制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S9S12GN32AVLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 8x10b | -40°C~105°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5742PFK1AMLQ8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 144-LQFP | YES | A/D 64x12b | -40°C~125°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 3.3V | 0.5mm | S-PQFP-G144 | 3.6V | 3.15V | Internal | 180MHz | 192K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32 | NO | YES | NO | NO | 8 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | LPC1768UKZ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 70 | 表面贴装 | 100-UFBGA, WLCSP | YES | A/D 8x12b; D/A 1x10b | -40°C~85°C TA | Tape & Reel (TR) | 2010 | LPC17xx | 活跃 | 1 (Unlimited) | 100 | BOTTOM | BALL | 未说明 | 3.3V | 0.5mm | 未说明 | 100 | 3.6V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | YES | 5.07mm | 5.07mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | MK20DN512ZVMB10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 81-LBGA | YES | 52 | -40°C~105°C TA | Tray | 2013 | Kinetis K20 | Obsolete | 3 (168 Hours) | 81 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 0.65mm | MK20DN512 | S-PBGA-B81 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MKM14Z128CHH5R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 20 | 表面贴装 | 44-VFLGA Exposed Pad | YES | A/D 5x16b, 4x24b | -40°C~85°C TA | Tape & Reel (TR) | 2002 | 动力学 KM | 不用于新设计 | 3 (168 Hours) | 44 | 3A991.A.2 | VOLTAGE RANGE: 2.7 V TO 3.6 V (WHEN ANALOG FRONT END (AFE) IS USED) | 8542.31.00.01 | BOTTOM | BUTT | 未说明 | 3.3V | 0.65mm | 未说明 | S-XBGA-B44 | 3.6V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | NO | NO | 0.98mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||
 | S9S08DZ60F1MLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 25 | 表面贴装 | 32-LQFP | 32-LQFP (7x7) | A/D 10x12b | -40°C~125°C TA | Tray | 2008 | S08 | Obsolete | 3 (168 Hours) | S9S08DZ60 | External | 40MHz | 4K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | MCF5470VR200 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | 不用于新设计 | 3 (168 Hours) | 388 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5470 | S-PBGA-B388 | 不合格 | 1.58V | 1.43V | External | 200MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.55mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
 | S912XET256W1CAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 16384 | 262144 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||
 | MC908QC8CDXE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | A/D 10x10b | -40°C~85°C TA | Tube | 2006 | HC08 | Obsolete | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | 未说明 | 未说明 | MC908QC8 | Internal | 8MHz | 384 x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | MCF5251CVM140R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 225-LFBGA | YES | A/D 6x12b | -40°C~85°C TA | Tape & Reel (TR) | 2006 | MCF525x | e1 | 不用于新设计 | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 40 | S-PBGA-B225 | 1.32V | 1.08V | External | 140MHz | 128K x 8 | 1.08V~3.6V | MICROPROCESSOR | Coldfire V2 | DMA | 140MHz | ROMless | 32-Bit | ATA, Audio, CANbus, EBI/EMI, I2C, IDE, SD, SPI, UART/USART, USB OTG | 32 | 24 | YES | NO | 32 | 固定点 | YES | 1.6mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||
| LPC1812JBD144E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 83 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 8x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2010 | LPC18xx | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 3.3V | 0.5mm | LPC1812 | 144 | S-PQFP-G144 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 104K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART | 32 | YES | YES | YES | 16K x 8 | CORTEX-M3 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MKL04Z32VFK4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 22 | 表面贴装 | 24-VFQFN Exposed Pad | YES | A/D 12x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL0 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | S-XQCC-N24 | 3.6V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 1mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MC9S08QD4MSCR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 256 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | -40°C~125°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | Matte Tin (Sn) | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MC9S08DZ32CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 53 | 表面贴装 | 64-LQFP | A/D 24x12b | -40°C~85°C TA | Tray | 2002 | S08 | Obsolete | 3 (168 Hours) | unknown | MC9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
 | S912ZVMC64F3WKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 31 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | -40°C~150°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 50MHz | 4K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| S912ZVL64F0VLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 19 | 表面贴装 | 32-LQFP | A/D 6x10b | -40°C~105°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | LPC844M201JHI33Y | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 29 | 表面贴装 | 32-VFQFN Exposed Pad | A/D 12x12b | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC84x | 活跃 | 3 (168 Hours) | Internal/External | 30MHz | 8K x 8 | 1.8V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| S9S08DZ32F2CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 53 | 表面贴装 | 64-LQFP | A/D 24x12b | -40°C~85°C TA | Tray | 1996 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | S9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| MC68HC908JB16FA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 32-LQFP | 21 | 0°C~70°C TA | Tray | HC08 | Obsolete | 1 (Unlimited) | 8542.31.00.01 | MC68HC908 | Internal | 6MHz | 384 x 8 | 4V~5.5V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 16KB 16K x 8 | SCI, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| S912XEQ384F1VAGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 99 Weeks | 119 | 24576 | 393216 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||
| MK22DN512VLH5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 524288 | 表面贴装 | 64-LQFP | YES | A/D 18x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK22DN512 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
 | MC908JK1ECDWER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 14 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 12x8b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HC08 | 不用于新设计 | 3 (168 Hours) | 20 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | 5.5V | 4.5V | External | 8MHz | 128 x 8 | 2.7V~3.3V | MICROCONTROLLER | LED, LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | 8 | YES | NO | YES | 12.8mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| S912XEQ384BVAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 91 | 393216 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S912XEQ384 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||
 | MC9S08AC16MBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 | 通孔 | 42-SDIP (0.600, 15.24mm) | YES | A/D 8x10b | -40°C~125°C TA | Tube | 2008 | S08 | Obsolete | 不适用 | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3V | 0.8mm | 未说明 | MC9S08AC16 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | S912XHY256F0VLLR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 76 | 12288 | 262144 | Automotive grade | 表面贴装 | 100-LQFP | YES | A/D 8x10b | -40°C~105°C TA | Tape & Reel (TR) | 2008 | HCS12X | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S-PQFP-G100 | 不合格 | 5.5V | 1.83.3/5V | 4.5V | External | 40MHz | 12K x 8 | 4.5V~5.5V | MICROCONTROLLER | LCD, Motor control PWM, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 8K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant |