制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | S912XEG256J2CAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 16384 | 262144 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||
 | MMC2114CFCVM33 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 104 | 表面贴装 | 196-LBGA | 196-MAPBGA (15x15) | A/D 8x10b | -40°C~85°C TA | Tray | 2002 | MCore | Obsolete | 3 (168 Hours) | MMC2114 | Internal | 33MHz | 32K x 8 | 2.7V~3.6V | M210 | LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, SCI, SPI | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | S9S08RN48W1VLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 39 | 表面贴装 | 48-LQFP | A/D 16x12b | -40°C~105°C TA | Tray | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 48K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MCF5281CVF66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 142 | 表面贴装 | 256-LBGA | A/D 8x10b | -40°C~85°C TA | Tray | 2009 | MCF528x | Obsolete | 3 (168 Hours) | 8542.31.00.01 | unknown | MCF5281 | External | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | MCHC11F1VFNE3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 30 | 表面贴装 | 68-LCC (J-Lead) | YES | A/D 8x8b | -40°C~105°C TA | Tube | 1993 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 24.23mm | 24.23mm | ROHS3 Compliant | ||||||||||||||||||
 | MKV11Z128VFM7P | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | compliant | 未说明 | 3.6V | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | YES | YES | NO | 5mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||
 | SPC5747GK1CKU6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | A/D 80x10b, 64x12b | -40°C~85°C TA | Bulk | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| MC9S08PT32AVLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 4096 | 32768 | A/D 16x12b | 表面贴装 | 48-LQFP | YES | 41 | -40°C~105°C TA | Tray | 2013 | S08 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | S-PQFP-G48 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||
 | MCF51AC128AVPUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 54 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 20x12b | -40°C~105°C TA | Tray | 2007 | MCF51AC | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MCF51AC128 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 32 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||
 | MC9S12GC32MFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 60 | 32768 | 表面贴装 | 80-QFP | YES | A/D 8x10b | -40°C~125°C TA | Tray | 2015 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12GC32 | S-PQFP-G80 | 不合格 | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||
 | LPC832M101FDH20FP | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | A/D 5x12b | -40°C~85°C TA | Tube | 2010 | LPC83x | 活跃 | 1 (Unlimited) | 260 | 未说明 | 20 | Internal | 30MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | MK22FN1M0AVLK12R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 56 | 表面贴装 | 80-LQFP | YES | A/D 27x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2015 | Kinetis K20 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.8mm | 未说明 | 3.6V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MC9S08DZ128CLLR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 87 | 表面贴装 | 100-LQFP | YES | A/D 24x12b | -40°C~85°C TA | Tape & Reel (TR) | 2010 | S08 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | 5.5V | 2.7V | External | 40MHz | 8K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 2K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
 | MKL46Z256VMP4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 50 | 32768 | 262144 | 表面贴装 | 64-LFBGA | YES | A/D 16x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL4 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.5mm | 40 | S-PBGA-B64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||
 | SPC5646BCF0VLU8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 3145728 | A/D 27x10b, 5x12b | Automotive grade | 表面贴装 | 176-LQFP | YES | 147 | -40°C~105°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 176 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5646 | S-PQFP-G176 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 120MHz | 192K x 8 | 3V~5.5V | 单片机RISC | e200z4d | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, I2C, LINbus, SCI, SPI | 300mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||
 | LPC1114FHN33/333,5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 28 | 57344 | 表面贴装 | 32-VQFN Exposed Pad | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2009 | LPC1100L | 活跃 | 3 (168 Hours) | 33 | QUAD | 无铅 | 3.3V | 0.65mm | LPC1114 | 32 | S-PQCC-N32 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 56KB 56K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 2013-06-14 00:00:00 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
| S912XET256BVAAR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 59 | 表面贴装 | 80-QFP | A/D 8x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 16K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MK10DN128VLH5R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 44 | 131072 | 表面贴装 | 64-LQFP | YES | A/D 19x16b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DN128 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||
| S912XEQ512J2CAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 32768 | 524288 | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||
| S912XDG256F1MAAR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 59 | 表面贴装 | 80-QFP | A/D 8x10b, 16x10b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | 不用于新设计 | 3 (168 Hours) | External | 80MHz | 14K x 8 | 2.35V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MKM33Z64CLL5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 68 | 表面贴装 | 100-LQFP | YES | A/D 12x16b, 4x24b | -40°C~85°C TA | Tray | 2002 | 动力学 KM | e3 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | VOLTAGE RANGE: 2.7 V TO 3.6 V (WHEN ANALOG FRONT END (AFE) IS USED) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LCD, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | NO | NO | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||
 | SPC5602BF2VLQ4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 123 | 262144 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 36x10b | -40°C~105°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5602 | S-PQFP-G144 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 24K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||
 | MCF51JM32VQH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 51 | 32768 | 表面贴装 | 64-QFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2007 | MCF51JM | e3 | 活跃 | 3 (168 Hours) | 64 | 5A992 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MCF51JM32 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | External | 50MHz | 16K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 32KB 32K x 8 | CANbus, I2C, SCI, SPI, USB OTG | 32 | YES | NO | YES | NO | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||
| SPC5604PGF1VLL6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 68 | 524288 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 30x10b | -40°C~105°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | SPC5604 | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 40K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 89mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 32 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| LPC43S30FBD144E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 83 | 表面贴装 | 144-LQFP | YES | A/D 8x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC43xx | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | 144 | 3.6V | 2V | Internal | 204MHz | 264K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Dual-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 16 | 16 | 20mm | 20mm | ROHS3 Compliant |