制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S912ZVC12F0MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 28 | 表面贴装 | 48-LQFP | A/D 10x10b; D/A 1x8b | -40°C~125°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 8K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MC9S08LG32CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 53 | 表面贴装 | 64-LQFP | YES | A/D 12x12b | -40°C~85°C TA | Tray | 2007 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC9S08LG32 | S-PQFP-G64 | 不合格 | 5.5V | 2.7V | Internal | 40MHz | 1.9K x 8 | 2.7V~5.5V | MICROCONTROLLER | LCD, LVD, PWM | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||
| MC9S08PT32AVLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 4096 | 32768 | 表面贴装 | 64-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2011 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 0.5mm | 40 | S-PQFP-G64 | 不合格 | 3/5V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MC9S12XET256MAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 262144 | 表面贴装 | 112-LQFP | YES | A/D 12x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XET256 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 16K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
 | MCHC908QY4CDWE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 13 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 4x8b | -40°C~85°C TA | Tube | 2005 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.A.2 | Tin (Sn) | OPERATES AT 3V NOMINAL SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MCHC908QY4 | R-PDSO-G16 | 5.5V | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||
 | MKL04Z32VLC4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 32768 | 表面贴装 | 32-LQFP | YES | A/D 14x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL0 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 12-BIT ADC AVAILABLE | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.8mm | 40 | MKL04Z32 | S-PQFP-G32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M0 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||
 | MKL16Z32VFT4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2005 | Kinetis KL1 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | DIFFERENTIAL ANALOG CHANNEL INPUTS: 6-CH 16-BIT | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL16Z32 | S-XQCC-N48 | 3.6V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, TSI, UART/USART | 32 | YES | YES | YES | YES | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||
| MK20DX128VLF5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 29 | 131072 | 表面贴装 | 48-LQFP | YES | A/D 11x16b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | S-PQFP-G48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||
| MC9S12C128MFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 31 | 表面贴装 | 48-LQFP | YES | A/D 8x10b | -40°C~125°C TA | Tray | 1996 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC9S12C128 | S-PQFP-G48 | 不合格 | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | CPU12 | 16 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||
 | MC9S08AW32CFGER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 34 | 32768 | 表面贴装 | 44-LQFP | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08AW32 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||
 | MC56F8357VPYE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 76 | 262144 | 表面贴装 | 160-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 160 | 3A991.A.2 | Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8357 | S-PQFP-G160 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 10K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | 16 | 24 | YES | YES | 16 | 固定点 | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | |||||||||||
| MKV10Z16VLC7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 28 | 8192 | 16384 | 表面贴装 | 32-LQFP | YES | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 0.8mm | 40 | S-PQFP-G32 | 不合格 | 1.8/3.3V | Internal | 75MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | CORTEX-M0 | ROHS3 Compliant | |||||||||||||||||||||||||
 | MC9S08PA4AVTGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 14 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 8x12b | -40°C~105°C TA | Tape & Reel (TR) | 2013 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| S9S12ZVL32F0MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 34 | 1024 | 32768 | Automotive grade | 表面贴装 | 48-LQFP | YES | A/D 10x10b | -40°C~125°C TA | Tray | 2011 | S12 MagniV | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 0.5mm | S-PQFP-G48 | 不合格 | 5.5/18V | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 26mA | 16 | 128 x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | |||||||||||||||||||||||||||
| MC9S08LL16CLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 38 | 表面贴装 | 64-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08LL16 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | LCD, LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
 | MK20DN512VMC10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 66 | 524288 | 表面贴装 | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK20DN512 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.52mm | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||
 | MK10DN512ZVMD10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 104 | 表面贴装 | 144-LBGA | YES | A/D 46x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK10DN512 | S-PBGA-B144 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||
| MK22FX512VMC12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 26 Weeks | 64 | 524288 | 表面贴装 | 121-LFBGA | YES | A/D 38x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e1 | 不用于新设计 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.8V | 0.65mm | 40 | MK22FX512 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M4F | 8mm | 8mm | ROHS3 Compliant | ||||||||||||||||
 | MK40DN512VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 98 | 524288 | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K40 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK40DN512 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||
| MKV11Z128VLF7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 40 | 表面贴装 | 48-LQFP | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 未说明 | S-PQFP-G48 | 3.6V | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, I2C, SPI, UART/USART | YES | YES | NO | YES | ROHS3 Compliant | ||||||||||||||||||||||||||
| MC9S08QE32CLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 26 | 32768 | 表面贴装 | 32-LQFP | YES | A/D 10x12b | -40°C~85°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 2.4V TO 2.1V SUPPLY AT 40 MHZ, 2.1V TO 1.8V SUPPLY AT 20 MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08QE32 | S-PQFP-G32 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 2K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||
 | MC68332ACEH20 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 132-BQFP Bumpered | YES | 15 | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 132 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 245 | 5V | 0.635mm | 30 | MC68332 | S-PQFP-G132 | 不合格 | Internal | 20MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 20MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 4.572mm | 24.13mm | 24.13mm | ROHS3 Compliant | |||||||||||||||||||
| S9S12G48F0MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 54 | 49152 | Automotive grade | 表面贴装 | 64-LQFP | YES | A/D 12x10b | -40°C~125°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G48 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 1.5K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||
| MC56F8356VFVE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 62 | 表面贴装 | 144-LQFP | A/D 16x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | 活跃 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | MC56F8356 | External | 60MHz | 10K x 16 | 2.25V~3.6V | 56800E | POR, PWM, Temp Sensor, WDT | FLASH | 16-Bit | 256KB 128K x 16 | CANbus, EBI/EMI, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | MC9S12XEG128MAA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 59 | 131072 | 表面贴装 | 80-QFP | YES | A/D 12x12b | -40°C~125°C TA | Tray | 2005 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XEG128 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | NO | YES | NO | 2K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant |