制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 只读存储器可编程性 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | MC56F8346VFVER2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 62 | 65536 | 表面贴装 | 144-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tape & Reel (TR) | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8346 | S-PQFP-G144 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 6K x 16 | 2.25V~3.6V | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 128KB 64K x 16 | CANbus, EBI/EMI, SCI, SPI | 16 | 16 | YES | YES | 16 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||
 | LPC1777FBD208,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 165 | 524288 | 表面贴装 | 208-LQFP | YES | A/D 8x12b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC17xx | e3 | 活跃 | 2 (1 Year) | 208 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC1777 | 208 | S-PQFP-G208 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | 32 | 1.6mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||
 | MC68HC11A0CFNE3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 38 | 表面贴装 | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | A/D 8x8b | -40°C~85°C TA | Tube | 1996 | HC11 | Obsolete | 3 (168 Hours) | MC68HC11 | External | 3MHz | 256 x 8 | 4.5V~5.5V | HC11 | POR, WDT | ROMless | 8-Bit | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | S9S08RNA8W2CTJR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 16 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | A/D 10x10b | -40°C~85°C TA | Tape & Reel (TR) | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | SPC5602BK0CLL4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 79 | 表面贴装 | 100-LQFP | A/D 28x10b | -40°C~85°C TA | Tray | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5602 | Internal | 48MHz | 24K x 8 | 3V~5.5V | e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| S912XEP768J4MAG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 786432 | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | S912XEP768 | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 48K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 768KB 768K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||
 | MC908AZ32ACFUER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40 | 表面贴装 | 64-QFP | A/D 15x8b | -40°C~85°C TA | Tape & Reel (TR) | 2006 | HC08 | 不用于新设计 | 3 (168 Hours) | MC908AZ32 | Internal | 8MHz | 1K x 8 | 4.5V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | DSP56853FGE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 128-LQFP | YES | 41 | -40°C~85°C TA | Tray | 1998 | 568xx | Obsolete | 3 (168 Hours) | 128 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.5mm | 40 | DSP56853 | R-PQFP-G128 | 1.98V | 1.62V | External | 120MHz | 4K x 16 | 1.62V~1.98V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | DMA, POR, WDT | 240MHz | SRAM | 16-Bit | 24KB 12K x 16 | EBI/EMI, SCI, SPI, SSI | 21 | YES | YES | 16 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MC9RS08KA4CWGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 14 | 4096 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 12x10b | -40°C~85°C TA | Tape & Reel (TR) | 2013 | RS08 | 活跃 | 3 (168 Hours) | 16 | 8542.31.00.01 | DUAL | 鸥翼 | 1.27mm | MC9RS08KA4 | R-PDSO-G16 | 不合格 | 2/5V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | LVD, POR, PWM, WDT | FLASH | 8-Bit | 4KB 4K x 8 | I2C | 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | MC68HC908EY16CFA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 | 表面贴装 | 32-LQFP | A/D 8x10b | -40°C~85°C TA | Tray | HC08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | MC68HC908 | Internal | 8MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, PWM | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | S9S08EL16F1MTL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 22 | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | A/D 16x10b | -40°C~125°C TA | Tube | 1998 | S08 | 活跃 | 3 (168 Hours) | External | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | MPC561MZP56R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 64 | 0 | 表面贴装 | 388-BBGA | YES | A/D 32x10b | -40°C~125°C TA | Tape & Reel (TR) | 1999 | MPC5xx | e0 | 不用于新设计 | 3 (168 Hours) | 388 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 240 | 2.6V | 1mm | 30 | MPC561 | S-PBGA-B388 | 不合格 | 2.7V | 2.65V | 2.5V | External | 56MHz | 32K x 8 | 2.5V~2.7V | MICROCONTROLLER, RISC | PowerPC | POR, PWM, WDT | 20MHz | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | NO | NO | 24 | 32 | FLASH | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||
 | S9S08SG32E1CTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 12 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 1999 | S08 | 活跃 | 3 (168 Hours) | 16 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
| S9S08SG32E1VTJR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | -40°C~105°C TA | Tape & Reel (TR) | 1999 | S08 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
| S9S12GN32F1MLCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 26 | 2048 | 32768 | Automotive grade | 表面贴装 | 32-LQFP | YES | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 1997 | HCS12 | 活跃 | 3 (168 Hours) | 32 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.8mm | S-PQFP-G32 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | 1K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||
 | S9S08RN32W1MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 55 | 表面贴装 | 64-LQFP | A/D 16x12b | -40°C~125°C TA | Tray | 2012 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| SPC5607BAVLQ6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 121 | 表面贴装 | 144-LQFP | YES | A/D 15x10b, 5x12b | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5607 | 5.5V | 4.5V | Internal | 64MHz | 96K x 8 | 3V~5.5V | 单片机RISC | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 1.5MB 1.5M x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||
 | SPC5745BK1VMH2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 表面贴装 | 100-LBGA | A/D 36x10b, 16x12b | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | Internal | 120MHz | 256K x 8 | 3.15V~5.5V | e200z4 | DMA, I2S, POR, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 64K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
.png) | S9KEAZN64AVLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 28 | 表面贴装 | 32-LQFP | A/D 16x12b | -40°C~105°C TA | Tray | 2013 | Kinetis KEA | 活跃 | 3 (168 Hours) | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| MC908QY2ACDWER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 13 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 6x10b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | ALSO OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MC908QY2 | R-PDSO-G16 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | 8 | YES | NO | YES | NO | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||
 | LPC54S016JBD100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64 | 表面贴装 | 100-LQFP | A/D 12x12b | -40°C~105°C TA | Tray | LPC540xx | 活跃 | 3 (168 Hours) | Internal | 180MHz | 360K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
 | MCF5206FT25A | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | 8 | 0°C~70°C TA | Tray | 1996 | MCF520x | Obsolete | 1 (Unlimited) | MCF5206 | External | 25MHz | 512 x 8 | 4.75V~5.25V | Coldfire V2 | POR, WDT | ROMless | 32-Bit | I2C, UART/USART | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5746CHK0AMMH6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 100-LBGA | A/D 80x10b, 64x12b | -40°C~125°C TA | Bulk | MPC57xx | 活跃 | 3 (168 Hours) | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | e200z2, e200z4 | DMA, LVD, POR, WDT | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XEG128J2CAAR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 59 | 12288 | 131072 | 表面贴装 | 80-QFP | YES | A/D 8x12b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 2K x 8 | CPU12 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||
 | S912XET256W1CALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 16384 | 262144 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant |