制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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![]() | MC9S08GT32ACFDER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 39 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | S08 | 不用于新设计 | 3 (168 Hours) | 48 | EAR99 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08GT32 | 3.6V | 2.08V | Internal | 40MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | YES | YES | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | LPC1101LVUKZ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 21 | 32768 | 表面贴装 | 25-UFBGA, WLCSP | YES | A/D 6x8b | -40°C~85°C TA | Tape & Reel (TR) | 2010 | LPC1100LV | 活跃 | 1 (Unlimited) | 25 | BOTTOM | BALL | 未说明 | 1.8V | 0.4mm | 未说明 | LPC1101 | R-PBGA-B25 | 不合格 | 1.95V | 1.8V | 1.65V | Internal | 50MHz | 2K x 8 | 1.65V~1.95V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | NO | CORTEX-M0 | 0.615mm | 2.32mm | 2.17mm | ROHS3 Compliant | |||||||||||||||||
![]() | MC908SR12CFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 31 | 表面贴装 | 48-LQFP | A/D 14x10b | -40°C~85°C TA | Tray | 2004 | HC08 | Obsolete | 3 (168 Hours) | MC908SR12 | Internal | 8MHz | 512 x 8 | 2.7V~5.5V | LVD, POR, PWM, Temp Sensor | FLASH | 8-Bit | 12KB 12K x 8 | I2C, SCI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5567MVR132 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 238 | 2097152 | Automotive grade | 表面贴装 | 416-BBGA | YES | A/D 40x12b | -40°C~125°C TA | Tray | 2003 | MPC55xx Qorivva | 活跃 | 3 (168 Hours) | 416 | 8542.31.00.01 | BOTTOM | BALL | 1.5V | 1mm | SPC5567 | S-PBGA-B416 | 不合格 | 1.65V | 1.53.35V | 1.35V | External | 132MHz | 80K x 8 | 1.35V~1.65V | MICROCONTROLLER | e200z6 | DMA, POR, PWM, WDT | 132MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, Ethernet, SCI, SPI | 600mA | 32 | NO | NO | YES | AEC-Q100 | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||
![]() | LPC11E36FBD64/501E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 54 | 98304 | 表面贴装 | 64-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2010 | LPC11E3x | 活跃 | 2 (1 Year) | 64 | QUAD | 鸥翼 | 3.3V | 0.5mm | LPC11E36 | 64 | S-PQFP-G64 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 12K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 96KB 96K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART | 32 | YES | NO | NO | 4K x 8 | CORTEX-M0 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||
![]() | MCF54452VR266R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 360-BBGA | 132 | 0°C~70°C TA | Tape & Reel (TR) | 2006 | MCF5445x | 活跃 | 3 (168 Hours) | Internal | 266MHz | 32K x 8 | 1.35V~3.6V | Coldfire V4 | DMA, WDT | ROMless | 32-Bit | I2C, SPI, SSI, UART/USART, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | LPC1112LVFHI33/103 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 27 | 16384 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 6x8b | -40°C~85°C TA | Tray | 2010 | LPC1100LV | 活跃 | 3 (168 Hours) | 32 | EAR99 | 8542.31.00.01 | QUAD | 无铅 | 未说明 | 1.8V | 0.5mm | 未说明 | LPC1112 | 32 | S-PQCC-N32 | 不合格 | 1.95V | 1.8V | 1.65V | Internal | 50MHz | 4K x 8 | 1.65V~1.95V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||
![]() | S9S12G128AVLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 表面贴装 | 48-LQFP | A/D 12x10b | -40°C~105°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVC12F0VKHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 42 | 表面贴装 | 64-LQFP Exposed Pad | A/D 16x10b; D/A 1x8b | -40°C~105°C TA | Tape & Reel (TR) | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | LPC2138FHN64/01,55 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 47 | 524288 | 表面贴装 | 64-VFQFN Exposed Pad | YES | A/D 16x10b; D/A 1x10b | -40°C~85°C TA | Tray | 2007 | LPC2100 | e3 | Obsolete | 3 (168 Hours) | 64 | TIN | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 30 | LPC2138 | 64 | S-PQCC-N64 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, POR, PWM, WDT | 60MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | 32 | YES | NO | YES | YES | 8 | 8 | 1mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||
![]() | SPC5644CF0VLU8 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 147 | 表面贴装 | 176-LQFP | A/D 27x10b, 5x12b | -40°C~105°C TA | Tray | 2004 | MPC56xx Qorivva | yes | 活跃 | 3 (168 Hours) | SPC5644 | Internal | 80MHz/120MHz | 192K x 8 | 3V~5.5V | MICROCONTROLLER | e200z4d, e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | SPC5604BK0CLQ6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 123 | 表面贴装 | 144-LQFP | YES | A/D 36x10b | -40°C~85°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 144 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5604 | 5.5V | 4.5V | Internal | 64MHz | 32K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | S9S12GA128F0MLFR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 40 | 8192 | 131072 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 12x12b | -40°C~125°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S-PQFP-G48 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||
![]() | S9S12XS256J0CALR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 12288 | 262144 | Automotive grade | 表面贴装 | 112-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tape & Reel (TR) | 2012 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G112 | 不合格 | 1.98V | 1.83.3/5V | 1.72V | External | 40MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, SCI, SPI | 35mA | 16 | YES | YES | YES | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
![]() | SPC5602BK0VLL6 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 79 | 表面贴装 | 100-LQFP | YES | A/D 28x10b | -40°C~105°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5602 | 5.5V | 4.5V | Internal | 64MHz | 24K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | MC68HC908JL3CDW | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 23 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | A/D 12x8b | -40°C~85°C TA | Tube | HC08 | Obsolete | 1 (Unlimited) | 8542.31.00.01 | MC68HC908 | External | 8MHz | 128 x 8 | 2.7V~3.3V | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF5270AB100 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 160-BQFP | 160-QFP (28x28) | 39 | 0°C~70°C TA | Tray | 2006 | MCF527x | Obsolete | 3 (168 Hours) | MCF5270 | External | 100MHz | 64K x 8 | 1.4V~1.6V | Coldfire V2 | DMA, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | FS32R274VCK2MMM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 257-LFBGA | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | -40°C~125°C TA | Tray | S32R | 活跃 | 3 (168 Hours) | 8542.31.00.01 | Internal | 180MHz, 240MHz | 1.5M x 8 | 1.19V~5.5V | e200z4, e200z7 (2) | POR, PWM, WDT | FLASH | 32-Bit Tri-Core | 2MB 2M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5777CCK3MMO3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 524288 | 8388608 | 表面贴装 | 516-BGA | YES | A/D 16b Sigma-Delta, eQADC | -40°C~125°C TA | Tray | 2012 | MPC57xx | 活跃 | 3 (168 Hours) | 516 | 5A992 | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1mm | 未说明 | S-PBGA-B516 | 1.32V | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | 32 | YES | YES | YES | NO | 8 | 2.02mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||
![]() | S9S12P128J0VFTR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 34 | 131072 | Automotive grade | 表面贴装 | 48-TFQFN Exposed Pad | YES | A/D 10x12b | -40°C~105°C TA | Tape & Reel (TR) | 2004 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 5V | 0.5mm | 40 | S9S12P128 | S-XQCC-N48 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.05mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||
![]() | MKL25Z32VLK4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 66 | 32768 | 表面贴装 | 80-LQFP | YES | A/D 14x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MKL25Z32 | S-PQFP-G80 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||
![]() | SP5745BFK1AVKU2R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | A/D 36x10b, 16x12b | 表面贴装 | 176-LQFP Exposed Pad | YES | 129 | -40°C~105°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 120MHz | 256K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, I2S, POR, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | 32 | YES | YES | NO | 64K x 8 | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | SP5746CBK1AMKU6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | MKL04Z32VLC4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 表面贴装 | 32-LQFP | YES | A/D 14x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL0 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | S-PQFP-G32 | 3.6V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||
![]() | MC9S08PA60AVLD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 37 | 表面贴装 | 44-LQFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2014 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | S-PQFP-G44 | 5.5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | 256 x 8 | 10mm | 10mm | ROHS3 Compliant |