~85°C TA | Tape & Reel (TR) | 2002 | MCF521x | 不用于新设计 | 3 (168 Hours) | 260 | 40 | Internal | 66MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| MC908QY2AMDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 6x10b | -40°C~125°C TA | Tube | 2010 | HC08 | Obsolete | 3 (168 Hours) | MC908QY2 | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 1.5KB 1.5K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| SPC5602BF2VLL4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 79 | 262144 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 28x10b | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5602 | S-PQFP-G100 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 24K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| MC9S08RE16CFDER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN-EP (7x7) | 39 | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | Obsolete | 3 (168 Hours) | MC9S08RE16 | Internal | 8MHz | 1K x 8 | 1.8V~3.6V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| S912XEP100J4MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 91 | 65536 | 1048576 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||
 | S912ZVML12F1VKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~105°C TA | Tape & Reel (TR) | 2011 | S12 MagniV | yes | Obsolete | 3 (168 Hours) | Internal | 50MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| FS32K144MNT0VLLT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 89 | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | -40°C~105°C TA | Tray | 2011 | S32K | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | compliant | 40 | 5.5V | 2.7V | Internal | 64MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||
 | MCF51JF32VFM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 22 | 32768 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 6x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2004 | MCF51Jx | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 1V | 0.5mm | 40 | MCF51JF32 | S-XQCC-N32 | 不合格 | 1.1V | 1.8/3.3V | 0.9V | External | 50MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER | Coldfire V1 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||
 | MC908MR32VFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 44 | 表面贴装 | 64-QFP | YES | A/D 10x10b | -40°C~105°C TA | Tray | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC908MR32 | S-PQFP-G64 | 5.5V | 4.5V | Internal | 8MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | 8 | YES | YES | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
 | MC9S08SE8VWLR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 24 | 512 | 8192 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | A/D 10x10b | -40°C~105°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 28 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | R-PDSO-G28 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | 17.925mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||
 | MCP11A1CFNE3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 38 | 表面贴装 | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | A/D 8x8b | -40°C~85°C TA | Tube | 1996 | HC11 | Obsolete | 3 (168 Hours) | MCP11A1 | External | 3MHz | 256 x 8 | 4.5V~5.5V | HC11 | POR, WDT | ROMless | 8-Bit | SCI, SPI | 512 x 8 | ROHS3 Compliant |