制造商是'NXP'
NXP 嵌入式 - 微控制器
(6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 只读存储器可编程性 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC9S08QG4CDTER | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 12 | 4096 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08QG4 | R-PDSO-G16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||
 | MC9S08QG4CFFE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 12 | 4096 | 表面贴装 | 16-VQFN Exposed Pad | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2003 | S08 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.8mm | 40 | MC9S08QG4 | S-XQCC-N16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||
 | MK70FX512VMJ12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 128 | 524288 | 表面贴装 | 256-LBGA | YES | A/D 71x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K70 | e1 | 活跃 | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 1 V MINIMUM SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK70FX512 | S-PBGA-B256 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 16K x 8 | CORTEX-M4F | 1.7mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
 | MC9S08DZ96CLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 39 | 98304 | 表面贴装 | 48-LQFP | YES | A/D 16x12b | -40°C~85°C TA | Tray | 2002 | S08 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08DZ96 | S-PQFP-G48 | 不合格 | 5.5V | 3/5V | 2.7V | External | 40MHz | 6K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 38.4MHz | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 16 | 2K x 8 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||
 | MK60FN1M0VMD12 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 1048576 | 表面贴装 | 144-LBGA | YES | A/D 58x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3V | 1mm | 40 | MK60FN1M0 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4F | 1.7mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||
| S9S08SC4E0MTG | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 12 | 4096 | Automotive grade | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | -40°C~125°C TA | Bulk | 1999 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SC4 | R-PDSO-G16 | 不合格 | 5.5V | 5V | 4.5V | Internal | 40MHz | 256 x 8 | 4.5V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SCI | 8.9mA | 8 | YES | NO | YES | AEC-Q100 | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||
 | MKE04Z8VWJ4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 18 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 10x12b; D/A 2x6b | -40°C~105°C TA | Tube | 2014 | Kinetis KE04 | e3 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 40 | R-PDSO-G20 | 5.5V | 2.7V | Internal | 48MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | YES | NO | YES | NO | ROHS3 Compliant | |||||||||||||||||||||||
 | MC9S12C32CFUE16 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 60 | 32768 | 表面贴装 | 80-QFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2005 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12C32 | S-PQFP-G80 | 不合格 | 2.75V | 2.53.3/5V | 2.35V | Internal | 16MHz | 2K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | CPU12 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||
 | MC9S08QD2MSC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 4 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | -40°C~125°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 哑光锡 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08QD2 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 2KB 2K x 8 | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||
 | MCF52254CAF66 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 56 | 524288 | 表面贴装 | 100-LQFP | YES | A/D 8x12b | -40°C~85°C TA | Tray | 2004 | MCF5225x | e3 | 活跃 | 3 (168 Hours) | 100 | 5A992 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MCF52254 | S-PQFP-G100 | 不合格 | 3.6V | 3.3V | 3V | Internal | 66MHz | 64K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||
 | MC9S08AW32CPUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 54 | 32768 | 表面贴装 | 64-LQFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08AW32 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||
 | MK60DN256VLQ10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 | 262144 | 表面贴装 | 144-LQFP | YES | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK60DN256 | S-PQFP-G144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||
 | MC9S08MP16VLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 25 | 16384 | 表面贴装 | 32-LQFP | YES | A/D 13x12b; D/A 3x5b | -40°C~105°C TA | Tray | 2009 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08MP16 | S-PQFP-G32 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 51.34MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | YES | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||
| MKE02Z64VLC2 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 28 | 4096 | 65536 | 表面贴装 | 32-LQFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | S-PQFP-G32 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | CORTEX-M0 | ROHS3 Compliant | |||||||||||||
| S9S08DZ60F2MLC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 25 | 表面贴装 | 32-LQFP | A/D 10x12b | -40°C~125°C TA | Tray | 1996 | S08 | yes | 活跃 | 3 (168 Hours) | 260 | 40 | S9S08DZ60 | External | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, I2C, LINbus, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
 | MC9S08PT60VLD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 37 | 61440 | 表面贴装 | 44-LQFP | YES | A/D 16x12b | -40°C~105°C TA | Tray | 2002 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08PT60 | S-PQFP-G44 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||
 | MKE02Z64VQH4 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 57 | 4096 | 65536 | 表面贴装 | 64-QFP | YES | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tray | 2002 | Kinetis KE02 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 哑光锡 | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | YES | NO | YES | NO | 256 x 8 | 8 | ROHS3 Compliant | ||||||||||||||||||
 | MKV30F64VFM10 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 26 | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | 3.6V | 1.71V | Internal | 100MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||
| MK30DX256VLL7 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 70 | 262144 | 表面贴装 | 100-LQFP | YES | A/D 38x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K30 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK30DX256 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||
 | MK20DX128VFT5 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 29 | 131072 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 11x16b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||
 | MPC5125YVN400 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 324-BBGA | YES | 64 | -40°C~125°C TJ | Tray | 2002 | MPC51xx | e2 | 活跃 | 3 (168 Hours) | 324 | 3A991.A.2 | Tin/Silver (Sn/Ag) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.4V | 1mm | 40 | MPC5125 | S-PBGA-B324 | 不合格 | 1.47V | 1.43.3V | 1.33V | External | 400MHz | 32K x 8 | 1.08V~3.6V | MICROCONTROLLER | e300 | DMA, WDT | 35MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | 32 | NO | YES | NO | NO | FLASH | 2.55mm | 23mm | 23mm | ROHS3 Compliant | ||||||||||||||||
| MC9S12DG128CFUE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 59 | 表面贴装 | 80-QFP | YES | A/D 16x10b | -40°C~85°C TA | Tray | 1996 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 2.5V | 0.65mm | 未说明 | MC9S12DG128 | S-PQFP-G80 | 不合格 | 2.75V | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | MICROCONTROLLER | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 2K x 8 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||
 | MC9S08GT8ACFBE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 36 | 8192 | 表面贴装 | 44-QFP | YES | A/D 8x10b | -40°C~85°C TA | Tray | 2000 | S08 | e3 | 活跃 | 3 (168 Hours) | 44 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.8mm | 40 | MC9S08GT8 | S-PQFP-G44 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 40MHz | 1K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 16 | YES | NO | YES | NO | 2.45mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||
 | LPC54606J512BD100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 64 | 表面贴装 | 100-LQFP | YES | A/D 12x12b | -40°C~105°C TA | Tray | 2010 | LPC546xx | 活跃 | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 3.3V | 0.5mm | 100 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 180MHz | 200K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 32 | YES | YES | YES | NO | 14 | 16K x 8 | 8 | 16 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||
 | MC9S08SH4CTJ | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 17 | 4096 | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08SH4 | R-PDSO-G20 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant |