制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 只读存储器可编程性 | 片上数据 RAM 宽度 | 源Url状态检查日期 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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 | S9S12ZVLS1F0VFM | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 19 | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | A/D 6x10b | -40°C~105°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 128 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC68HC908QY2CDT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 4x8b | -40°C~85°C TA | Tube | 2010 | HC08 | e3 | Obsolete | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 2.7V MINIMUM SUPPLY @ 4MHZ | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | MC68HC908 | R-PDSO-G16 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 24MHz | FLASH | 8-Bit | 1.5KB 1.5K x 8 | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | Non-RoHS Compliant | |||||||||||||||||||||||||
 | LPC3220FET296/01,5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 51 | 0 | 表面贴装 | 296-TFBGA | YES | A/D 3x10b | -40°C~85°C TA | Tray | 2008 | LPC3200 | 不用于新设计 | 3 (168 Hours) | 296 | BOTTOM | BALL | 260 | 1.35V | 0.8mm | 未说明 | LPC32*0 | 296 | S-PBGA-B296 | 不合格 | 1.39V | 1.23.3V | 1.31V | Internal | 266MHz | 128K x 8 | 0.9V~3.6V | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, Motor Control PWM, PWM, WDT | 20MHz | ROMless | 16/32-Bit | EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | NO | FLASH | 1.2mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | S912ZVL64F0CLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 34 | 表面贴装 | 48-LQFP | A/D 10x10b | -40°C~85°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 1K x 8 | 5.5V~18V | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S12VR16F0CLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 16 | 表面贴装 | 32-LQFP | A/D 2x10b | -40°C~85°C TA | Tray | 2011 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | FS32K144HRT0VMHR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 100-LBGA | A/D 16x12b; D/A 1x8b | -40°C~105°C TA | Tape & Reel (TR) | S32K | 活跃 | 3 (168 Hours) | Internal | 80MHz | 64K x 8 | 2.7V~5.5V | ARM® Cortex®-M4F | POR, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08RN48W1MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 39 | 表面贴装 | 48-LQFP | A/D 16x12b | -40°C~125°C TA | Tray | 2012 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 48K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
.png) | MKW31Z512VHT4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 48-VFLGA | YES | -40°C~105°C TA | Tape & Reel (TR) | Kinetis KW31Z | 活跃 | 3 (168 Hours) | 48 | 5A992 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 40 | S-XQCC-N48 | 3.6V | 1.71V | 微处理器电路 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XEQ384F1MAGR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 119 | 24576 | 393216 | Automotive grade | 表面贴装 | 144-LQFP | YES | A/D 24x12b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MPC563MZP66R2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 56 | 524288 | 表面贴装 | 388-BBGA | YES | A/D 32x10b | -40°C~125°C TA | Tape & Reel (TR) | 1999 | MPC5xx | e0 | 不用于新设计 | 3 (168 Hours) | 388 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 240 | 2.6V | 1mm | 30 | MPC563 | S-PBGA-B388 | 不合格 | 2.7V | 2.65V | 2.5V | External | 66MHz | 32K x 8 | 2.5V~2.7V | MICROCONTROLLER, RISC | PowerPC | POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | NO | NO | 24 | 32 | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||
 | LPC1112FHI33/202,5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 28 | 16384 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2010 | LPC1100L | 活跃 | 3 (168 Hours) | 33 | QUAD | 无铅 | 3.3V | 0.65mm | LPC1112 | 32 | S-PQCC-N32 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 16KB 16K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | NO | CORTEX-M0 | 2013-06-14 00:00:00 | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| MC908QB8MDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 10x10b | -40°C~125°C TA | Tube | HC08 | Obsolete | 3 (168 Hours) | MC908QB8 | Internal | 8MHz | 256 x 8 | 2.7V~5.5V | LVD, POR, PWM | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12DP256BMPV | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 91 | 表面贴装 | 112-LQFP | A/D 16x10b | -40°C~125°C TA | Tray | 1998 | HCS12 | Obsolete | 3 (168 Hours) | MC9S12DP256 | Internal | 25MHz | 12K x 8 | 2.35V~5.25V | PWM, WDT | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 4K x 8 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XD256F1CAAR | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 59 | 14336 | 262144 | 表面贴装 | 80-QFP | YES | A/D 8x10b, 16x10b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | 不用于新设计 | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 2.5V | 0.635mm | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | Internal | 80MHz | 16K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | 23 | 2K x 8 | CPU12 | 16 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MC68HC11E1CFN3 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 38 | 表面贴装 | 52-LCC (J-Lead) | YES | A/D 8x8b | -40°C~85°C TA | Tube | 2003 | HC11 | Obsolete | 3 (168 Hours) | 52 | QUAD | J BEND | 5V | 1.27mm | unknown | MC68HC11 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 512 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 35mA | 8 | YES | NO | NO | NO | 16 | 512 x 8 | NO | YES | 8 | FIXED-POINT | NO | 8 | 4.57mm | 19.1262mm | 19.1262mm | Non-RoHS Compliant | |||||||||||||||||||||||
| MC9S12DB128BCPV | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 91 | 表面贴装 | 112-LQFP | 112-LQFP (20x20) | A/D 16x10b | -40°C~85°C TA | Tray | 2001 | HCS12 | Obsolete | 3 (168 Hours) | MC9S12DB128 | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | HCS12 | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| MC908GR16MFAE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 表面贴装 | 48-LQFP | A/D 8x10b | -40°C~125°C TA | Tray | HC08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | MC908GR16 | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| S912XEP100BMAL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 91 | 表面贴装 | 112-LQFP | A/D 16x12b | -40°C~125°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | External | 50MHz | 64K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5746CK1AMKU6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 Weeks | 129 | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 1.25V | 0.5mm | 40 | 1.32V | 1.2V | Internal | 80MHz/160MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | LPC1853JBD208E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 142 | 524288 | 表面贴装 | 208-LQFP | YES | A/D 8x10b; D/A 1x10b | -40°C~105°C TA | Tray | 2010 | LPC18xx | e3 | 活跃 | 3 (168 Hours) | 208 | Tin (Sn) | QUAD | 鸥翼 | 3.3V | 0.5mm | LPC1853 | 208 | S-PQFP-G208 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 180MHz | 136K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | 16K x 8 | CORTEX-M3 | 28mm | 28mm | ROHS3 Compliant | ||||||||||||||||||||||||
| LPC1774FBD208,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 165 | 131072 | 表面贴装 | 208-LQFP | YES | A/D 8x12b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC17xx | e3 | 活跃 | 2 (1 Year) | 208 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC1774 | 208 | S-PQFP-G208 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 40K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 2K x 8 | CORTEX-M3 | 32 | 1.6mm | 28mm | 28mm | ROHS3 Compliant | ||||||||||||||||
 | MK12DX256VMC5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 60 | 262144 | 表面贴装 | 121-LFBGA | YES | A/D 24x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK12DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 8mm | 8mm | Non-RoHS Compliant | ||||||||||||||||||||
 | MPC555LFAZP40 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 101 | 表面贴装 | 272-BBGA | YES | A/D 32x10b | -55°C~125°C TA | Tray | 1998 | MPC5xx | e0 | 不用于新设计 | 3 (168 Hours) | 272 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 235 | 3.3V | 1.27mm | 30 | MPC555 | S-PBGA-B272 | 不合格 | 3.6V | 3V | External | 40MHz | 26K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | PowerPC | POR, PWM, WDT | 20MHz | FLASH | 32-Bit | 448KB 448K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | 32 | YES | NO | YES | NO | 24 | 32 | 2.65mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||
 | SPC5604CAMLH6R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 45 | 表面贴装 | 64-LQFP | YES | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5604 | 5.5V | 4.5V | Internal | 64MHz | 48K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | SPC5604BK0MLL4R | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 79 | 表面贴装 | 100-LQFP | YES | A/D 28x10b | -40°C~125°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5604 | 5.5V | 4.5V | Internal | 48MHz | 32K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 14mm | 14mm | ROHS3 Compliant |